Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-83-636-41-001101

116-83-636-41-001101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip
2,346 -

RFQ

116-83-636-41-001101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-324-41-013101

116-87-324-41-013101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,772 -

RFQ

116-87-324-41-013101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-424-41-013101

116-87-424-41-013101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,824 -

RFQ

116-87-424-41-013101

Ficha técnica

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-624-41-013101

116-87-624-41-013101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,802 -

RFQ

116-87-624-41-013101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-618-10-002101

299-83-618-10-002101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
2,994 -

RFQ

299-83-618-10-002101

Ficha técnica

Bulk 299 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-322-41-013101

116-83-322-41-013101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
3,449 -

RFQ

116-83-322-41-013101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-422-41-013101

116-83-422-41-013101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
2,263 -

RFQ

116-83-422-41-013101

Ficha técnica

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-640-41-009101

116-83-640-41-009101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
2,538 -

RFQ

116-83-640-41-009101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-324-10-001101

299-83-324-10-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,794 -

RFQ

299-83-324-10-001101

Ficha técnica

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-100-15-101101

510-83-100-15-101101

CONN SOCKET PGA 100POS GOLD

Preci-Dip
3,235 -

RFQ

510-83-100-15-101101

Ficha técnica

Bulk 510 Active PGA 100 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-642-41-008101

116-83-642-41-008101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
3,406 -

RFQ

116-83-642-41-008101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-169-17-101101

510-87-169-17-101101

CONN SOCKET PGA 169POS GOLD

Preci-Dip
3,326 -

RFQ

510-87-169-17-101101

Ficha técnica

Bulk 510 Active PGA 169 (17 x 17) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-642-41-011101

116-87-642-41-011101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
2,410 -

RFQ

116-87-642-41-011101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-180-14-031101

510-87-180-14-031101

CONN SOCKET PGA 180POS GOLD

Preci-Dip
2,074 -

RFQ

510-87-180-14-031101

Ficha técnica

Bulk 510 Active PGA 180 (14 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-100-15-001101

510-83-100-15-001101

CONN SOCKET PGA 100POS GOLD

Preci-Dip
3,140 -

RFQ

510-83-100-15-001101

Ficha técnica

Bulk 510 Active PGA 100 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-107-12-051101

510-83-107-12-051101

CONN SOCKET PGA 107POS GOLD

Preci-Dip
3,375 -

RFQ

510-83-107-12-051101

Ficha técnica

Bulk 510 Active PGA 107 (12 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-181-14-031101

510-87-181-14-031101

CONN SOCKET PGA 181POS GOLD

Preci-Dip
3,725 -

RFQ

510-87-181-14-031101

Ficha técnica

Bulk 510 Active PGA 181 (14 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-101-15-101101

510-83-101-15-101101

CONN SOCKET PGA 101POS GOLD

Preci-Dip
2,863 -

RFQ

510-83-101-15-101101

Ficha técnica

Bulk 510 Active PGA 101 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-87-650-41-001101

122-87-650-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
2,193 -

RFQ

122-87-650-41-001101

Ficha técnica

Bulk 122 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-87-650-41-001101

123-87-650-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
2,437 -

RFQ

123-87-650-41-001101

Ficha técnica

Bulk 123 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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1500+
1500+ Promedio diario de RFQ
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20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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