Conectores rectangulares - Cabezales, Pines especiales

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus ConnectorType ContactType NumberofPositions Pitch NumberofRows RowSpacing MountingType Termination Features ContactFinish ContactFinishThickness
20-3625-11

20-3625-11

CONN HDR DIP FORK 20POS GOLD

Aries Electronics
3,566 -

RFQ

20-3625-11

Ficha técnica

Bulk 625 Active DIP, DIL - Header Forked 20 0.100 (2.54mm) 2 0.300 (7.62mm) Through Hole Solder - Gold 10.0µin (0.25µm)
28-8625-10

28-8625-10

CONN HDR DIP FORK 28POS TIN

Aries Electronics
2,265 -

RFQ

28-8625-10

Ficha técnica

Bulk 625 Active DIP, DIL - Header Forked 28 0.100 (2.54mm) 2 0.800 (20.32mm) Through Hole Solder - Tin 200.0µin (5.08µm)
08-6625-51

08-6625-51

CONN HDR DIP FORK 8POS GOLD

Aries Electronics
3,419 -

RFQ

08-6625-51

Ficha técnica

Bulk 625 Active DIP, DIL - Header Forked 8 0.100 (2.54mm) 2 0.600 (15.24mm) Through Hole Wire Wrap - Gold 10.0µin (0.25µm)
16-0625-11

16-0625-11

CONN HDR STRIP FORK 16POS GOLD

Aries Electronics
3,605 -

RFQ

16-0625-11

Ficha técnica

Bulk 0625 Active Header Strip Forked 16 0.100 (2.54mm) 1 - Through Hole Solder - Gold 10.0µin (0.25µm)
26-3625-10

26-3625-10

CONN HDR DIP FORK 26POS TIN

Aries Electronics
2,020 -

RFQ

26-3625-10

Ficha técnica

Bulk 625 Active DIP, DIL - Header Forked 26 0.100 (2.54mm) 2 0.300 (7.62mm) Through Hole Solder - Tin 200.0µin (5.08µm)
32-3625-20

32-3625-20

CONN HDR DIP POST 32POS TIN

Aries Electronics
2,415 -

RFQ

32-3625-20

Ficha técnica

Bulk 625 Active DIP, DIL - Header Post 32 0.100 (2.54mm) 2 0.300 (7.62mm) Through Hole Solder - Tin 200.0µin (5.08µm)
36-6625-20

36-6625-20

CONN HDR DIP POST 36POS TIN

Aries Electronics
2,324 -

RFQ

36-6625-20

Ficha técnica

Bulk 625 Active DIP, DIL - Header Post 36 0.100 (2.54mm) 2 0.600 (15.24mm) Through Hole Solder - Tin 200.0µin (5.08µm)
32-6625-70

32-6625-70

CONN HDR DIP POST 32POS TIN

Aries Electronics
2,377 -

RFQ

32-6625-70

Ficha técnica

Bulk 625 Active DIP, DIL - Header Post 32 0.100 (2.54mm) 2 0.600 (15.24mm) Through Hole Solder - Tin 200.0µin (5.08µm)
18-0625-11

18-0625-11

CONN HDR STRIP FORK 18POS GOLD

Aries Electronics
2,912 -

RFQ

18-0625-11

Ficha técnica

Bulk 0625 Active Header Strip Forked 18 0.100 (2.54mm) 1 - Through Hole Solder - Gold 10.0µin (0.25µm)
18-6625-11

18-6625-11

CONN HDR DIP FORK 18POS GOLD

Aries Electronics
3,429 -

RFQ

18-6625-11

Ficha técnica

Bulk 625 Active DIP, DIL - Header Forked 18 0.100 (2.54mm) 2 0.600 (15.24mm) Through Hole Solder - Gold 10.0µin (0.25µm)
24-3625-10

24-3625-10

CONN HDR DIP FORK 24POS TIN

Aries Electronics
3,757 -

RFQ

24-3625-10

Ficha técnica

Bulk 625 Active DIP, DIL - Header Forked 24 0.100 (2.54mm) 2 0.300 (7.62mm) Through Hole Solder - Tin 200.0µin (5.08µm)
20-6625-11

20-6625-11

CONN HDR DIP FORK 20POS GOLD

Aries Electronics
3,558 -

RFQ

20-6625-11

Ficha técnica

Bulk 625 Active DIP, DIL - Header Forked 20 0.100 (2.54mm) 2 0.600 (15.24mm) Through Hole Solder - Gold 10.0µin (0.25µm)
17-0625-31

17-0625-31

CONN HDR STRIP SOLDER 17POS GOLD

Aries Electronics
2,520 -

RFQ

17-0625-31

Ficha técnica

Bulk 0625 Active Header Strip Solder Cup 17 0.100 (2.54mm) 1 - Through Hole Solder - Gold 10.0µin (0.25µm)
20-3625-71

20-3625-71

CONN HDR DIP POST 20POS GOLD

Aries Electronics
3,927 -

RFQ

20-3625-71

Ficha técnica

Bulk 625 Active DIP, DIL - Header Post 20 0.100 (2.54mm) 2 0.300 (7.62mm) Through Hole Solder - Gold 10.0µin (0.25µm)
14-0625-71

14-0625-71

CONN HDR STRIP POST 14POS GOLD

Aries Electronics
2,761 -

RFQ

14-0625-71

Ficha técnica

Bulk 0625 Active Header Strip Post 14 0.100 (2.54mm) 1 - Through Hole Solder - Gold 10.0µin (0.25µm)
28-3625-21

28-3625-21

CONN HDR DIP POST 28POS GOLD

Aries Electronics
3,775 -

RFQ

28-3625-21

Ficha técnica

Bulk 625 Active DIP, DIL - Header Post 28 0.100 (2.54mm) 2 0.300 (7.62mm) Through Hole Solder - Gold 10.0µin (0.25µm)
28-6625-21

28-6625-21

CONN HDR DIP POST 28POS GOLD

Aries Electronics
2,839 -

RFQ

28-6625-21

Ficha técnica

Bulk 625 Active DIP, DIL - Header Post 28 0.100 (2.54mm) 2 0.600 (15.24mm) Through Hole Solder - Gold 10.0µin (0.25µm)
30-6625-10

30-6625-10

CONN HDR DIP FORK 30POS TIN

Aries Electronics
2,872 -

RFQ

30-6625-10

Ficha técnica

Bulk 625 Active DIP, DIL - Header Forked 30 0.100 (2.54mm) 2 0.600 (15.24mm) Through Hole Solder - Tin 200.0µin (5.08µm)
32-9625-70

32-9625-70

CONN HDR DIP POST 32POS TIN

Aries Electronics
3,466 -

RFQ

32-9625-70

Ficha técnica

Bulk 625 Active DIP, DIL - Header Post 32 0.100 (2.54mm) 2 0.900 (22.86mm) Through Hole Solder - Tin 200.0µin (5.08µm)
32-3625-70

32-3625-70

CONN HDR DIP POST 32POS TIN

Aries Electronics
3,532 -

RFQ

32-3625-70

Ficha técnica

Bulk 625 Active DIP, DIL - Header Post 32 0.100 (2.54mm) 2 0.300 (7.62mm) Through Hole Solder - Tin 200.0µin (5.08µm)
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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