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| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | MountingType | CoilVoltage | ContactForm | ContactRating(Current) | SwitchingVoltage | CoilCurrent | CoilType | Features | TerminationStyle | SealRating | CoilInsulation | MustOperateVoltage | MustReleaseVoltage | OperateTime | ReleaseTime | OperatingTemperature | ContactMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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2-1617351-2JMSP-5XM=M39016/11-018M TE Connectivity Aerospace, Defense and Marine |
2,156 | - |
RFQ |
Bulk | MSP | Active | Through Hole | 5VDC | DPDT (2 Form C) | 1 A | 115VAC, 28VDC - Max | 50 mA | Non Latching | - | PC Pin | Sealed - Hermetically | - | 2.6 VDC | 0.23 VDC | 4 ms | 2 ms | -65°C ~ 125°C | Silver Palladium (AgPd), Gold (Au) | |
|
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6-1617543-0JMSP-6XL=M39016/11-020L TE Connectivity Aerospace, Defense and Marine |
2,850 | - |
RFQ |
Bulk | MSP | Active | Through Hole | 6VDC | DPDT (2 Form C) | 1 A | 115VAC, 28VDC - Max | 30 mA | Non Latching | - | PC Pin | Sealed - Hermetically | - | 3.4 VDC | 0.28 VDC | 4 ms | 2 ms | -65°C ~ 125°C | Silver Palladium (AgPd), Gold (Au) | |
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HMD-5BHMD-5B = HM RELAY 0.5 LEADS TE Connectivity Aerospace, Defense and Marine |
3,784 | - |
RFQ |
Ficha técnica |
Bulk | HMD, CII | Active | Through Hole | 5VDC | DPDT (2 Form C) | 1 A | - | - | - | - | PC Pin | Sealed - Hermetically | - | - | - | 4 ms | 6 ms | -55°C ~ 85°C | Silver Palladium (AgPd), Gold (Au) |
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HMD-26BHMD-26B = HM RELAY 0.5 LEADS TE Connectivity Aerospace, Defense and Marine |
2,369 | - |
RFQ |
Bulk | HMD, CII | Active | Through Hole | 26.5VDC | DPDT (2 Form C) | 1 A | - | - | - | - | PC Pin | Sealed - Hermetically | - | - | - | 4 ms | 6 ms | -55°C ~ 85°C | Silver Palladium (AgPd), Gold (Au) | |
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HC3-26BHC3-26B = HC RELAY TE Connectivity Aerospace, Defense and Marine |
2,493 | - |
RFQ |
Bulk | HC, CII | Active | Through Hole | 26.5VDC | DPDT (2 Form C) | 1 A | - | - | - | - | PC Pin | Sealed - Hermetically | - | 18 VDC | - | 4 ms | 3 ms | -55°C ~ 85°C | Silver Palladium (AgPd), Gold (Au) | |
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MGSC-26WMGSC-26W=MGS .100 GRID RELAY TE Connectivity Aerospace, Defense and Marine |
3,358 | - |
RFQ |
Bulk | MGS, CII | Active | Through Hole | 26.5VDC | DPDT (2 Form C) | 1 A | - | - | - | - | PC Pin | - | - | 14 VDC | 1.4 VDC | 4 ms | 2 ms | -65°C ~ 125°C | Silver Palladium (AgPd), Gold (Au) | |
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MGSHC-18MGSHC-18 = MGSH 200C HIGH TEMP TE Connectivity Aerospace, Defense and Marine |
3,312 | - |
RFQ |
Bulk | MGS, CII | Active | Through Hole | 18VDC | DPDT (2 Form C) | 1 A | - | - | - | - | PC Pin | - | - | 9.8 VDC | 0.92 VDC | 4 ms | 2 ms | -65°C ~ 125°C | Silver Palladium (AgPd), Gold (Au) | |
|
J1MAC-12XLSRELAY GEN PURPOSE SPDT 1A 12VDC TE Connectivity Aerospace, Defense and Marine |
2,485 | - |
RFQ |
Ficha técnica |
Bulk | Military, MIL-R-39016/7, 1MA, CII | Active | Through Hole | 12VDC | SPDT (1 Form C) | 1 A | 115VAC, 28VDC - Max | - | Non Latching | - | PC Pin | Sealed - Hermetically | - | 7 VDC | 0.63 VDC | 2 ms | 2 ms | -65°C ~ 125°C | Silver Palladium (AgPd), Gold (Au) |
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JMAW-6XMJMAW-6XM = M39016/9-014M TE Connectivity Aerospace, Defense and Marine |
2,999 | - |
RFQ |
Bulk | Military, MIL-R-39016/9, MA, CII | Active | Through Hole | 6VDC | DPDT (2 Form C) | 1 A | 115VAC, 28VDC - Max | - | Non Latching | - | PC Pin | Sealed - Hermetically | - | 3.5 VDC | 0.28 VDC | 2 ms | 1.5 ms | -65°C ~ 125°C | Silver Palladium (AgPd), Gold (Au) | |
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JMAW-12XMJMAW-12XM = M39016/9-016M TE Connectivity Aerospace, Defense and Marine |
3,523 | - |
RFQ |
Bulk | Military, MIL-R-39016/9, MA, CII | Active | Through Hole | 12VDC | DPDT (2 Form C) | 1 A | 115VAC, 28VDC - Max | - | Non Latching | - | PC Pin | Sealed - Hermetically | - | 7 VDC | 0.63 VDC | 2 ms | 1.5 ms | -65°C ~ 125°C | Silver Palladium (AgPd), Gold (Au) | |
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JMAP-12XLJMAP-12XL = M39016/9-022L TE Connectivity Aerospace, Defense and Marine |
2,619 | - |
RFQ |
Bulk | MAP | Active | Through Hole | 12VDC | DPDT (2 Form C) | 1 A | 115VAC, 28VDC - Max | 30.8 mA | Non Latching | - | PC Pin | Sealed - Hermetically | - | 7 VDC | 0.63 VDC | 2 ms | 1.5 ms | -65°C ~ 125°C | Silver Palladium (AgPd), Gold (Au) | |
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JMAP-12XMJMAP-12XM=M39016/9-022M TE Connectivity Aerospace, Defense and Marine |
2,526 | - |
RFQ |
Bulk | MAP | Active | Through Hole | 12VDC | DPDT (2 Form C) | 1 A | 115VAC, 28VDC - Max | 30.8 mA | Non Latching | - | PC Pin | Sealed - Hermetically | - | 7 VDC | 0.63 VDC | 2 ms | 1.5 ms | -65°C ~ 125°C | Silver Palladium (AgPd), Gold (Au) | |
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JMAC-5XLJMAC-5XL = M39016/9-057L TE Connectivity Aerospace, Defense and Marine |
2,771 | - |
RFQ |
Bulk | MAC | Active | Through Hole | 5VDC | DPDT (2 Form C) | 1 A | 115VAC, 28VDC - Max | 100 mA | Non Latching | - | PC Pin | Sealed - Hermetically | - | 2.7 VDC | 0.22 VDC | 2 ms | 1.5 ms | -65°C ~ 125°C | Silver Palladium (AgPd), Gold (Au) | |
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JMAC-12XMJMAC-12XM = M39016/9-060M TE Connectivity Aerospace, Defense and Marine |
2,280 | - |
RFQ |
Bulk | MAC | Active | Through Hole | 12VDC | DPDT (2 Form C) | 1 A | 115VAC, 28VDC - Max | 30.8 mA | Non Latching | - | PC Pin | Sealed - Hermetically | - | 7 VDC | 0.63 VDC | 2 ms | 1.5 ms | -65°C ~ 125°C | Silver Palladium (AgPd), Gold (Au) | |
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JMAC-30XMJMAC-30XM=M39016/9-063M TE Connectivity Aerospace, Defense and Marine |
3,084 | - |
RFQ |
Bulk | MAC | Active | Through Hole | 30VDC | DPDT (2 Form C) | 1 A | 115VAC, 28VDC - Max | 12 mA | Non Latching | - | PC Pin | Sealed - Hermetically | - | 17.7 VDC | 1.5 VDC | 2 ms | 1.5 ms | -65°C ~ 125°C | Silver Palladium (AgPd), Gold (Au) | |
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8-1617541-7JMAC-18XM=M39016/9-061M TE Connectivity Aerospace, Defense and Marine |
2,582 | - |
RFQ |
Bulk | MAC | Active | Through Hole | 18VDC | DPDT (2 Form C) | 1 A | 115VAC, 28VDC - Max | 20.5 mA | Non Latching | - | PC Pin | Sealed - Hermetically | - | 10.5 VDC | 0.91 VDC | 2 ms | 1.5 ms | -65°C ~ 125°C | Silver Palladium (AgPd), Gold (Au) | |
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1617123-2JMAP-18XL = M39016/9-023L TE Connectivity Aerospace, Defense and Marine |
3,658 | - |
RFQ |
Bulk | Military, MIL-R-39016/9, MA, CII | Active | Through Hole | 18VDC | DPDT (2 Form C) | 1 A | 115VAC, 28VDC - Max | - | Non Latching | - | PC Pin | Sealed - Hermetically | - | 10.5 VDC | 0.91 VDC | 2 ms | 1.5 ms | -65°C ~ 125°C | Silver Palladium (AgPd), Gold (Au) | |
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2-1617542-3JMAP-18XM=M39016/9-023M TE Connectivity Aerospace, Defense and Marine |
2,544 | - |
RFQ |
Bulk | MAP | Active | Through Hole | 18VDC | DPDT (2 Form C) | 1 A | 115VAC, 28VDC - Max | 20.5 mA | Non Latching | - | PC Pin | Sealed - Hermetically | - | 10.5 VDC | 0.91 VDC | 2 ms | 1.5 ms | -65°C ~ 125°C | Silver Palladium (AgPd), Gold (Au) | |
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2-1617542-9JMAP-9XM=M39016/9-021M TE Connectivity Aerospace, Defense and Marine |
3,745 | - |
RFQ |
Bulk | MAP | Active | Through Hole | 9VDC | DPDT (2 Form C) | 1 A | 115VAC, 28VDC - Max | 40.9 mA | Non Latching | - | PC Pin | Sealed - Hermetically | - | 5.3 VDC | 0.54 VDC | 2 ms | 1.5 ms | -65°C ~ 125°C | Silver Palladium (AgPd), Gold (Au) | |
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1-1617125-0JMAW-5XM = M39016/9-013M TE Connectivity Aerospace, Defense and Marine |
3,093 | - |
RFQ |
Bulk | Military, MIL-R-39016/9, MA, CII | Active | Through Hole | 5VDC | DPDT (2 Form C) | 1 A | 115VAC, 28VDC - Max | - | Non Latching | - | PC Pin | Sealed - Hermetically | - | 2.7 VDC | 0.22 VDC | 2 ms | 1.5 ms | -65°C ~ 125°C | Silver Palladium (AgPd), Gold (Au) |
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