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Zócalos para circuitos integrados, transistores
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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510-87-120-13-061101CONN SOCKET PGA 120POS GOLD Preci-Dip |
2,242 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 120 (13 x 13) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
20-3511-10CONN IC DIP SOCKET 20POS TIN Aries Electronics |
3,422 | - |
RFQ |
Ficha técnica |
Bulk | 511 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
23-0513-10CONN SOCKET SIP 23POS GOLD Aries Electronics |
2,383 | - |
RFQ |
Ficha técnica |
Bulk | 0513 | Active | SIP | 23 (1 x 23) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
16-1518-00CONN IC DIP SOCKET 16POS GOLD Aries Electronics |
3,649 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | DIP, 0.2 (5.08mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
30-0518-10TCONN SOCKET SIP 30POS GOLD Aries Electronics |
3,095 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | SIP | 30 (1 x 30) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
33-0518-10CONN SOCKET SIP 33POS GOLD Aries Electronics |
2,528 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | SIP | 33 (1 x 33) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
08-0508-20CONN SOCKET SIP 8POS GOLD Aries Electronics |
3,357 | - |
RFQ |
Ficha técnica |
Bulk | 508 | Active | SIP | 8 (1 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
08-0508-30CONN SOCKET SIP 8POS GOLD Aries Electronics |
3,199 | - |
RFQ |
Ficha técnica |
Bulk | 508 | Active | SIP | 8 (1 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
08-1508-20CONN IC DIP SOCKET 8POS GOLD Aries Electronics |
3,925 | - |
RFQ |
Ficha técnica |
Bulk | 508 | Active | DIP, 0.2 (5.08mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
08-1508-30CONN IC DIP SOCKET 8POS GOLD Aries Electronics |
2,028 | - |
RFQ |
Ficha técnica |
Bulk | 508 | Active | DIP, 0.2 (5.08mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
14-C280-10TCONN IC DIP SOCKET 14POS TIN Aries Electronics |
2,366 | - |
RFQ |
Ficha técnica |
Bulk | EJECT-A-DIP™ | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
116-83-424-41-011101CONN IC DIP SOCKET 24POS GOLD Preci-Dip |
3,743 | - |
RFQ |
Ficha técnica |
Bulk | 116 | Active | DIP, 0.4 (10.16mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-83-624-41-011101CONN IC DIP SOCKET 24POS GOLD Preci-Dip |
3,620 | - |
RFQ |
Ficha técnica |
Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
614-87-652-31-012101CONN IC DIP SOCKET 52POS GOLD Preci-Dip |
2,872 | - |
RFQ |
Ficha técnica |
Bulk | 614 | Active | DIP, 0.6 (15.24mm) Row Spacing | 52 (2 x 26) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
614-87-952-31-012101CONN IC DIP SOCKET 52POS GOLD Preci-Dip |
3,497 | - |
RFQ |
Ficha técnica |
Bulk | 614 | Active | DIP, 0.9 (22.86mm) Row Spacing | 52 (2 x 26) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-83-632-41-007101CONN IC DIP SOCKET 32POS GOLD Preci-Dip |
2,870 | - |
RFQ |
Ficha técnica |
Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-83-432-41-007101CONN IC DIP SOCKET 32POS GOLD Preci-Dip |
3,859 | - |
RFQ |
Ficha técnica |
Bulk | 116 | Active | DIP, 0.4 (10.16mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
117-87-652-41-105101CONN IC DIP SOCKET 52POS GOLD Preci-Dip |
2,686 | - |
RFQ |
Ficha técnica |
Bulk | 117 | Active | DIP, 0.6 (15.24mm) Row Spacing | 52 (2 x 26) | 0.070 (1.78mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.070 (1.78mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
14-C195-10TCONN IC DIP SOCKET 14POS TIN Aries Electronics |
3,852 | - |
RFQ |
Ficha técnica |
Bulk | EJECT-A-DIP™ | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
110-83-628-41-105191CONN IC DIP SOCKET 28POS GOLD Preci-Dip |
3,201 | - |
RFQ |
Bulk | 110 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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