RFI y EMI: contactos, dedo y juntas

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type Shape Width Length Height Material Plating Plating-Thickness AttachmentMethod
0078001717

0078001717

SLMT,2F,SNB,USFT

Laird Technologies EMI
3,549 -

RFQ

0078001717

Ficha técnica

Bulk Ultrasoft Slot Mount Active Fingerstock - 0.320 (8.13mm) 0.356 (9.04mm) 0.110 (2.79mm) Beryllium Copper Tin 299.21µin (7.60µm) Slot
0078001802

0078001802

SLMT,3F,BF,USF

Laird Technologies EMI
2,186 -

RFQ

0078001802

Ficha técnica

Bulk Ultrasoft Slot Mount Active Fingerstock - 0.320 (8.13mm) 0.543 (13.79mm) 0.110 (2.79mm) Beryllium Copper - - Slot
0078001817

0078001817

SLMT,3F,SNB,USFT

Laird Technologies EMI
2,286 -

RFQ

0078001817

Ficha técnica

Bulk Ultrasoft Slot Mount Active Fingerstock - 0.320 (8.13mm) 0.543 (13.79mm) 0.110 (2.79mm) Beryllium Copper Tin 299.21µin (7.60µm) Slot
0078001902

0078001902

SLMT,4F,BF,USF

Laird Technologies EMI
2,870 -

RFQ

0078001902

Ficha técnica

Bulk Ultrasoft Slot Mount Active Fingerstock - 0.320 (8.13mm) 0.730 (18.54mm) 0.110 (2.79mm) Beryllium Copper - - Slot
0078001919

0078001919

SLMT,4F,NIB,USFT

Laird Technologies EMI
3,491 -

RFQ

0078001919

Ficha técnica

Bulk Ultrasoft Slot Mount Active Fingerstock - 0.320 (8.13mm) 0.730 (18.54mm) 0.110 (2.79mm) Beryllium Copper Nickel 299.21µin (7.60µm) Slot
0078002017

0078002017

SLMT,2F,SNB,USFT

Laird Technologies EMI
2,846 -

RFQ

0078002017

Ficha técnica

Bulk Ultrasoft Slot Mount Active Fingerstock - 0.600 (15.24mm) 0.532 (13.51mm) 0.220 (5.59mm) Beryllium Copper Tin 299.21µin (7.60µm) Slot
0078002417

0078002417

SLMT,2F,SNB,USFT

Laird Technologies EMI
3,757 -

RFQ

0078002417

Ficha técnica

Bulk Ultrasoft Slot Mount Active Fingerstock - 0.370 (9.40mm) 0.475 (12.07mm) 0.130 (3.30mm) Beryllium Copper Tin 299.21µin (7.60µm) Slot
0078002419

0078002419

SLMT,2F,NIB,USFT

Laird Technologies EMI
2,247 -

RFQ

0078002419

Ficha técnica

Bulk Ultrasoft Slot Mount Active Fingerstock - 0.370 (9.40mm) 0.475 (12.07mm) 0.130 (3.30mm) Beryllium Copper Nickel 299.21µin (7.60µm) Slot
0078004717

0078004717

SLMT,3F,SNB,USFT

Laird Technologies EMI
3,965 -

RFQ

0078004717

Ficha técnica

Bulk Ultrasoft Slot Mount Active Fingerstock - 0.320 (8.13mm) 0.543 (13.79mm) 0.110 (2.79mm) Beryllium Copper Tin 299.21µin (7.60µm) Slot
0078008919

0078008919

SLMT,3F,NIB,USFT

Laird Technologies EMI
3,083 -

RFQ

0078008919

Ficha técnica

Bulk Ultrasoft Slot Mount Active Fingerstock - 0.600 (15.24mm) 0.810 (20.57mm) 0.220 (5.59mm) Beryllium Copper Nickel 299.21µin (7.60µm) Slot
67BCG2504005010R00

67BCG2504005010R00

SP,CON,C,AU,TNR

Laird Technologies EMI
3,518 -

RFQ

Bulk BCG Active - - - - - - - - -
0078009617

0078009617

SLMT,4F,SNB,USFT

Laird Technologies EMI
2,344 -

RFQ

0078009617

Ficha técnica

Bulk Ultrasoft Slot Mount Active Fingerstock - 0.600 (15.24mm) 1.096 (27.84mm) 0.220 (5.59mm) Beryllium Copper Tin 299.21µin (7.60µm) Slot
331021483033

331021483033

WE-SECF SMT EMI CONTACT FINGER

Würth Elektronik
3,164 -

RFQ

Tape & Reel (TR),Cut Tape (CT) WE-SECF Active - - - - - - - - Solder
67B6G2007503015R00

67B6G2007503015R00

FINGERSTOCK CONTACT

Laird Technologies EMI
2,787 -

RFQ

Tape & Reel (TR),Cut Tape (CT) B6G Active Fingerstock - 0.079 (2.00mm) 0.295 (7.50mm) 0.118 (3.00mm) Beryllium Copper Gold - Solder
67B5G4004005108R0B

67B5G4004005108R0B

SP,CON,5,AU,TNR

Laird Technologies EMI
2,444 -

RFQ

Bulk B5G Active Fingerstock - 0.157 (4.00mm) 0.157 (4.00mm) 0.201 (5.10mm) Beryllium Copper Gold - Solder
0077001902

0077001902

GASKET BECU 8.1X18.54MM

Laird Technologies EMI
3,861 -

RFQ

0077001902

Ficha técnica

Bulk Slot Mount Active Fingerstock - 0.320 (8.13mm) 0.730 (18.54mm) 0.110 (2.79mm) Beryllium Copper - - Slot
0077001517

0077001517

GASKET BECU 15.24X6.35MM

Laird Technologies EMI
3,971 -

RFQ

0077001517

Ficha técnica

Bulk Slot Mount Active Fingerstock - 0.600 (15.24mm) 0.250 (6.35mm) 0.220 (5.59mm) Beryllium Copper Tin 299.99µin (7.62µm) Slot
0077002002

0077002002

GASKET BECU 15.24X13.51MM

Laird Technologies EMI
2,271 -

RFQ

0077002002

Ficha técnica

Box Slot Mount Active Fingerstock - 0.600 (15.24mm) 0.532 (13.51mm) 0.220 (5.59mm) Beryllium Copper - - Slot
0077002302

0077002302

GASKET BECU 9.4X5.72MM

Laird Technologies EMI
3,441 -

RFQ

0077002302

Ficha técnica

Box Slot Mount Active Fingerstock - 0.370 (9.40mm) 0.225 (5.71mm) 0.130 (3.30mm) Beryllium Copper - - Slot
0077004102

0077004102

GASKET BECU 7.11X13.82MM

Laird Technologies EMI
2,394 -

RFQ

0077004102

Ficha técnica

Box Slot Mount Active Fingerstock - 0.280 (7.11mm) 0.543 (13.79mm) 0.110 (2.79mm) Beryllium Copper Nickel, Tin 299.99µin (7.62µm) Slot
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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