Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
D01-9933201

D01-9933201

CONNECTOR

Harwin Inc.
2,187 -

RFQ

D01-9933201

Ficha técnica

Bulk D01-993 Obsolete SIP 32 (1 x 32) 0.100 (2.54mm) Tin - Brass Through Hole - Solder Cup 0.100 (2.54mm) Tin - Brass Polyamide (PA46), Nylon 4/6, Glass Filled
D2618-42

D2618-42

IC SOCKET ASSEMBLY 18POS

Harwin Inc.
2,272 -

RFQ

D2618-42

Ficha técnica

Tube D26 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D2724-42

D2724-42

IC SOCKET ASSEMBLY 24POS

Harwin Inc.
2,860 -

RFQ

D2724-42

Ficha técnica

Tube D2 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Plastic
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1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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