Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
XR2T2411N

XR2T2411N

CONN IC DIP SOCKET 24POS GOLD

Omron Electronics Inc-EMC Div
2,554 -

RFQ

XR2T2411N

Ficha técnica

Bulk XR2 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Threaded Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polybutylene Terephthalate (PBT), Glass Filled
XR2A-4001-N

XR2A-4001-N

CONN IC DIP SOCKET 40POS GOLD

Omron Electronics Inc-EMC Div
2,391 -

RFQ

XR2A-4001-N

Ficha técnica

Bulk XR2 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2A-6411-N

XR2A-6411-N

I.C. CONNECTOR SOCKET

Omron Electronics Inc-EMC Div
3,447 -

RFQ

Bulk * Active - - - - - - - - - - - - - -
XR3G-6401

XR3G-6401

CONN IC SOCKET 64POS

Omron Electronics Inc-EMC Div
3,141 -

RFQ

XR3G-6401

Ficha técnica

-,Box - Active - - - - - - - - - - - - - -
XR2A-2001-N

XR2A-2001-N

CONN IC DIP SOCKET 20POS GOLD

Omron Electronics Inc-EMC Div
2,925 -

RFQ

XR2A-2001-N

Ficha técnica

Bulk XR2 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2A-2815

XR2A-2815

CONN IC DIP SOCKET 28POS GOLD

Omron Electronics Inc-EMC Div
2,233 -

RFQ

XR2A-2815

Ficha técnica

Bulk XR2 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2C-1511-N

XR2C-1511-N

CONN SOCKET SIP 15POS GOLD

Omron Electronics Inc-EMC Div
2,389 -

RFQ

XR2C-1511-N

Ficha técnica

Bulk XR2 Active SIP 15 (1 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2E-3204

XR2E-3204

CONN SOCKET SIP 32POS GOLD

Omron Electronics Inc-EMC Div
3,248 -

RFQ

XR2E-3204

Ficha técnica

Bulk XR2 Obsolete SIP 32 (1 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2H-1611-N

XR2H-1611-N

CONN ZIG-ZAG 16POS GOLD

Omron Electronics Inc-EMC Div
3,072 -

RFQ

XR2H-1611-N

Ficha técnica

Bulk XR2 Active Zig-Zag 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2C-2000-HSG

XR2C-2000-HSG

CONN IC SOCKET 20POS

Omron Electronics Inc-EMC Div
3,035 -

RFQ

XR2C-2000-HSG

Ficha técnica

Bulk,Bulk XR2 Obsolete Housing 20 (1 x 20) 0.100 (2.54mm) - - Beryllium Copper - Closed Frame Solder 0.100 (2.54mm) - - Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2C-3200-HSG

XR2C-3200-HSG

CONN IC SOCKET 32POS

Omron Electronics Inc-EMC Div
3,790 -

RFQ

XR2C-3200-HSG

Ficha técnica

Bulk XR2 Active Housing 32 (1 x 32) 0.100 (2.54mm) - - Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) - - Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2E-3205

XR2E-3205

CONN SOCKET SIP 32POS GOLD

Omron Electronics Inc-EMC Div
3,841 -

RFQ

XR2E-3205

Ficha técnica

Bulk XR2 Obsolete SIP 32 (1 x 32) 0.100 (2.54mm) Gold - Beryllium Copper - - Solder 0.100 (2.54mm) Gold - Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2D-2401-N

XR2D-2401-N

CONN IC DIP SOCKET 24POS GOLD

Omron Electronics Inc-EMC Div
3,839 -

RFQ

XR2D-2401-N

Ficha técnica

Bulk XR2 Obsolete DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2D-4001-N

XR2D-4001-N

CONN IC DIP SOCKET 40POS GOLD

Omron Electronics Inc-EMC Div
3,670 -

RFQ

XR2D-4001-N

Ficha técnica

Bulk XR2 Obsolete DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2E-3201-N

XR2E-3201-N

CONN SOCKET SIP 32POS GOLD

Omron Electronics Inc-EMC Div
2,832 -

RFQ

XR2E-3201-N

Ficha técnica

Bulk XR2 Obsolete SIP 32 (1 x 32) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2C2611N

XR2C2611N

CONN SOCKET SIP 26POS GOLD

Omron Electronics Inc-EMC Div
3,156 -

RFQ

XR2C2611N

Ficha técnica

Bulk XR2 Active SIP 26 (1 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Threaded - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polybutylene Terephthalate (PBT), Glass Filled
XR2C-3215

XR2C-3215

CONNECTORS - CONNECTOR

Omron Electronics Inc-EMC Div
2,151 -

RFQ

XR2C-3215

Ficha técnica

Box * Active - - - - - - - - - - - - - -
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1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Producto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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