Conectores rectangulares - Cabezales, Receptáculos, Conectores hembra

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
ESQT-112-03-F-D-309

ESQT-112-03-F-D-309

CONN SOCKET 24POS 0.079 GOLD PCB

Samtec Inc.
2,109 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 24 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.309 (7.85mm) 0.149 (3.78mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-112-03-F-D-311

ESQT-112-03-F-D-311

CONN SOCKET 24POS 0.079 GOLD PCB

Samtec Inc.
3,108 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 24 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.311 (7.90mm) 0.147 (3.73mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-112-03-F-D-310

ESQT-112-03-F-D-310

CONN SOCKET 24POS 0.079 GOLD PCB

Samtec Inc.
3,215 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 24 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.310 (7.87mm) 0.148 (3.76mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-112-03-F-D-313

ESQT-112-03-F-D-313

CONN SOCKET 24POS 0.079 GOLD PCB

Samtec Inc.
2,749 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 24 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.313 (7.95mm) 0.145 (3.68mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-112-03-F-D-315

ESQT-112-03-F-D-315

CONN SOCKET 24POS 0.079 GOLD PCB

Samtec Inc.
2,101 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 24 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.315 (8.00mm) 0.143 (3.63mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-112-03-F-D-335

ESQT-112-03-F-D-335

CONN SOCKET 24POS 0.079 GOLD PCB

Samtec Inc.
2,256 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 24 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.335 (8.51mm) 0.123 (3.12mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-112-03-F-D-338

ESQT-112-03-F-D-338

CONN SOCKET 24POS 0.079 GOLD PCB

Samtec Inc.
2,978 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 24 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.338 (8.59mm) 0.120 (3.05mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-112-03-F-D-350

ESQT-112-03-F-D-350

CONN SOCKET 24POS 0.079 GOLD PCB

Samtec Inc.
2,122 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 24 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.350 (8.89mm) 0.108 (2.75mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-112-03-F-D-354

ESQT-112-03-F-D-354

CONN SOCKET 24POS 0.079 GOLD PCB

Samtec Inc.
3,675 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 24 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.354 (9.00mm) 0.104 (2.64mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-112-03-F-D-355

ESQT-112-03-F-D-355

CONN SOCKET 24POS 0.079 GOLD PCB

Samtec Inc.
2,011 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 24 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.355 (9.02mm) 0.103 (2.62mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-112-03-F-D-370

ESQT-112-03-F-D-370

CONN SOCKET 24POS 0.079 GOLD PCB

Samtec Inc.
3,029 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 24 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.370 (9.40mm) 0.088 (2.23mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-112-03-F-D-375

ESQT-112-03-F-D-375

CONN SOCKET 24POS 0.079 GOLD PCB

Samtec Inc.
3,113 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 24 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.375 (9.53mm) 0.083 (2.11mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-112-03-F-D-379

ESQT-112-03-F-D-379

CONN SOCKET 24POS 0.079 GOLD PCB

Samtec Inc.
2,478 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 24 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.379 (9.63mm) 0.079 (2.00mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-112-03-F-D-380

ESQT-112-03-F-D-380

CONN SOCKET 24POS 0.079 GOLD PCB

Samtec Inc.
3,052 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 24 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.380 (9.65mm) 0.078 (1.98mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-112-03-F-D-383

ESQT-112-03-F-D-383

CONN SOCKET 24POS 0.079 GOLD PCB

Samtec Inc.
3,825 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 24 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.383 (9.73mm) 0.075 (1.91mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-112-03-F-D-408

ESQT-112-03-F-D-408

CONN SOCKET 24POS 0.079 GOLD PCB

Samtec Inc.
3,971 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 24 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.408 (10.36mm) 0.050 (1.27mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-112-03-FM-D-335

ESQT-112-03-FM-D-335

CONN SOCKET 24POS 0.079 GOLD PCB

Samtec Inc.
2,378 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 24 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.335 (8.51mm) 0.123 (3.12mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-115-02-LM-S-415-006

ESQT-115-02-LM-S-415-006

CONN SOCKET 15POS 0.079 GOLD PCB

Samtec Inc.
3,978 -

RFQ

Tube ESQT Active Elevated Socket Forked Board to Board or Cable 15 14 0.079 (2.00mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.415 (10.54mm) 0.435 (11.05mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-115-02-LM-S-540-006

ESQT-115-02-LM-S-540-006

CONN SOCKET 15POS 0.079 GOLD PCB

Samtec Inc.
2,754 -

RFQ

Tube ESQT Active Elevated Socket Forked Board to Board or Cable 15 14 0.079 (2.00mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.540 (13.72mm) 0.310 (7.87mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESW-109-69-L-D

ESW-109-69-L-D

CONN SOCKET 18POS 0.1 GOLD PCB

Samtec Inc.
3,838 -

RFQ

ESW-109-69-L-D

Ficha técnica

Bulk ESW Active Elevated Socket Forked Board to Board 18 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.735 (18.67mm) 0.180 (4.57mm) -55°C ~ 125°C UL94 V-0 Tin - -
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Producto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Usuario