Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
123-83-428-41-001101

123-83-428-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,550 -

RFQ

123-83-428-41-001101

Ficha técnica

Bulk 123 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-636-41-105101

110-83-636-41-105101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip
2,009 -

RFQ

110-83-636-41-105101

Ficha técnica

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-100-10-000101

510-87-100-10-000101

CONN SOCKET PGA 100POS GOLD

Preci-Dip
2,773 -

RFQ

510-87-100-10-000101

Ficha técnica

Bulk 510 Active PGA 100 (10 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-100-11-001101

510-87-100-11-001101

CONN SOCKET PGA 100POS GOLD

Preci-Dip
3,836 -

RFQ

510-87-100-11-001101

Ficha técnica

Bulk 510 Active PGA 100 (11 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-420-41-011101

116-83-420-41-011101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
2,809 -

RFQ

116-83-420-41-011101

Ficha técnica

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-952-41-005101

110-87-952-41-005101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip
3,456 -

RFQ

110-87-952-41-005101

Ficha técnica

Bulk 110 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-632-31-012101

614-83-632-31-012101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
3,898 -

RFQ

614-83-632-31-012101

Ficha técnica

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-324-41-009101

116-83-324-41-009101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,957 -

RFQ

116-83-324-41-009101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-064-08-000101

510-83-064-08-000101

CONN SOCKET PGA 64POS GOLD

Preci-Dip
3,105 -

RFQ

510-83-064-08-000101

Ficha técnica

Bulk 510 Active PGA 64 (8 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-101-11-001101

510-87-101-11-001101

CONN SOCKET PGA 101POS GOLD

Preci-Dip
3,540 -

RFQ

510-87-101-11-001101

Ficha técnica

Bulk 510 Active PGA 101 (11 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-642-41-001101

115-83-642-41-001101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
3,310 -

RFQ

Bulk 115 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-628-41-009101

116-87-628-41-009101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,391 -

RFQ

116-87-628-41-009101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-628-41-801101

110-83-628-41-801101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,025 -

RFQ

110-83-628-41-801101

Ficha técnica

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-320-41-004101

116-87-320-41-004101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
2,953 -

RFQ

116-87-320-41-004101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-420-41-004101

116-87-420-41-004101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
3,688 -

RFQ

116-87-420-41-004101

Ficha técnica

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-432-41-007101

116-87-432-41-007101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
3,584 -

RFQ

116-87-432-41-007101

Ficha técnica

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-328-41-035101

146-83-328-41-035101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,854 -

RFQ

146-83-328-41-035101

Ficha técnica

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-328-41-036101

146-83-328-41-036101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,518 -

RFQ

146-83-328-41-036101

Ficha técnica

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-632-41-035101

146-87-632-41-035101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
3,029 -

RFQ

146-87-632-41-035101

Ficha técnica

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-632-41-036101

146-87-632-41-036101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
2,590 -

RFQ

146-87-632-41-036101

Ficha técnica

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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