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Zócalos para circuitos integrados, transistores

Número de parte del fabricante	Disponibilidad	Precio	Cantidad	Ficha técnica	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
AR 28-HZL/01/7-TT CONN IC DIP SOCKET 28POS GOLD Assmann WSW Components	10,783	-	RFQ	Ficha técnica	Tube	-	Active	DIP, 0.3 (7.62mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester
54020-44030LF CONN SOCKET PLCC 44POS TIN Amphenol ICC (FCI)	2,767	-	RFQ	Ficha técnica	Tube	-	Active	PLCC	44 (4 x 11)	0.050 (1.27mm)	Tin	100.0µin (2.54µm)	Copper Alloy	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	100.0µin (2.54µm)	Copper Alloy	Polyphenylene Sulfide (PPS)
8468-11B1-RK-TP CONN SOCKET PLCC 68POS TIN 3M	2,572	-	RFQ	Ficha técnica	Tube	8400	Active	PLCC	68 (4 x 17)	0.050 (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Through Hole	Closed Frame	Solder	0.050 (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Polybutylene Terephthalate (PBT), Glass Filled
110-44-648-41-001000 CONN IC DIP SOCKET 48POS TIN Mill-Max Manufacturing Corp.	275	-	RFQ	Ficha técnica	Tube	110	Active	DIP, 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Tin	100.0µin (2.54µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-328-41-001000 CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp.	180	-	RFQ	Ficha técnica	Tube	110	Active	DIP, 0.3 (7.62mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
ICO-308-SGT CONN IC DIP SOCKET 8POS GOLD Samtec Inc.	2,865	-	RFQ	Ficha técnica	Tube	ICO	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polyester, Glass Filled
210-43-628-41-001000 CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp.	382	-	RFQ	Ficha técnica	Tube	210	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
AR 16-HZW/TN CONN IC DIP SOCKET 16POS GOLD Assmann WSW Components	108	-	RFQ	Ficha técnica	Tube	-	Active	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester
115-93-624-41-003000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	158	-	RFQ	Ficha técnica	Tube	115	Active	DIP, 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-87-632-41-001101 CONN IC DIP SOCKET 32POS GOLD Preci-Dip	4,744	-	RFQ	Ficha técnica	Tube	110	Active	DIP, 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-13-320-41-001000 CONN IC DIP SOCKET 20POS GOLD Mill-Max Manufacturing Corp.	118	-	RFQ	Ficha técnica	Tube	110	Active	DIP, 0.3 (7.62mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
940-44-068-17-400000 CONN SOCKET PLCC 68POS TIN Mill-Max Manufacturing Corp.	1,503	-	RFQ	Ficha técnica	Tube	940	Active	PLCC	68 (4 x 17)	0.050 (1.27mm)	Tin	150.0µin (3.81µm)	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.050 (1.27mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-632-41-001000 CONN IC DIP SOCKET 32POS GOLD Mill-Max Manufacturing Corp.	504	-	RFQ	Ficha técnica	Tube	110	Active	DIP, 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
8484-11B1-RK-TP CONN SOCKET PLCC 84POS TIN 3M	2,289	-	RFQ	Ficha técnica	Tube	8400	Active	PLCC	84 (4 x 21)	0.050 (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Polybutylene Terephthalate (PBT), Glass Filled
214-44-632-01-670800 CONN IC DIP SOCKET 32POS TIN Mill-Max Manufacturing Corp.	581	-	RFQ	Ficha técnica	Tube	214	Active	DIP, 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Tin	100.0µin (2.54µm)	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-43-624-41-001000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	126	-	RFQ	Ficha técnica	Tube	111	Active	DIP, 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-41-640-41-001000 CONN IC DIP SOCKET 40POS GOLD Mill-Max Manufacturing Corp.	1,100	-	RFQ	Ficha técnica	Tube	110	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-87-640-41-001101 CONN IC DIP SOCKET 40POS GOLD Preci-Dip	4,902	-	RFQ	Ficha técnica	Tube	110	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
A-CCS 068-G-T CONN SOCKET PLCC 68POS GOLD Assmann WSW Components	867	-	RFQ	Ficha técnica	Tube	-	Active	PLCC	68 (4 x 17)	0.050 (1.27mm)	Gold	-	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	-	Phosphor Bronze	Polybutylene Terephthalate (PBT)
A-CCS 044-G-T CONN SOCKET PLCC 44POS GOLD Assmann WSW Components	5,659	-	RFQ	Ficha técnica	Tube	-	Active	PLCC	44 (4 x 11)	0.050 (1.27mm)	Gold	-	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	-	Phosphor Bronze	Polybutylene Terephthalate (PBT)