RFI y EMI: contactos, dedo y juntas

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type Shape Width Length Height Material Plating Plating-Thickness AttachmentMethod
0097011417

0097011417

CSTR,STR,SNB

Laird Technologies EMI
248 -

RFQ

0097011417

Ficha técnica

Bulk Contact Strip Active Fingerstock - - - - Beryllium Copper - - Slot
4286ABX1G03937

4286ABX1G03937

X1G FOF GASKET, RETANGULAR, 3.0M

Laird Technologies EMI
475 -

RFQ

4286ABX1G03937

Ficha técnica

Bulk - Active Fabric Over Foam Rectangle 0.394 (10.01mm) 39.370 (1.00m) 0.118 (3.00mm) - - - Adhesive
10104319-001RLF

10104319-001RLF

CIRCUIT BOARD HARDWARE - PCB 2.5

Amphenol ICC (FCI)
3,983 -

RFQ

10104319-001RLF

Ficha técnica

Box * Active - - - - - - - - -
ECP 697/37F

ECP 697/37F

ECP 697/37F 41-3900-6.11

EURO TBAPS INDIA
500 -

RFQ

ECP 697/37F

Ficha técnica

Box - Last Time Buy Gasket - 0.340 (8.64mm) - 0.070 (1.78mm) Beryllium Copper, Stainless Steel - - Adhesive
ECP 697/44F

ECP 697/44F

ECP 697/44F 41-3900-7.26

EURO TBAPS INDIA
500 -

RFQ

ECP 697/44F

Ficha técnica

Box - Last Time Buy Gasket - 0.340 (8.64mm) - 0.070 (1.78mm) Beryllium Copper, Stainless Steel - - Adhesive
ECP 697/54F

ECP 697/54F

ECP 697/54F 41-3900-8.91

EURO TBAPS INDIA
500 -

RFQ

ECP 697/54F

Ficha técnica

Box - Last Time Buy Gasket - 0.340 (8.64mm) - 0.070 (1.78mm) Beryllium Copper, Stainless Steel - - Adhesive
ECP 697/120F

ECP 697/120F

ECP 697/120F 41-3900-8.91

EURO TBAPS INDIA
500 -

RFQ

ECP 697/120F

Ficha técnica

Box - Last Time Buy Gasket - 0.340 (8.64mm) - 0.070 (1.78mm) Beryllium Copper, Stainless Steel - - Adhesive
4208PA51H01800

4208PA51H01800

GASKET FAB/FOAM 10X457.2MM RECT

Laird Technologies EMI
2,347 -

RFQ

4208PA51H01800

Ficha técnica

Bulk 51H Active Fabric Over Foam Rectangle 0.394 (10.00mm) 18.000 (457.20mm) 0.039 (1.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
4245PA51H01800

4245PA51H01800

GASKT FABRIC/FOAM 3X457.2MM RECT

Laird Technologies EMI
3,036 -

RFQ

4245PA51H01800

Ficha técnica

Bulk 51H Active Fabric Over Foam Rectangle 0.118 (3.00mm) 18.000 (457.20mm) 0.039 (1.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
4202PA51H01800

4202PA51H01800

GSKT FAB/FOAM 6.4X457.2MM DSHAPE

Laird Technologies EMI
2,498 -

RFQ

4202PA51H01800

Ficha técnica

Bulk 51H Active Fabric Over Foam D-Shape 0.252 (6.40mm) 18.000 (457.20mm) 0.118 (3.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
10-04-1687-6502

10-04-1687-6502

CHO-SEAL 6502 NI/AL 0.070 1'

Parker Chomerics
2,509 -

RFQ

10-04-1687-6502

Ficha técnica

Spool - Active Gasket Round 0.070 (1.78mm) 12.000 (304.80mm) - Conductive Elastomer Nickel - Non-Conductive Adhesive
3020505

3020505

GASKET FABRIC/FOAM 5MMX1M SQ

Würth Elektronik
2,658 -

RFQ

3020505

Ficha técnica

Tray WE-LT Active Fabric Over Foam Square 0.197 (5.00mm) 39.370 (1.00m) 0.197 (5.00mm) Polyurethane Foam, Rayon Paper - - Non-Conductive Adhesive
0077008102

0077008102

GASKET BECU 7.11X609.6MM

Laird Technologies EMI
3,784 -

RFQ

0077008102

Ficha técnica

Box No Snag Active Fingerstock - 0.280 (7.11mm) 23.976 (609.00mm) 0.110 (2.79mm) Beryllium Copper Nickel, Tin 299.99µin (7.62µm) Adhesive
0097064502

0097064502

FINGERSTCK BECU ALY 5.33X609.6MM

Laird Technologies EMI
2,929 -

RFQ

0097064502

Ficha técnica

Box Clip-On Active Fingerstock - 0.210 (5.33mm) 15.984 (406.00mm) 0.070 (1.78mm) Beryllium Copper Nickel, Tin 299.99µin (7.62µm) Clip
37-131-1013-02400

37-131-1013-02400

SOFT SHIELD 3700 EMI 1013 24

Parker Chomerics
2,994 -

RFQ

37-131-1013-02400

Ficha técnica

Bulk - Active Fabric Over Foam Rectangle 0.394 (10.00mm) 24.000 (609.60mm) 0.075 (1.91mm) Nickel-Copper Polyester (NI/CU) Nickel - Adhesive
3021717

3021717

WE-LT CONDUCTIVE SHIELDING GASKE

Würth Elektronik
3,274 -

RFQ

3021717

Ficha técnica

Bag WE-LT Active Fabric Over Foam Square 0.669 (17.00mm) 39.370 (1.00m) 0.669 (17.00mm) Polyurethane Foam, Rayon Paper - - Non-Conductive Adhesive
0097053702

0097053702

GASKET BECU 28.7X304.8MM

Laird Technologies EMI
3,486 -

RFQ

0097053702

Ficha técnica

Bulk All-Purpose Active Fingerstock - 1.130 (28.70mm) 12.008 (305.00mm) 0.410 (10.41mm) Beryllium Copper Nickel, Tin 299.99µin (7.62µm) Adhesive
4850-12-1212-0200

4850-12-1212-0200

SOFT SHIELD 4850 12X12 2MM

Parker Chomerics
2,956 -

RFQ

4850-12-1212-0200

Ficha técnica

Bulk SOFT-SHIELD® 4850 Active Conductive Foam Sheet 12.000 (304.80mm) 12.000 (304.80mm) 0.079 (2.00mm) Copper Silver - Adhesive
4850-12-1212-0300

4850-12-1212-0300

SOFT SHIELD 4850 12X12 3MM

Parker Chomerics
3,505 -

RFQ

4850-12-1212-0300

Ficha técnica

Bulk SOFT-SHIELD® 4850 Active Conductive Foam Sheet 12.000 (304.80mm) 12.000 (304.80mm) 0.118 (3.00mm) Copper Silver - Adhesive
4850-12-1212-0400

4850-12-1212-0400

SOFT SHIELD 4850 12X12 4MM

Parker Chomerics
3,862 -

RFQ

4850-12-1212-0400

Ficha técnica

Bulk SOFT-SHIELD® 4850 Active Conductive Foam Sheet 12.000 (304.80mm) 12.000 (304.80mm) 0.157 (4.00mm) - - - Adhesive
Total 4831 Record«Prev1... 2324252627282930...242Next»
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Producto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Usuario