RFI y EMI: contactos, dedo y juntas

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type Shape Width Length Height Material Plating Plating-Thickness AttachmentMethod
SG060200R-24.00

SG060200R-24.00

.060H X .200W X 24L--RECTANGU

Leader Tech Inc.
2,883 -

RFQ

SG060200R-24.00

Ficha técnica

Bulk - Active Fabric Over Foam Rectangle 0.200 (5.08mm) 24.000 (609.60mm) 0.060 (1.52mm) Polyurethane Foam, Nickel-Copper Polyester (NI/CU) - - -
SG180400D-12

SG180400D-12

.180H X 400W X 12L--D SHAPED-

Leader Tech Inc.
3,981 -

RFQ

SG180400D-12

Ficha técnica

Bulk - Active Fabric Over Foam D-Shape 0.400 (10.16mm) 12.000 (304.80mm) 0.180 (4.57mm) Polyurethane Foam, Nickel-Copper Polyester (NI/CU) - - -
0097078017

0097078017

DCON,25P,SNB

Laird Technologies EMI
3,255 -

RFQ

0097078017

Ficha técnica

Bulk D Connector Active Fingerstock - 0.690 (17.53mm) 2.280 (57.91mm) 0.025 (0.64mm) Beryllium Copper Tin 299.21µin (7.60µm) Slot
0077009317

0077009317

SLMT,STR,SNB .140X.325X.187X16

Laird Technologies EMI
2,330 -

RFQ

Bulk 77 Active Fingerstock - 0.325 (8.26mm) 16.000 (406.40mm) 0.140 (3.56mm) Beryllium Copper Tin 299.21µin (7.60µm) Slot
0097050017

0097050017

AP,STR,SNB,PSA

Laird Technologies EMI
3,886 -

RFQ

0097050017

Ficha técnica

Bulk All-Purpose Active Fingerstock - 0.600 (15.24mm) 23.976 (609.00mm) 0.230 (5.84mm) Beryllium Copper Tin 299.99µin (7.62µm) Adhesive
4787PA51H03937

4787PA51H03937

GK,NICU,PTAFG,PU,V0,DSH .200X.25

Laird Technologies EMI
2,441 -

RFQ

Bulk 51H Active Fabric Over Foam D-Shape 0.250 (6.35mm) 39.370 (1.00m) 0.200 (5.08mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
0097063617

0097063617

NOSG,STR,SNB,CLO

Laird Technologies EMI
2,547 -

RFQ

0097063617

Ficha técnica

Bulk Clip-On Symmetrical Active Fingerstock - 0.358 (9.09mm) 16.535 (420.00mm) 0.174 (4.42mm) Beryllium Copper Tin 299.99µin (7.62µm) Clip
4223PAX1R03937

4223PAX1R03937

GK,NICU,PTAFG,PU,V0,REC .040X.15

Laird Technologies EMI
3,413 -

RFQ

Bulk EcoTemp™ 85 X1R Active Fabric Over Foam Rectangle 0.157 (3.99mm) 39.370 (1.00m) 0.040 (1.02mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
0077004919

0077004919

NOSG,STR,NIB,PSA

Laird Technologies EMI
3,422 -

RFQ

0077004919

Ficha técnica

Bulk Slot Mount Active Fingerstock - 0.600 (15.24mm) 0.347 (8.81mm) 0.120 (3.05mm) Beryllium Copper Nickel 299.21µin (7.60µm) Adhesive
4694PA51H03937

4694PA51H03937

GK,NICU,PTAFG,PU,V0,REC .125X.50

Laird Technologies EMI
2,870 -

RFQ

Bulk 51H Active Fabric Over Foam Rectangle 0.500 (12.70mm) 39.370 (1.00m) 0.125 (3.18mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
4701PA51H03937

4701PA51H03937

GK,NICU,PTAFG,PU,V0,REC 6.35X9.5

Laird Technologies EMI
2,085 -

RFQ

Bulk 51H Active Fabric Over Foam Rectangle 0.375 (9.53mm) 39.370 (1.00m) 0.250 (6.35mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
0097055017

0097055017

TWT,STR,SNB,PSA

Laird Technologies EMI
3,816 -

RFQ

0097055017

Ficha técnica

Bulk Twist Active Fingerstock - 0.230 (5.84mm) 24.000 (609.60mm) 0.030 (0.76mm) Beryllium Copper Tin 299.21µin (7.60µm) Adhesive
0097055019

0097055019

TWT,STR,NIB,PSA

Laird Technologies EMI
2,824 -

RFQ

0097055019

Ficha técnica

Bulk Twist Active Fingerstock - 0.230 (5.84mm) 23.976 (609.00mm) 0.030 (0.76mm) Beryllium Copper Nickel 299.99µin (7.62µm) Adhesive
0097055119

0097055119

TWT,17S,NIB,PSA

Laird Technologies EMI
2,673 -

RFQ

0097055119

Ficha técnica

Bulk Twist Active Fingerstock - 0.160 (4.06mm) 23.976 (609.00mm) 0.030 (0.76mm) Beryllium Copper Nickel 299.99µin (7.62µm) Adhesive
303085035

303085035

WE-LT CONDUCTIVE SHIELDING GASKE

Würth Elektronik
100 -

RFQ

303085035

Ficha técnica

Bag WE-LT Active Fabric Over Foam D-Shape 0.335 (8.50mm) 39.370 (1.00m) 0.138 (3.50mm) Polyurethane Foam, Rayon Paper - - Non-Conductive Adhesive
302095095

302095095

WE-LT CONDUCTIVE SHIELDING GASKE

Würth Elektronik
100 -

RFQ

302095095

Ficha técnica

Bag WE-LT Active Fabric Over Foam Square 0.374 (9.50mm) 39.370 (1.00m) 0.374 (9.50mm) Polyurethane Foam, Rayon Paper - - Non-Conductive Adhesive
3020702

3020702

GASKET FABRIC/FOAM 7MMX1M RECT

Würth Elektronik
2,139 -

RFQ

3020702

Ficha técnica

Tray WE-LT Active Fabric Over Foam Rectangle 0.276 (7.00mm) 39.370 (1.00m) 0.079 (2.00mm) Polyurethane Foam, Rayon Paper - - Non-Conductive Adhesive
30506

30506

CONDUCTIVE NI/CU GLASS SLEEVE 1M

Würth Elektronik
3,512 -

RFQ

30506

Ficha técnica

Bag WE-ST Active Gasket Sleeve - 0.236 (6.00mm) 39.370 (1.00m) - Nickel-Copper (NI/CU) Glass Fiber - - -
WS-3125-KR-2400

WS-3125-KR-2400

FAB/FOAM GASKET .395WX.040HX24L

3G Shielding Specialties LP
3,298 -

RFQ

WS-3125-KR-2400

Ficha técnica

Tube - Active Fabric Over Foam Rectangle 0.395 (10.03mm) 24.000 (609.60mm) 0.040 (1.02mm) Polyurethane Foam, Nickel-Copper Polyester (NI/CU) - - Adhesive
WS-3130-KR-2400

WS-3130-KR-2400

FAB/FOAM GASKET .125WX.060HX24L

3G Shielding Specialties LP
2,874 -

RFQ

WS-3130-KR-2400

Ficha técnica

Tube - Active Fabric Over Foam Rectangle 0.125 (3.18mm) 24.000 (609.60mm) 0.060 (1.52mm) Polyurethane Foam, Nickel-Copper Polyester (NI/CU) - - Adhesive
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1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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