Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
04-7422-10

04-7422-10

CONN SOCKET SIP 4POS TIN

Aries Electronics
3,531 -

RFQ

04-7422-10

Ficha técnica

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7425-10

04-7425-10

CONN SOCKET SIP 4POS TIN

Aries Electronics
3,209 -

RFQ

04-7425-10

Ficha técnica

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7430-10

04-7430-10

CONN SOCKET SIP 4POS TIN

Aries Electronics
3,452 -

RFQ

04-7430-10

Ficha técnica

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7445-10

04-7445-10

CONN SOCKET SIP 4POS TIN

Aries Electronics
3,632 -

RFQ

04-7445-10

Ficha técnica

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7482-10

04-7482-10

CONN SOCKET SIP 4POS TIN

Aries Electronics
3,805 -

RFQ

04-7482-10

Ficha técnica

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7500-10

04-7500-10

CONN SOCKET SIP 4POS TIN

Aries Electronics
2,129 -

RFQ

04-7500-10

Ficha técnica

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7533-10

04-7533-10

CONN SOCKET SIP 4POS TIN

Aries Electronics
3,229 -

RFQ

04-7533-10

Ficha técnica

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7545-10

04-7545-10

CONN SOCKET SIP 4POS TIN

Aries Electronics
3,759 -

RFQ

04-7545-10

Ficha técnica

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7550-10

04-7550-10

CONN SOCKET SIP 4POS TIN

Aries Electronics
3,108 -

RFQ

04-7550-10

Ficha técnica

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7560-10

04-7560-10

CONN SOCKET SIP 4POS TIN

Aries Electronics
2,261 -

RFQ

04-7560-10

Ficha técnica

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7700-10

04-7700-10

CONN SOCKET SIP 4POS TIN

Aries Electronics
3,982 -

RFQ

04-7700-10

Ficha técnica

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7755-10

04-7755-10

CONN SOCKET SIP 4POS TIN

Aries Electronics
3,126 -

RFQ

04-7755-10

Ficha técnica

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7800-10

04-7800-10

CONN SOCKET SIP 4POS TIN

Aries Electronics
3,684 -

RFQ

04-7800-10

Ficha técnica

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7850-10

04-7850-10

CONN SOCKET SIP 4POS TIN

Aries Electronics
3,041 -

RFQ

04-7850-10

Ficha técnica

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7950-10

04-7950-10

CONN SOCKET SIP 4POS TIN

Aries Electronics
2,153 -

RFQ

04-7950-10

Ficha técnica

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
XR2A3221N

XR2A3221N

CONN IC DIP SOCKET 32POS GOLD

Omron Electronics Inc-EMC Div
3,641 -

RFQ

XR2A3221N

Ficha técnica

Bulk XR2 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polybutylene Terephthalate (PBT), Glass Filled
ICA-324-SGT

ICA-324-SGT

.100 SCREW MACHINE DIP SOCKET

Samtec Inc.
3,746 -

RFQ

Tube ICA Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
116-83-624-41-013101

116-83-624-41-013101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,809 -

RFQ

116-83-624-41-013101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-324-41-013101

116-83-324-41-013101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,805 -

RFQ

116-83-324-41-013101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-424-41-013101

116-83-424-41-013101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,599 -

RFQ

116-83-424-41-013101

Ficha técnica

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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1500+
1500+ Promedio diario de RFQ
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1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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