Conectores rectangulares - Cabezales, Receptáculos, Conectores hembra

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
CLP-140-02-S-D-TR

CLP-140-02-S-D-TR

CONN RCPT 80POS 0.05 GOLD SMD

Samtec Inc.
3,532 -

RFQ

CLP-140-02-S-D-TR

Ficha técnica

Tape & Reel (TR) CLP Active Receptacle Female Socket Board to Board 80 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Tin - -
CLP-136-02-L-D-PA-TR

CLP-136-02-L-D-PA-TR

CONN RCPT 72POS 0.05 GOLD SMD

Samtec Inc.
2,550 -

RFQ

CLP-136-02-L-D-PA-TR

Ficha técnica

Tape & Reel (TR) CLP Active Receptacle Female Socket Board to Board 72 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Tin - -
CLP-145-02-L-D-A-P-TR

CLP-145-02-L-D-A-P-TR

CONN RCPT 90POS 0.05 GOLD SMD

Samtec Inc.
2,465 -

RFQ

CLP-145-02-L-D-A-P-TR

Ficha técnica

Tape & Reel (TR) CLP Active Receptacle Female Socket Board to Board 90 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Tin - -
MLE-131-01-G-DV-A-P-TR

MLE-131-01-G-DV-A-P-TR

1MM MICRO STRIPS

Samtec Inc.
2,673 -

RFQ

Tape & Reel (TR) Tiger Eye™ MLE Active Receptacle Female Socket Board to Board 62 All 0.039 (1.00mm) 2 0.039 (1.00mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.130 (3.30mm) - -55°C ~ 125°C - - - -
RSM-125-02-L-D-TR

RSM-125-02-L-D-TR

CONN RCPT 50POS 0.05 GOLD SMD

Samtec Inc.
3,838 -

RFQ

RSM-125-02-L-D-TR

Ficha técnica

Tape & Reel (TR) RSM Active Receptacle Female Socket Board to Board 50 All 0.050 (1.27mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.240 (6.10mm) - -55°C ~ 125°C UL94 V-0 Tin - -
FHP-13-02-T-S

FHP-13-02-T-S

CONN RCPT 13POS 0.156 TIN SMD

Samtec Inc.
3,275 -

RFQ

FHP-13-02-T-S

Ficha técnica

Tube FHP Active Receptacle Female Socket Board to Board 13 All 0.156 (3.96mm) 1 - Surface Mount Solder Push-Pull Tin - Black 0.368 (9.35mm) - -55°C ~ 105°C - Tin - -
CES-119-01-L-D

CES-119-01-L-D

CONN RCPT 38POS 0.1 GOLD PCB

Samtec Inc.
2,860 -

RFQ

CES-119-01-L-D

Ficha técnica

Tube CES Active Receptacle Female Socket Board to Board 38 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.200 (5.08mm) 0.128 (3.25mm) -55°C ~ 125°C UL94 V-0 Tin - -
CLE-133-01-G-DV-P-TR

CLE-133-01-G-DV-P-TR

CONN RCPT 66POS 0.031 GOLD SMD

Samtec Inc.
3,599 -

RFQ

CLE-133-01-G-DV-P-TR

Ficha técnica

Tape & Reel (TR) CLE Active Receptacle, Pass Through Female Socket Board to Board 66 All 0.031 (0.80mm) 2 0.047 (1.20mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.130 (3.30mm) - -55°C ~ 125°C UL94 V-0 Gold - -
CLP-111-02-S-D-P

CLP-111-02-S-D-P

CONN RCPT 22POS 0.05 GOLD SMD

Samtec Inc.
2,578 -

RFQ

CLP-111-02-S-D-P

Ficha técnica

Tube CLP Active Receptacle Female Socket Board to Board 22 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Tin - -
CLT-130-02-G-D-BE-A-TR

CLT-130-02-G-D-BE-A-TR

CONN RCPT 60POS 0.079 GOLD SMD

Samtec Inc.
2,091 -

RFQ

CLT-130-02-G-D-BE-A-TR

Ficha técnica

Tape & Reel (TR) CLT Active Receptacle, Bottom Entry Female Socket Board to Board 60 All 0.079 (2.00mm) 2 0.079 (2.00mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.083 (2.10mm) - -55°C ~ 125°C UL94 V-0 Gold - -
SFMH-120-02-L-D-TR

SFMH-120-02-L-D-TR

.050'' X .050 SOCKET STRIP ASSEM

Samtec Inc.
2,722 -

RFQ

SFMH-120-02-L-D-TR

Ficha técnica

Tape & Reel (TR) Tiger Eye™ SFMH Active Receptacle Female Socket Board to Board 40 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount, Right Angle Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.135 (3.43mm) - -55°C ~ 125°C UL94 V-0 Gold - -
CLP-150-02-G-D-BE-PA

CLP-150-02-G-D-BE-PA

CONN RCPT 100POS 0.05 GOLD SMD

Samtec Inc.
3,370 -

RFQ

CLP-150-02-G-D-BE-PA

Ficha técnica

Tray CLP Active Receptacle, Bottom Entry Female Socket Board to Board 100 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Gold - -
ESQ-132-23-T-S

ESQ-132-23-T-S

CONN SOCKET 32POS 0.1 TIN PCB

Samtec Inc.
3,606 -

RFQ

ESQ-132-23-T-S

Ficha técnica

Tube ESQ Active Elevated Socket Forked Board to Board 32 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.535 (13.60mm) 0.190 (4.83mm) -55°C ~ 105°C UL94 V-0 Tin - -
ESW-136-44-T-S

ESW-136-44-T-S

CONN SOCKET 36POS 0.1 TIN PCB

Samtec Inc.
3,537 -

RFQ

ESW-136-44-T-S

Ficha técnica

Tube ESW Active Elevated Socket Forked Board to Board 36 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.735 (18.67mm) 0.180 (4.57mm) -55°C ~ 105°C UL94 V-0 Tin - -
SLW-147-01-G-S

SLW-147-01-G-S

CONN RCPT 47POS 0.1 GOLD PCB

Samtec Inc.
2,865 -

RFQ

SLW-147-01-G-S

Ficha técnica

Bulk SLW Active Receptacle Forked Board to Board 47 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.180 (4.57mm) 0.115 (2.92mm) -55°C ~ 125°C - Gold 6.09mm -
SSQ-122-02-S-D

SSQ-122-02-S-D

CONN RCPT 44POS 0.1 GOLD PCB

Samtec Inc.
3,715 -

RFQ

SSQ-122-02-S-D

Ficha técnica

Bulk SSQ Active Receptacle Forked Board to Board or Cable 44 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.335 (8.51mm) 0.194 (4.93mm) -55°C ~ 125°C UL94 V-0 Tin - -
BSW-112-04-G-D

BSW-112-04-G-D

CONN RCPT 24POS 0.1 GOLD PCB

Samtec Inc.
3,832 -

RFQ

BSW-112-04-G-D

Ficha técnica

Bulk BSW Active Receptacle, Breakaway Female Socket Board to Board 24 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole, Bottom Mount Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.350 (8.89mm) 0.165 (4.19mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-117-24-T-D

ESQ-117-24-T-D

CONN SOCKET 34POS 0.1 TIN PCB

Samtec Inc.
2,897 -

RFQ

ESQ-117-24-T-D

Ficha técnica

Tube ESQ Active Elevated Socket Forked Board to Board 34 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.535 (13.60mm) 0.380 (9.65mm) -55°C ~ 105°C UL94 V-0 Tin - -
ESQT-123-03-F-S-400

ESQT-123-03-F-S-400

CONN SOCKET 23POS 0.079 GOLD PCB

Samtec Inc.
2,990 -

RFQ

Tube ESQT Active Elevated Socket Forked Board to Board or Cable 23 All 0.079 (2.00mm) 1 - Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.400 (10.16mm) 0.058 (1.47mm) -55°C ~ 125°C UL94 V-0 Tin - -
SSM-105-S-DH-LC

SSM-105-S-DH-LC

CONN RCPT 10POS 0.1 GOLD SMD R/A

Samtec Inc.
2,256 -

RFQ

Tube SSM Active Receptacle Female Socket Board to Board or Cable 10 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount, Right Angle Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.225 (5.72mm) - -55°C ~ 125°C - Tin - -
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Producto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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