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RFI y EMI: contactos, dedo y juntas
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | Shape | Width | Length | Height | Material | Plating | Plating-Thickness | AttachmentMethod |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
10-05-4308-S6305CHO-SEAL S6305 0.312X0.312 1' Parker Chomerics |
296 | - |
RFQ |
Ficha técnica |
Spool | - | Active | Gasket | D-Shape | 0.312 (7.92mm) | 12.000 (304.80mm) | 0.312 (7.92mm) | Conductive Elastomer | Nickel | - | - |
|
37-131-1022-02400SOFT SHIELD 3700 EMI 1022 24 Parker Chomerics |
153 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Fabric Over Foam | Rectangle | 0.394 (10.00mm) | 24.000 (609.60mm) | 0.105 (2.67mm) | Nickel-Copper Polyester (NI/CU) | Nickel | - | Adhesive |
|
0097055102FINGERSTOCK BECU 4X609.6MM Laird Technologies EMI |
198 | - |
RFQ |
Ficha técnica |
Bulk | Twist | Active | Fingerstock | - | 0.160 (4.06mm) | 23.976 (609.00mm) | 0.030 (0.76mm) | Beryllium Copper | Nickel, Tin | 299.99µin (7.62µm) | Adhesive |
|
3021213WE-LT CONDUCTIVE SHIELDING GASKE Würth Elektronik |
137 | - |
RFQ |
Ficha técnica |
Bag | WE-LT | Active | Fabric Over Foam | Rectangle | 0.472 (12.00mm) | 39.370 (1.00m) | 0.512 (13.00mm) | Polyurethane Foam, Rayon Paper | - | - | Non-Conductive Adhesive |
|
0097055117FINGERSTOCK BECU 4X609.6MM Laird Technologies EMI |
440 | - |
RFQ |
Ficha técnica |
Bulk | Twist | Active | Fingerstock | - | 0.160 (4.06mm) | 23.976 (609.00mm) | 0.030 (0.76mm) | Beryllium Copper | Tin | 299.99µin (7.62µm) | Adhesive |
|
81-01-14618-2000FINGERSTOCK 0.1X0.3X16 Parker Chomerics |
353 | - |
RFQ |
Ficha técnica |
Tube | - | Active | Fingerstock | - | 0.300 (7.62mm) | 15.984 (406.00mm) | 0.100 (2.54mm) | Beryllium Copper | Unplated | - | Non-Conductive Adhesive |
|
0077001402GASKET BECU ALLOY 15.24X609.6MM Laird Technologies EMI |
3,123 | - |
RFQ |
Ficha técnica |
Box | No Snag | Active | Fingerstock | - | 0.600 (15.24mm) | 23.976 (609.00mm) | 0.220 (5.59mm) | Beryllium Copper | Nickel, Tin | 299.99µin (7.62µm) | Adhesive |
|
0097065517FINGERSTOCK BECU 1.7X304.8MM Laird Technologies EMI |
261 | - |
RFQ |
Ficha técnica |
Bulk | Clip-On | Active | Fingerstock | - | 0.076 (1.93mm) | 12.008 (305.00mm) | 0.093 (2.36mm) | Beryllium Copper | Tin | 299.99µin (7.62µm) | Clip |
|
81-02-14308-2000FINGERSTOCK 0.22X0.6X16 Parker Chomerics |
108 | - |
RFQ |
Ficha técnica |
Tube | - | Active | Fingerstock | - | 0.600 (15.24mm) | 17.992 (457.00mm) | 0.220 (5.59mm) | Beryllium Copper | Unplated | - | Adhesive |
|
4572AB01K09600GASKET FAB/FOAM 10MMX2.44M RECT Laird Technologies EMI |
164 | - |
RFQ |
Ficha técnica |
Bulk | Shielding | Active | Fabric Over Foam | Rectangle | 0.394 (10.00mm) | 96.000 (2.44m) | 0.016 (0.40mm) | Polyurethane Foam, Nickel-Copper Polyester (NI/CU) | - | - | - |
|
55-45007FINGERSTOCK 0.03X0.23X24 Parker Chomerics |
279 | - |
RFQ |
Ficha técnica |
Tube | - | Active | - | - | - | - | - | - | - | - | - |
|
10094594-009RLF1.30MM HEIGHT UNIVERSAL CONTACT Amphenol ICC (FCI) |
3,365 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR),Cut Tape (CT) | - | Active | Shield Finger, Pre-Loaded | - | 0.059 (1.50mm) | 0.137 (3.48mm) | 0.051 (1.30mm) | Beryllium Copper Alloy | Gold | Flash | Solder |
|
10103955-009RLF1.80MM HEIGHT UNIVERSAL CONTACT Amphenol ICC (FCI) |
3,457 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR),Cut Tape (CT) | - | Active | Shield Finger, Pre-Loaded | - | 0.028 (0.70mm) | 0.134 (3.40mm) | 0.071 (1.80mm) | Beryllium Copper Alloy | Gold | Flash | Solder |
|
10104320-009RLF1.30MM HEIGHT UNIVERSAL CONTACT Amphenol ICC (FCI) |
3,190 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR),Cut Tape (CT) | - | Active | Shield Finger, Pre-Loaded | - | 0.043 (1.10mm) | 0.137 (3.48mm) | 0.051 (1.30mm) | Beryllium Copper Alloy | Gold | Flash | Solder |
|
10131144-001RLFANTENNA SPRING PACKAGED Amphenol ICC (FCI) |
3,580 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR),Cut Tape (CT) | - | Active | Fingerstock | Angled | 0.276 (7.00mm) | 0.453 (11.51mm) | 0.126 (3.20mm) | Copper Alloy | Gold | - | Solder |
|
BMI-C-002CONTACT RETAINER FOR BOARDSHIELD Laird Technologies EMI |
2,330 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR),Cut Tape (CT) | BMI-C | Active | Fingerstock | - | 0.394 (10.00mm) | 0.085 (2.17mm) | 0.100 (2.54mm) | Beryllium Copper | Gold | - | Solder |
|
10-04-1687-S6305CHO-SEAL S6305 NI/C 0.070 1' Parker Chomerics |
336 | - |
RFQ |
Ficha técnica |
Spool | - | Active | Gasket | Round | 0.070 (1.78mm) | 12.000 (304.80mm) | - | Conductive Elastomer | Nickel | - | Non-Conductive Adhesive |
|
10-04-2657-S6305CHO-SEAL S6305 NI/C 0.080 1' Parker Chomerics |
632 | - |
RFQ |
Ficha técnica |
Spool | - | Active | Gasket | Round | 0.080 (2.03mm) | 12.000 (304.80mm) | - | Conductive Elastomer | Nickel | - | Non-Conductive Adhesive |
|
19-04-28067-S6305CHO-SEAL S6305 NI/C 0.060 1' Parker Chomerics |
109 | - |
RFQ |
Ficha técnica |
Spool | - | Active | Gasket | Round | 0.060 (1.52mm) | 12.000 (304.80mm) | - | Conductive Elastomer | Nickel | - | Non-Conductive Adhesive |
|
10-04-2865-S6305CHO-SEAL S6305 NI/C 0.093 1' Parker Chomerics |
131 | - |
RFQ |
Ficha técnica |
Spool | - | Active | Gasket | Round | 0.093 (2.36mm) | 12.000 (304.80mm) | - | Conductive Elastomer | Nickel | - | Non-Conductive Adhesive |
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