+86 075582561136
Subir BOM
Zócalos para circuitos integrados, transistores
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
217-83-764-41-005101DIL SOLDER TAIL 1.778MM Preci-Dip |
3,716 | - |
RFQ |
- | 217 | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
117-83-668-41-005101CONN IC DIP SOCKET 68POS GOLD Preci-Dip |
2,350 | - |
RFQ |
Ficha técnica |
Bulk | 117 | Active | DIP, 0.6 (15.24mm) Row Spacing | 68 (2 x 34) | 0.070 (1.78mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.070 (1.78mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
HLS-0104-G-3.100 SCREW MACHINE SOCKET ARRAY Samtec Inc. |
2,604 | - |
RFQ |
Tube | HLS | Active | SIP | 4 (1 x 4) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | - | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | - | Thermoplastic | |
|
714-43-214-31-018000CONN IC DIP SOCKET 14POS GOLD Mill-Max Manufacturing Corp. |
3,969 | - |
RFQ |
Ficha técnica |
Bulk | 714 | Active | DIP, 0.1 (2.54mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
116-83-640-41-012101CONN IC DIP SOCKET 40POS GOLD Preci-Dip |
2,033 | - |
RFQ |
Ficha técnica |
Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
36-1518-10TCONN IC DIP SOCKET 36POS GOLD Aries Electronics |
2,256 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | DIP, 0.2 (5.08mm) Row Spacing | 36 (2 x 18) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
39-0518-10CONN SOCKET SIP 39POS GOLD Aries Electronics |
3,184 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | SIP | 39 (1 x 39) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
510-83-089-12-051101CONN SOCKET PGA 89POS GOLD Preci-Dip |
3,150 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 89 (12 x 12) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-83-089-13-082101CONN SOCKET PGA 89POS GOLD Preci-Dip |
2,197 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 89 (13 x 13) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-83-084-12-051101CONN SOCKET PGA 84POS GOLD Preci-Dip |
3,537 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 84 (12 x 12) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-83-084-13-081101CONN SOCKET PGA 84POS GOLD Preci-Dip |
3,095 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 84 (13 x 13) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-83-084-13-082101CONN SOCKET PGA 84POS GOLD Preci-Dip |
2,864 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 84 (13 x 13) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-83-652-41-006101CONN IC DIP SOCKET 52POS GOLD Preci-Dip |
3,036 | - |
RFQ |
Ficha técnica |
Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 52 (2 x 26) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
110-83-964-41-005101CONN IC DIP SOCKET 64POS GOLD Preci-Dip |
2,586 | - |
RFQ |
Ficha técnica |
Bulk | 110 | Active | DIP, 0.9 (22.86mm) Row Spacing | 64 (2 x 32) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
299-87-324-10-001101CONN IC DIP SOCKET 24POS GOLD Preci-Dip |
3,822 | - |
RFQ |
Ficha técnica |
Bulk | 299 | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
110-83-064-01-505101CONN IC DIP SOCKET 64POS GOLD Preci-Dip |
3,351 | - |
RFQ |
Ficha técnica |
Bulk | 110 | Active | DIP, 0.6 (15.24mm) Row Spacing | 64 (2 x 32) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
19-0518-00CONN SOCKET SIP 19POS GOLD Aries Electronics |
3,289 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | SIP | 19 (1 x 19) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
33-0518-10HCONN SOCKET SIP 33POS GOLD Aries Electronics |
2,395 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | SIP | 33 (1 x 33) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
36-0518-10TCONN SOCKET SIP 36POS GOLD Aries Electronics |
2,105 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | SIP | 36 (1 x 36) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
614-83-648-31-012101CONN IC DIP SOCKET 48POS GOLD Preci-Dip |
3,342 | - |
RFQ |
Ficha técnica |
Bulk | 614 | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
- 1500+ Promedio diario de RFQ
- 20,000.000 Unidad estándar de producto
- 1800+ Fabricantes en todo el mundo
- 15,000+ Almacén en inventario
