Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-87-640-41-005101

110-87-640-41-005101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
2,783 -

RFQ

110-87-640-41-005101

Ficha técnica

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-210-10-001101

299-87-210-10-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,484 -

RFQ

299-87-210-10-001101

Ficha técnica

Bulk 299 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-628-41-105161

110-87-628-41-105161

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,071 -

RFQ

110-87-628-41-105161

Ficha técnica

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-328-41-105161

110-87-328-41-105161

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,905 -

RFQ

110-87-328-41-105161

Ficha técnica

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-328-41-006101

116-87-328-41-006101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,313 -

RFQ

116-87-328-41-006101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-628-41-006101

116-87-628-41-006101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,848 -

RFQ

116-87-628-41-006101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-320-41-018101

116-83-320-41-018101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
3,301 -

RFQ

116-83-320-41-018101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-83-316-41-001101

122-83-316-41-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
3,961 -

RFQ

122-83-316-41-001101

Ficha técnica

Bulk 122 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-83-316-41-001101

123-83-316-41-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
3,900 -

RFQ

123-83-316-41-001101

Ficha técnica

Bulk 123 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-322-41-105101

110-83-322-41-105101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
3,620 -

RFQ

110-83-322-41-105101

Ficha técnica

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-87-624-41-105101

117-87-624-41-105101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,043 -

RFQ

117-87-624-41-105101

Ficha técnica

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-310-11-001101

299-87-310-11-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,573 -

RFQ

299-87-310-11-001101

Ficha técnica

Tube 299 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-318-41-009101

116-87-318-41-009101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
3,737 -

RFQ

116-87-318-41-009101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-320-41-035101

146-87-320-41-035101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
2,965 -

RFQ

146-87-320-41-035101

Ficha técnica

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-320-41-036101

146-87-320-41-036101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
3,613 -

RFQ

146-87-320-41-036101

Ficha técnica

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-316-41-801101

110-83-316-41-801101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
3,171 -

RFQ

110-83-316-41-801101

Ficha técnica

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-328-41-001101

115-83-328-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,016 -

RFQ

Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-83-428-41-005101

117-83-428-41-005101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,569 -

RFQ

117-83-428-41-005101

Ficha técnica

Bulk 117 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.070 (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-83-628-41-005101

117-83-628-41-005101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,793 -

RFQ

117-83-628-41-005101

Ficha técnica

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.070 (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-83-322-41-001101

612-83-322-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
3,262 -

RFQ

612-83-322-41-001101

Ficha técnica

Bulk 612 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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