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| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | MountingType | CoilVoltage | ContactForm | ContactRating(Current) | SwitchingVoltage | CoilCurrent | CoilType | Features | TerminationStyle | SealRating | CoilInsulation | MustOperateVoltage | MustReleaseVoltage | OperateTime | ReleaseTime | OperatingTemperature | ContactMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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3-1617352-0JMGSCDD-26M=M39016/43-038M TE Connectivity Aerospace, Defense and Marine |
2,619 | - |
RFQ |
Bulk | MGS | Active | Through Hole | 26.5VDC | DPDT (2 Form C) | 1 A | 115VAC, 28VDC - Max | 8.3 mA | Non Latching | Diode | PC Pin | Sealed - Hermetically | - | 15.2 VDC | 1.7 VDC | 4 ms | 7.5 ms | -65°C ~ 125°C | Silver Palladium (AgPd), Gold (Au) | |
|
R10-E1Z4-115VRELAY GEN PURPOSE 4PDT 2A 115VAC TE Connectivity Potter & Brumfield Relays |
3,845 | - |
RFQ |
Ficha técnica |
Bulk | R10 | Active | Socketable | 115VAC | 4PDT (4 Form C) | 2 A | 120VAC, 30VDC - Max | - | Non Latching | - | Plug In | - | - | 86 VAC | - | - | - | -55°C ~ 75°C | Silver (Ag) |
|
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HC3-26CHC3-26C = HC RELAY TE Connectivity Aerospace, Defense and Marine |
3,367 | - |
RFQ |
Bulk | HC, CII | Active | Through Hole | 26.5VDC | DPDT (2 Form C) | 1 A | - | - | - | - | PC Pin | Sealed - Hermetically | - | 18 VDC | - | 4 ms | 3 ms | -55°C ~ 85°C | Silver Palladium (AgPd), Gold (Au) | |
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MACDG-26MACDG-26=RELAY TE Connectivity Aerospace, Defense and Marine |
3,303 | - |
RFQ |
Bulk | MAC | Active | Through Hole | 26.5VDC | DPDT (2 Form C) | 1 A | 28VDC - Max | 17 mA | Non Latching | Diode | PC Pin | Sealed - Hermetically | - | 14.2 VDC | 1.37 VDC | 1.5 ms | 4 ms | -65°C ~ 125°C | - | |
|
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9-1617540-8J1MSCD-18XL=M39016/25-040L TE Connectivity Aerospace, Defense and Marine |
2,411 | - |
RFQ |
Bulk | 1MS | Active | Through Hole | 18VDC | SPDT (1 Form C) | 1 A | 115VAC, 28VDC - Max | 7.8 mA | Non Latching | Diode | PC Pin | Sealed - Hermetically | - | 10.5 VDC | 0.91 VDC | 4 ms | 7.5 ms | -65°C ~ 125°C | Silver Palladium (AgPd), Gold (Au) | |
|
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J1MSCD-26XLJ1MSCD-26XL=M39016/25-036L TE Connectivity Aerospace, Defense and Marine |
2,146 | - |
RFQ |
Bulk | 1MS | Active | Through Hole | 26.5VDC | SPDT (1 Form C) | 1 A | 115VAC, 28VDC - Max | 6.6 mA | Non Latching | Diode | PC Pin | Sealed - Hermetically | - | 14.2 VDC | 1.37 VDC | 4 ms | 7.5 ms | -65°C ~ 125°C | Silver Palladium (AgPd), Gold (Au) | |
|
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1-1617351-2J1MSCD-6XM=M39016/25-034M TE Connectivity Aerospace, Defense and Marine |
3,499 | - |
RFQ |
Bulk | Military, MIL-R-39016/10, 1MS, CII | Active | Through Hole | 6VDC | SPDT (1 Form C) | 1 A | - | - | - | Diode | PC Pin | Sealed - Hermetically | - | 3.5 VDC | 0.28 VDC | 4 ms | 2.5 ms | -65°C ~ 125°C | Silver Palladium (AgPd), Gold (Au) | |
|
|
3-1617119-8J1MSCD-9XL = M39016/25-039L TE Connectivity Aerospace, Defense and Marine |
3,057 | - |
RFQ |
Bulk | 1MS | Active | Through Hole | 9VDC | SPDT (1 Form C) | 1 A | 115VAC, 28VDC - Max | 14.3 mA | Non Latching | Diode | PC Pin | Sealed - Hermetically | - | 5.3 VDC | 0.54 VDC | 4 ms | 7.5 ms | -65°C ~ 125°C | Silver Palladium (AgPd), Gold (Au) | |
|
|
3-1617119-6J1MSCD-5XM = M39016/25-033M TE Connectivity Aerospace, Defense and Marine |
2,785 | - |
RFQ |
Bulk | 1MS | Active | Through Hole | 5VDC | SPDT (1 Form C) | 1 A | 115VAC, 28VDC - Max | 40 mA | Non Latching | Diode | PC Pin | Sealed - Hermetically | - | 2.8 VDC | 0.23 VDC | 4 ms | 7.5 ms | -65°C ~ 125°C | Silver Palladium (AgPd), Gold (Au) | |
|
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J1MSPD-18XLJ1MSPD-18XL = M39016/25-032L TE Connectivity Aerospace, Defense and Marine |
2,757 | - |
RFQ |
Ficha técnica |
Bulk | 1MS | Active | Through Hole | 18VDC | SPDT (1 Form C) | 1 A | 115VAC, 28VDC - Max | 7.8 mA | Non Latching | Diode | PC Pin | Sealed - Hermetically | - | 10.5 VDC | 0.91 VDC | 4 ms | 7.5 ms | -65°C ~ 125°C | Silver Palladium (AgPd), Gold (Au) |
|
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1617128-4JMSCD-12XP = M39016/16-035P TE Connectivity Aerospace, Defense and Marine |
3,427 | - |
RFQ |
Bulk | Military, MIL-R-39016/16, MSD, CII | Active | Through Hole | 12VDC | DPDT (2 Form C) | 1 A | 115VAC, 28VDC - Max | - | Non Latching | Diode | PC Pin | Sealed - Hermetically | - | 7 VDC | 0.64 VDC | 4 ms | 7.5 ms | -65°C ~ 125°C | Silver Palladium (AgPd), Gold (Au) | |
|
|
1-1617351-4JMSCD-9XP=M39016/16-039P TE Connectivity Aerospace, Defense and Marine |
2,866 | - |
RFQ |
Bulk | Military, MIL-R-39016/16, MSD, CII | Active | Through Hole | 9VDC | DPDT (2 Form C) | 1 A | 115VAC, 28VDC - Max | - | Non Latching | Diode | PC Pin | Sealed - Hermetically | - | 4.85 VDC | 0.55 VDC | 4 ms | 7.5 ms | -65°C ~ 125°C | Silver Palladium (AgPd), Gold (Au) | |
|
|
1-1617543-3JMGSCDG-5MW=M39016/42-065M TE Connectivity Aerospace, Defense and Marine |
2,051 | - |
RFQ |
Bulk | Military, MIL-R-39016/42, MGSD, CII | Active | Through Hole | 5VDC | DPDT (2 Form C) | 1 A | 115VAC, 28VDC - Max | - | Non Latching | Diode | PC Pin | Sealed - Hermetically | - | 2.6 VDC | 0.23 VDC | 4 ms | 7.5 ms | -65°C ~ 125°C | Silver Palladium (AgPd), Gold (Au) | |
|
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4-1617599-6PRMGACG-12XW=RELAY TE Connectivity Aerospace, Defense and Marine |
3,654 | - |
RFQ |
Bulk | MGA | Active | Through Hole | 12VDC | DPDT (2 Form C) | 1 A | 115VAC, 28VDC - Max | 30.8 mA | Non Latching | - | PC Pin | Sealed - Hermetically | - | 7 VDC | 0.63 VDC | 2 ms | 1.5 ms | -65°C ~ 125°C | Silver Palladium (AgPd), Gold (Au) | |
|
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5-1617599-0PRMGACG-26XW=RELAY TE Connectivity Aerospace, Defense and Marine |
2,117 | - |
RFQ |
Bulk | MGA | Active | Through Hole | 26.5VDC | DPDT (2 Form C) | 1 A | 115VAC, 28VDC - Max | 17 mA | Non Latching | - | PC Pin | Sealed - Hermetically | - | 14.2 VDC | 1.37 VDC | 2 ms | 1.5 ms | -65°C ~ 125°C | Silver Palladium (AgPd), Gold (Au) | |
|
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JMGSCD-5LWJMGSCD-5LW=M39016/42-049L TE Connectivity Aerospace, Defense and Marine |
3,622 | - |
RFQ |
Bulk | Military, MIL-R-39016/42, MGSD, CII | Active | Through Hole | 5VDC | DPDT (2 Form C) | 1 A | 115VAC, 28VDC - Max | - | Non Latching | Diode | PC Pin | Sealed - Hermetically | - | 2.6 VDC | 0.23 VDC | 4 ms | 7.5 ms | -65°C ~ 125°C | Silver Palladium (AgPd), Gold (Au) | |
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JMGSCD-18MWJMGSCD-18MW = M39016/42-056M TE Connectivity Aerospace, Defense and Marine |
3,761 | - |
RFQ |
Bulk | Military, MIL-R-39016/42, MGSD, CII | Active | Through Hole | 18VDC | DPDT (2 Form C) | 1 A | 115VAC, 28VDC - Max | - | Non Latching | Diode | PC Pin | Sealed - Hermetically | - | 9.8 VDC | 0.92 VDC | 4 ms | 7.5 ms | -65°C ~ 125°C | Silver Palladium (AgPd), Gold (Au) | |
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J1MACD-26XPSJ1MACD-26XPS = M39016/23-036P TE Connectivity Aerospace, Defense and Marine |
3,936 | - |
RFQ |
Bulk | 1MA | Active | Through Hole | 26.5VDC | SPDT (1 Form C) | 1 A | 115VAC, 28VDC - Max | 13.3 mA | Non Latching | Diode | PC Pin | Sealed - Hermetically | - | 14.2 VDC | 1.37 VDC | 2 ms | 4 ms | -65°C ~ 125°C | Silver Palladium (AgPd), Gold (Au) | |
|
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JMGACDD-12PJMGACDD-12P = M39016/19-034P TE Connectivity Aerospace, Defense and Marine |
2,400 | - |
RFQ |
Bulk | Military, MIL-R-39016/19, MGADD, CII | Active | Through Hole | 12VDC | DPDT (2 Form C) | 1 A | 115VAC, 28VDC - Max | 32.8 mA | Non Latching | Diode | PC Pin | Sealed - Hermetically | - | 8 VDC | 1.1 VDC | 2 ms | 4 ms | -65°C ~ 125°C | Silver Palladium (AgPd), Gold (Au) | |
|
|
JMGACDD-26PJMGACDD-26P = M39016/19-036P TE Connectivity Aerospace, Defense and Marine |
2,190 | - |
RFQ |
Bulk | Military, MIL-R-39016/19, MGADD, CII | Active | Through Hole | 26.5VDC | DPDT (2 Form C) | 1 A | 115VAC, 28VDC - Max | 18.5 mA | Non Latching | Diode | PC Pin | Sealed - Hermetically | - | 15.2 VDC | 1.8 VDC | 2 ms | 4 ms | -65°C ~ 125°C | Silver Palladium (AgPd), Gold (Au) |
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