RFI y EMI: contactos, dedo y juntas

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type Shape Width Length Height Material Plating Plating-Thickness AttachmentMethod
1447009-5

1447009-5

SHIELDFINGER0820TYPE

TE Connectivity AMP Connectors
3,443 -

RFQ

1447009-5

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) - Active Shield Finger - 0.079 (2.00mm) 0.134 (3.40mm) 0.031 (0.80mm) Copper Alloy Gold 1.967µin (0.05µm) Solder
1746136-1

1746136-1

SHIELD FINGER 1520 AU PL VERSION

TE Connectivity AMP Connectors
3,498 -

RFQ

1746136-1

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) - Active Shield Finger - 0.079 (2.00mm) 0.134 (3.40mm) 0.059 (1.50mm) Copper Alloy Gold Flash Solder
2108614-5

2108614-5

2.7H SPRING FINGER W/EMBOSS

TE Connectivity AMP Connectors
3,161 -

RFQ

2108614-5

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) - Active Shield Finger, Pre-Loaded - 0.039 (1.00mm) 0.039 (1.00mm) 0.106 (2.70mm) Copper Alloy Gold Flash Solder
S7111-42R

S7111-42R

RFI SHIELD FINGER AU 4.5MM SMD

Harwin Inc.
3,308 -

RFQ

S7111-42R

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) EZ BoardWare Active Shield Finger, Pre-Loaded - 0.098 (2.50mm) 0.138 (3.50mm) 0.177 (4.50mm) Copper Alloy Gold Flash Solder
1447009-8

1447009-8

SHIELDFINGER3525Z

TE Connectivity AMP Connectors
3,059 -

RFQ

1447009-8

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) - Active Shield Finger - 0.098 (2.50mm) 0.177 (4.50mm) 0.138 (3.50mm) Copper Alloy Gold 1.967µin (0.05µm) Solder
S0921-46R

S0921-46R

RFI SHIELD CLIP CORNER TIN SMD

Harwin Inc.
3,372 -

RFQ

S0921-46R

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) - Active Shield Clip - - 0.222 (5.65mm) 0.215 (5.46mm) Cupro Nickel Tin 141.73µin (3.60µm) Solder
1437259-6

1437259-6

SHIELD FINGER NICKEL 2.49MM

TE Connectivity AMP Connectors
3,682 -

RFQ

1437259-6

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) - Active Shield Finger - 0.098 (2.50mm) 0.276 (7.00mm) 0.157 (4.00mm) Copper Alloy Nickel 1.967µin (0.05µm) Solder
S1941-46R

S1941-46R

RFI SHIELD FINGER TIN SMD

Harwin Inc.
2,296 -

RFQ

S1941-46R

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) EZ BoardWare Active Shield Finger - 0.224 (5.70mm) 0.378 (9.59mm) 0.285 (7.25mm) Beryllium Copper Tin 118.11µin (3.00µm) Solder
67SLH060100050PI00

67SLH060100050PI00

METAL FILM OVER FOAM CONTACTS

Laird Technologies EMI
2,431 -

RFQ

67SLH060100050PI00

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) SMD Grounding Metallized Active Film Over Foam Hourglass 0.236 (6.00mm) 0.197 (5.00mm) 0.394 (10.00mm) Polyurethane Foam, Tin-Copper Polyester (SN/CU) - - Solder
331031271520

331031271520

CONTACT FINGER EMI SMD

Würth Elektronik
3,270 -

RFQ

331031271520

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) WE-SECF Active Shield Finger - 0.059 (1.50mm) 0.106 (2.70mm) 0.079 (2.00mm) Beryllium Copper Gold Flash Solder
331081302025

331081302025

CONTACT FINGER EMI SMD

Würth Elektronik
3,056 -

RFQ

331081302025

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) WE-SECF Active Shield Finger - 0.079 (2.00mm) 0.118 (3.00mm) 0.098 (2.50mm) Beryllium Copper Gold Flash Solder
BMI-C-004

BMI-C-004

CONTACT BECU 6.0X4.3MM

Laird Technologies EMI
3,469 -

RFQ

BMI-C-004

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) BMI-C Active Fingerstock - 0.170 (4.32mm) 0.235 (5.97mm) 0.204 (5.17mm) Beryllium Copper Gold - Solder
331011452048

331011452048

CONTACT FINGER EMI SMD

Würth Elektronik
2,176 -

RFQ

331011452048

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) WE-SECF Active Shield Finger - 0.079 (2.00mm) 0.177 (4.50mm) 0.189 (4.80mm) Beryllium Copper Gold Flash Solder
331051472057

331051472057

CONTACT FINGER EMI SMD

Würth Elektronik
2,475 -

RFQ

331051472057

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) WE-SECF Active Shield Finger - 0.079 (2.00mm) 0.185 (4.70mm) 0.224 (5.70mm) Beryllium Copper Gold Flash Solder
331141352540

331141352540

CONTACT FINGER EMI SMD

Würth Elektronik
3,848 -

RFQ

331141352540

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) WE-SECF Active Shield Finger - 0.098 (2.50mm) 0.138 (3.50mm) 0.157 (4.00mm) Beryllium Copper Gold Flash Solder
0077001802

0077001802

GASKET BECU 8.1X13.82MM

Laird Technologies EMI
3,815 -

RFQ

0077001802

Ficha técnica

Box Slot Mount Active Fingerstock - 0.320 (8.13mm) 0.543 (13.79mm) 0.110 (2.79mm) Beryllium Copper Nickel, Tin 299.99µin (7.62µm) Slot
0097097302

0097097302

CARD GUI CLIPON BECU 3.05X9.53MM

Laird Technologies EMI
3,532 -

RFQ

0097097302

Ficha técnica

Box Card Guide Clip-On Active - - 0.120 (3.05mm) 0.375 (9.53mm) - - - - -
0D97098302

0D97098302

FINGERSTOCK BECU 2.03X9.53MM

Laird Technologies EMI
2,213 -

RFQ

0D97098302

Ficha técnica

Bulk Card Guide Clip-On Active Fingerstock - 0.080 (2.03mm) 0.375 (9.52mm) 0.062 (1.57mm) Beryllium Copper Nickel, Tin 299.99µin (7.62µm) Clip
0097098302

0097098302

CARD GUI CLIPON BECU 2.03X9.53MM

Laird Technologies EMI
2,470 -

RFQ

0097098302

Ficha técnica

Box Card Guide Clip-On Active Fingerstock - 0.080 (2.03mm) 0.375 (9.52mm) 0.062 (1.57mm) Beryllium Copper Nickel, Tin 299.99µin (7.62µm) Clip
10-04-6386-6502

10-04-6386-6502

CHO-SEAL 6502 NI/AL 0.040 1'

Parker Chomerics
3,712 -

RFQ

10-04-6386-6502

Ficha técnica

Spool - Active Gasket Round 0.040 (1.02mm) 12.000 (304.80mm) - Conductive Elastomer Nickel - Non-Conductive Adhesive
Total 4831 Record«Prev123456789...242Next»
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Producto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Usuario