Conectores rectangulares - Cabezales, Receptáculos, Conectores hembra

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
316-83-154-41-007101

316-83-154-41-007101

CONN SOCKET 54POS 0.1 GOLD PCB

Preci-Dip
3,651 -

RFQ

316-83-154-41-007101

Ficha técnica

Bulk 316 Active Socket Female Socket Board to Board 54 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.394 (10.00mm) 0.126 (3.20mm) -55°C ~ 125°C UL94 V-0 Tin - -
416-83-254-41-007101

416-83-254-41-007101

CONN SOCKET 54POS 0.1 GOLD PCB

Preci-Dip
3,778 -

RFQ

416-83-254-41-007101

Ficha técnica

Bulk 416 Active Socket Female Socket Board to Board 54 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.394 (10.00mm) 0.126 (3.20mm) -55°C ~ 125°C UL94 V-0 Tin - -
831-83-033-64-001101

831-83-033-64-001101

CONN SOCKET 33POS 0.079 GOLD PCB

Preci-Dip
3,938 -

RFQ

831-83-033-64-001101

Ficha técnica

Bulk 831 Active Socket Female Socket Board to Board 33 All 0.079 (2.00mm) 1 - Through Hole Press-Fit, Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.165 (4.20mm) 0.098 (2.50mm) -55°C ~ 125°C UL94 V-0 Tin - -
CLT-114-02-L-D-BE-A-P

CLT-114-02-L-D-BE-A-P

CONN RCPT 28POS 0.079 GOLD SMD

Samtec Inc.
2,357 -

RFQ

CLT-114-02-L-D-BE-A-P

Ficha técnica

Tube CLT Active Receptacle, Bottom Entry Female Socket Board to Board 28 All 0.079 (2.00mm) 2 0.079 (2.00mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.083 (2.10mm) - -55°C ~ 125°C UL94 V-0 Tin - -
346-83-153-41-035101

346-83-153-41-035101

CONN SOCKET 53POS 0.1 GOLD PCB

Preci-Dip
3,970 -

RFQ

346-83-153-41-035101

Ficha técnica

Bulk 346 Active Socket Female Socket Board to Board 53 All 0.100 (2.54mm) 1 - Through Hole Press-Fit, Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.173 (4.40mm) 0.150 (3.81mm) -55°C ~ 125°C UL94 V-0 Tin - -
346-83-153-41-036101

346-83-153-41-036101

CONN SOCKET 53POS 0.1 GOLD PCB

Preci-Dip
2,780 -

RFQ

346-83-153-41-036101

Ficha técnica

Bulk 346 Active Socket Female Socket Board to Board 53 All 0.100 (2.54mm) 1 - Through Hole Press-Fit, Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.116 (2.95mm) 0.110 (2.79mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-119-23-T-D

ESQ-119-23-T-D

CONN SOCKET 38POS 0.1 TIN PCB

Samtec Inc.
3,990 -

RFQ

ESQ-119-23-T-D

Ficha técnica

Tube ESQ Active Elevated Socket Forked Board to Board 38 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.535 (13.60mm) 0.190 (4.83mm) -55°C ~ 105°C UL94 V-0 Tin - -
CLE-121-01-G-DV

CLE-121-01-G-DV

CONN RCPT 42POS 0.031 GOLD SMD

Samtec Inc.
3,609 -

RFQ

CLE-121-01-G-DV

Ficha técnica

Bulk CLE Active Receptacle, Pass Through Female Socket Board to Board 42 All 0.031 (0.80mm) 2 0.047 (1.20mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.130 (3.30mm) - -55°C ~ 125°C UL94 V-0 Gold - -
ESQT-108-02-M-D-640

ESQT-108-02-M-D-640

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc.
2,077 -

RFQ

ESQT-108-02-M-D-640

Ficha técnica

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.640 (16.26mm) 0.210 (5.33mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESD-104-G-05

ESD-104-G-05

CONN SOCKET 8POS 0.1 GOLD PCB

Samtec Inc.
3,556 -

RFQ

Bulk ESD Active Elevated Socket Female Socket Board to Board 8 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.500 (12.70mm) 0.165 (4.19mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQ-118-14-T-D

ESQ-118-14-T-D

CONN SOCKET 36POS 0.1 TIN PCB

Samtec Inc.
3,548 -

RFQ

ESQ-118-14-T-D

Ficha técnica

Tube ESQ Active Elevated Socket Forked Board to Board 36 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.435 (11.05mm) 0.480 (12.19mm) -55°C ~ 105°C UL94 V-0 Tin - -
ESQT-108-02-M-D-408

ESQT-108-02-M-D-408

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc.
3,073 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.408 (10.36mm) 0.442 (11.23mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-M-D-450

ESQT-108-02-M-D-450

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc.
2,723 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.450 (11.43mm) 0.400 (10.16mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-M-D-709

ESQT-108-02-M-D-709

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc.
2,393 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.709 (18.00mm) 0.141 (3.58mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-M-D-760

ESQT-108-02-M-D-760

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc.
3,798 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.760 (19.30mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-M-D-790

ESQT-108-02-M-D-790

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc.
3,811 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.790 (20.07mm) 0.060 (1.52mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-104-02-M-T-750

ESQT-104-02-M-T-750

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc.
3,660 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 3 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.750 (19.05mm) 0.100 (2.54mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-M-D-310

ESQT-108-02-M-D-310

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc.
2,867 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.310 (7.87mm) 0.540 (13.72mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-M-D-320

ESQT-108-02-M-D-320

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc.
3,355 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.320 (8.13mm) 0.530 (13.46mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-M-D-368

ESQT-108-02-M-D-368

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc.
2,174 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.368 (9.35mm) 0.482 (12.24mm) -55°C ~ 125°C UL94 V-0 Tin - -
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Producto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Usuario

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