Conectores rectangulares - Cabezales, Receptáculos, Conectores hembra

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
ESQT-105-02-M-D-535

ESQT-105-02-M-D-535

CONN SOCKET 10POS 0.079 GOLD PCB

Samtec Inc.
2,965 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 10 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.535 (13.60mm) 0.315 (8.00mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-105-02-M-D-550

ESQT-105-02-M-D-550

CONN SOCKET 10POS 0.079 GOLD PCB

Samtec Inc.
3,052 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 10 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.550 (13.97mm) 0.300 (7.62mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-105-02-M-D-551

ESQT-105-02-M-D-551

CONN SOCKET 10POS 0.079 GOLD PCB

Samtec Inc.
2,364 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 10 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.551 (14.00mm) 0.299 (7.60mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-105-02-M-D-600

ESQT-105-02-M-D-600

CONN SOCKET 10POS 0.079 GOLD PCB

Samtec Inc.
2,663 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 10 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.600 (15.24mm) 0.250 (6.35mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-105-02-M-D-625

ESQT-105-02-M-D-625

CONN SOCKET 10POS 0.079 GOLD PCB

Samtec Inc.
2,225 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 10 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.625 (15.88mm) 0.225 (5.72mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-105-02-M-D-635

ESQT-105-02-M-D-635

CONN SOCKET 10POS 0.079 GOLD PCB

Samtec Inc.
3,135 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 10 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.635 (16.13mm) 0.215 (5.46mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-105-02-M-D-690

ESQT-105-02-M-D-690

CONN SOCKET 10POS 0.079 GOLD PCB

Samtec Inc.
3,000 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 10 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.690 (17.52mm) 0.160 (4.06mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-105-02-M-D-700

ESQT-105-02-M-D-700

CONN SOCKET 10POS 0.079 GOLD PCB

Samtec Inc.
3,596 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 10 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.700 (17.78mm) 0.150 (3.81mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-105-02-M-D-720

ESQT-105-02-M-D-720

CONN SOCKET 10POS 0.079 GOLD PCB

Samtec Inc.
2,982 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 10 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.720 (18.30mm) 0.130 (3.30mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-105-02-M-D-735

ESQT-105-02-M-D-735

CONN SOCKET 10POS 0.079 GOLD PCB

Samtec Inc.
2,118 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 10 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.735 (18.67mm) 0.115 (2.92mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-105-02-M-D-750

ESQT-105-02-M-D-750

CONN SOCKET 10POS 0.079 GOLD PCB

Samtec Inc.
3,646 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 10 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.750 (19.05mm) 0.100 (2.54mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-105-02-M-D-800

ESQT-105-02-M-D-800

CONN SOCKET 10POS 0.079 GOLD PCB

Samtec Inc.
3,875 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 10 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.800 (20.32mm) 0.050 (1.27mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-105-02-MM-D-360

ESQT-105-02-MM-D-360

CONN SOCKET 10POS 0.079 GOLD PCB

Samtec Inc.
2,438 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 10 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.360 (9.14mm) 0.490 (12.45mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-105-02-MM-D-700

ESQT-105-02-MM-D-700

CONN SOCKET 10POS 0.079 GOLD PCB

Samtec Inc.
2,566 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 10 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.700 (17.78mm) 0.150 (3.81mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESS-117-TT-23

ESS-117-TT-23

CONN SOCKET 17POS 0.1 TIN PCB

Samtec Inc.
3,514 -

RFQ

Bulk ESS Active Elevated Socket Female Socket Board to Board 17 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.300 (7.62mm) 0.123 (3.12mm) -55°C ~ 125°C UL94 V-0 Tin - -
SSM-105-S-DV-BE-M

SSM-105-S-DV-BE-M

CONN RCPT 10POS 0.1 GOLD SMD

Samtec Inc.
3,874 -

RFQ

Bulk SSM Active Receptacle, Bottom Entry Female Socket Board to Board or Cable 10 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.290 (7.37mm) - -55°C ~ 125°C - Tin - -
SSM-109-S-SH-LC

SSM-109-S-SH-LC

CONN RCPT 9POS 0.1 GOLD SMD R/A

Samtec Inc.
2,828 -

RFQ

Bulk SSM Active Receptacle Female Socket Board to Board or Cable 9 All 0.100 (2.54mm) 1 - Surface Mount, Right Angle Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.125 (3.18mm) - -55°C ~ 125°C - Tin - -
SSW-114-01-T-T

SSW-114-01-T-T

CONN RCPT 42POS 0.1 TIN PCB

Samtec Inc.
2,516 -

RFQ

Bulk SSW Active Receptacle Forked Board to Board or Cable 42 All 0.100 (2.54mm) 3 0.100 (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.335 (8.51mm) 0.104 (2.64mm) -55°C ~ 105°C UL94 V-0 Tin - -
SSW-116-24-G-S

SSW-116-24-G-S

CONN RCPT 16POS 0.1 GOLD PCB

Samtec Inc.
2,095 -

RFQ

Bulk SSW Active Receptacle Forked Board to Board or Cable 16 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.335 (8.51mm) 0.584 (14.83mm) -55°C ~ 125°C UL94 V-0 Gold - -
SSW-118-21-S-S-LL

SSW-118-21-S-S-LL

CONN RCPT 18POS 0.1 GOLD PCB

Samtec Inc.
2,929 -

RFQ

Bulk SSW Active Receptacle Forked Board to Board or Cable 18 All 0.100 (2.54mm) 1 - Through Hole Kinked Pin, Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.335 (8.51mm) 0.104 (2.64mm) -55°C ~ 125°C UL94 V-0 Tin - -
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Producto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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