Conectores rectangulares - Cabezales, Receptáculos, Conectores hembra

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
ESQT-106-03-S-D-310

ESQT-106-03-S-D-310

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc.
3,780 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.310 (7.87mm) 0.148 (3.76mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-03-F-D-310

ESQT-113-03-F-D-310

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
2,138 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.310 (7.87mm) 0.148 (3.76mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-03-F-D-315

ESQT-113-03-F-D-315

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
3,351 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.315 (8.00mm) 0.143 (3.63mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-03-F-D-320

ESQT-113-03-F-D-320

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
2,341 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.320 (8.13mm) 0.138 (3.50mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-03-F-D-321

ESQT-113-03-F-D-321

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
3,651 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.321 (8.15mm) 0.137 (3.48mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-03-F-D-335

ESQT-113-03-F-D-335

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
3,233 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.335 (8.51mm) 0.123 (3.12mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-03-F-D-338

ESQT-113-03-F-D-338

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
3,212 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.338 (8.59mm) 0.120 (3.05mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-03-F-D-340

ESQT-113-03-F-D-340

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
2,361 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.340 (8.64mm) 0.118 (3.00mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-03-F-D-346

ESQT-113-03-F-D-346

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
2,170 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.346 (8.80mm) 0.112 (2.84mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-03-F-D-350

ESQT-113-03-F-D-350

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
3,767 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.350 (8.89mm) 0.108 (2.75mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-03-F-D-354

ESQT-113-03-F-D-354

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
2,323 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.354 (9.00mm) 0.104 (2.64mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-03-F-D-355

ESQT-113-03-F-D-355

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
2,314 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.355 (9.02mm) 0.103 (2.62mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-03-F-D-358

ESQT-113-03-F-D-358

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
2,600 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.358 (9.10mm) 0.100 (2.54mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-03-F-D-365

ESQT-113-03-F-D-365

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
2,060 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.365 (9.27mm) 0.093 (2.35mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-03-F-D-368

ESQT-113-03-F-D-368

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
2,501 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.368 (9.35mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-03-F-D-375

ESQT-113-03-F-D-375

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
2,322 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.375 (9.53mm) 0.083 (2.11mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-03-F-D-380

ESQT-113-03-F-D-380

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
2,110 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.380 (9.65mm) 0.078 (1.98mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-03-F-D-408

ESQT-113-03-F-D-408

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
3,584 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.408 (10.36mm) 0.050 (1.27mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-03-FM-D-310

ESQT-113-03-FM-D-310

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
3,587 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.310 (7.87mm) 0.148 (3.76mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-114-03-M-S-310

ESQT-114-03-M-S-310

CONN SOCKET 14POS 0.079 GOLD PCB

Samtec Inc.
3,186 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 14 All 0.079 (2.00mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.310 (7.87mm) 0.148 (3.76mm) -55°C ~ 125°C UL94 V-0 Tin - -
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Producto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Usuario