Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
410-83-214-10-001101

410-83-214-10-001101

CONN ZIG-ZAG 14POS GOLD

Preci-Dip
3,688 -

RFQ

410-83-214-10-001101

Ficha técnica

Bulk 410 Active Zig-Zag 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
410-83-214-10-002101

410-83-214-10-002101

CONN ZIG-ZAG 14POS GOLD

Preci-Dip
2,165 -

RFQ

410-83-214-10-002101

Ficha técnica

Bulk 410 Active Zig-Zag 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-314-41-105191

110-87-314-41-105191

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
3,758 -

RFQ

Tape & Reel (TR),Cut Tape (CT) 110 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-316-31-012101

614-87-316-31-012101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
2,203 -

RFQ

614-87-316-31-012101

Ficha técnica

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-310-41-105191

110-83-310-41-105191

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,128 -

RFQ

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
540-88-044-17-400-TR

540-88-044-17-400-TR

CONN SOCKET PLCC 44POS TIN

Preci-Dip
2,032 -

RFQ

540-88-044-17-400-TR

Ficha técnica

Tape & Reel (TR) 540 Active PLCC 44 (4 x 11) 0.050 (1.27mm) Tin - Phosphor Bronze Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS)
510-87-036-06-000101

510-87-036-06-000101

CONN SOCKET PGA 36POS GOLD

Preci-Dip
2,792 -

RFQ

510-87-036-06-000101

Ficha técnica

Bulk 510 Active PGA 36 (6 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-628-41-605101

110-87-628-41-605101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,626 -

RFQ

110-87-628-41-605101

Ficha técnica

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-428-41-005101

110-87-428-41-005101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,755 -

RFQ

110-87-428-41-005101

Ficha técnica

Bulk 110 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-628-41-005101

110-87-628-41-005101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,897 -

RFQ

110-87-628-41-005101

Ficha técnica

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-328-01-762101

110-87-328-01-762101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,221 -

RFQ

110-87-328-01-762101

Ficha técnica

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14), 16 Loaded 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-87-318-41-001101

612-87-318-41-001101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
2,414 -

RFQ

612-87-318-41-001101

Ficha técnica

Bulk 612 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-314-41-012101

116-87-314-41-012101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
2,407 -

RFQ

116-87-314-41-012101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-310-41-001101

116-87-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,792 -

RFQ

116-87-310-41-001101

Ficha técnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-210-41-001101

116-87-210-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,741 -

RFQ

116-87-210-41-001101

Ficha técnica

Bulk 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-610-41-001101

116-87-610-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,328 -

RFQ

116-87-610-41-001101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-306-10-001101

299-87-306-10-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
2,415 -

RFQ

299-87-306-10-001101

Ficha técnica

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-312-41-002101

116-87-312-41-002101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
2,094 -

RFQ

116-87-312-41-002101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-312-41-003101

116-83-312-41-003101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
3,223 -

RFQ

116-83-312-41-003101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-312-41-035101

146-87-312-41-035101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
3,834 -

RFQ

146-87-312-41-035101

Ficha técnica

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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1800+ Fabricantes en todo el mundo
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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