Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-87-424-41-012101

116-87-424-41-012101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,741 -

RFQ

116-87-424-41-012101

Ficha técnica

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-624-41-012101

116-87-624-41-012101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,041 -

RFQ

116-87-624-41-012101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-322-41-008101

116-87-322-41-008101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
2,984 -

RFQ

116-87-322-41-008101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-87-632-41-001101

612-87-632-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
3,796 -

RFQ

612-87-632-41-001101

Ficha técnica

Bulk 612 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-432-41-005101

110-83-432-41-005101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
2,028 -

RFQ

110-83-432-41-005101

Ficha técnica

Bulk 110 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-314-41-004101

116-87-314-41-004101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
2,754 -

RFQ

116-87-314-41-004101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-210-10-001101

299-83-210-10-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,684 -

RFQ

299-83-210-10-001101

Ficha técnica

Bulk 299 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-065-10-051101

510-87-065-10-051101

CONN SOCKET PGA 65POS GOLD

Preci-Dip
2,158 -

RFQ

510-87-065-10-051101

Ficha técnica

Bulk 510 Active PGA 65 (10 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-065-10-052101

510-87-065-10-052101

CONN SOCKET PGA 65POS GOLD

Preci-Dip
3,736 -

RFQ

510-87-065-10-052101

Ficha técnica

Bulk 510 Active PGA 65 (10 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-318-41-035101

146-83-318-41-035101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
3,482 -

RFQ

146-83-318-41-035101

Ficha técnica

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-318-41-036101

146-83-318-41-036101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
2,345 -

RFQ

146-83-318-41-036101

Ficha técnica

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-314-41-011101

116-83-314-41-011101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
3,369 -

RFQ

116-83-314-41-011101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-310-11-001101

299-83-310-11-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,004 -

RFQ

299-83-310-11-001101

Ficha técnica

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-642-41-117101

114-87-642-41-117101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
2,911 -

RFQ

114-87-642-41-117101

Ficha técnica

Bulk 114 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-642-41-134161

114-87-642-41-134161

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
3,544 -

RFQ

114-87-642-41-134161

Ficha técnica

Bulk 114 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-648-41-005101

110-87-648-41-005101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
2,988 -

RFQ

110-87-648-41-005101

Ficha técnica

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-432-41-001101

115-83-432-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
2,306 -

RFQ

Bulk 115 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-324-41-018101

116-83-324-41-018101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,568 -

RFQ

116-83-324-41-018101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-628-41-003101

116-87-628-41-003101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,920 -

RFQ

116-87-628-41-003101

Ficha técnica

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-428-41-003101

116-87-428-41-003101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,896 -

RFQ

116-87-428-41-003101

Ficha técnica

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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