Conectores rectangulares - Cabezales, Pines macho

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus ConnectorType ContactType Pitch-Mating NumberofPositions NumberofRows RowSpacing-Mating NumberofPositionsLoaded Style Shrouding MountingType Termination FasteningType ContactLength-Mating ContactLength-Post OverallContactLength InsulationHeight ContactShape ContactFinish-Mating ContactFinishThickness-Mating ContactFinish-Post ContactMaterial
TSW-107-14-G-D-006

TSW-107-14-G-D-006

CONN HEADER VERT 14POS 2.54MM

Samtec Inc.
8,937 -

RFQ

TSW-107-14-G-D-006

Ficha técnica

Bulk TSW Active Header Male Pin 0.100 (2.54mm) 14 2 0.100 (2.54mm) 13 Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.320 (8.13mm) 0.110 (2.79mm) 0.530 (13.46mm) 0.100 (2.54mm) Square Gold 10.0µin (0.25µm) Gold Phosphor Bronze
IPBT-103-H1-T-S-RA-K

IPBT-103-H1-T-S-RA-K

CONN HEADER R/A 3POS 4.2MM

Samtec Inc.
26,369 -

RFQ

IPBT-103-H1-T-S-RA-K

Ficha técnica

Tube Power Mate® IPBT Active Header Male Pin 0.165 (4.20mm) 3 1 - All Board to Board or Cable Shrouded - 4 Wall Through Hole, Right Angle Solder Locking Ramp 0.260 (6.60mm) 0.147 (3.73mm) - 0.259 (6.58mm) Square Tin - Tin Copper Alloy
FTSH-105-01-L-D

FTSH-105-01-L-D

CONN HEADER VERT 10POS 1.27MM

Samtec Inc.
8,338 -

RFQ

FTSH-105-01-L-D

Ficha técnica

Tube FTSH Active Header, Cuttable Male Pin 0.050 (1.27mm) 10 2 0.050 (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.120 (3.05mm) 0.090 (2.29mm) 0.309 (7.86mm) 0.099 (2.51mm) Square Gold 10.0µin (0.25µm) Tin Phosphor Bronze
TMM-105-01-G-D-SM

TMM-105-01-G-D-SM

CONN HEADER SMD 10POS 2MM

Samtec Inc.
540 -

RFQ

TMM-105-01-G-D-SM

Ficha técnica

Tube TMM Active Header Male Pin 0.079 (2.00mm) 10 2 0.079 (2.00mm) All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.126 (3.20mm) - - 0.059 (1.50mm) Square Gold 20.0µin (0.51µm) Gold Phosphor Bronze
T1M-02-F-SV-L-P

T1M-02-F-SV-L-P

CONN HEADER SMD 2POS 1MM

Samtec Inc.
3,322 -

RFQ

Tape & Reel (TR),Cut Tape (CT) Micro Mate™ T1M Active Header Male Pin 0.039 (1.00mm) 2 1 - All Board to Cable/Wire Shrouded - 4 Wall Surface Mount Solder Locking Ramp - - - 0.217 (5.51mm) Square Gold 3.00µin (0.076µm) Tin Phosphor Bronze
TSM-107-01-L-DV

TSM-107-01-L-DV

CONN HEADER SMD 14POS 2.54MM

Samtec Inc.
2,163 -

RFQ

TSM-107-01-L-DV

Ficha técnica

Tube TSM Active Header Male Pin 0.100 (2.54mm) 14 2 0.100 (2.54mm) All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.230 (5.84mm) - - 0.100 (2.54mm) Square Gold 10.0µin (0.25µm) Tin Phosphor Bronze
TMM-110-01-L-S-SM

TMM-110-01-L-S-SM

CONN HEADER SMD 10POS 2MM

Samtec Inc.
1,109 -

RFQ

TMM-110-01-L-S-SM

Ficha técnica

Tube TMM Active Header Male Pin 0.079 (2.00mm) 10 1 - All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.126 (3.20mm) - - 0.059 (1.50mm) Square Gold 10.0µin (0.25µm) Tin Phosphor Bronze
TSM-106-01-L-DV-P

TSM-106-01-L-DV-P

CONN HEADER SMD 12POS 2.54MM

Samtec Inc.
1,945 -

RFQ

TSM-106-01-L-DV-P

Ficha técnica

Tube TSM Active Header Male Pin 0.100 (2.54mm) 12 2 0.100 (2.54mm) All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.230 (5.84mm) - - 0.100 (2.54mm) Square Gold 10.0µin (0.25µm) Tin Phosphor Bronze
T1M-03-F-SV-L-P

T1M-03-F-SV-L-P

CONN HEADER SMD 3POS 1MM

Samtec Inc.
2,102 -

RFQ

Tape & Reel (TR),Cut Tape (CT) Micro Mate™ T1M Active Header Male Pin 0.039 (1.00mm) 3 1 - All Board to Cable/Wire Shrouded - 4 Wall Surface Mount Solder Locking Ramp - - - 0.217 (5.51mm) Square Gold 3.00µin (0.076µm) Tin Phosphor Bronze
IPBT-103-H1-T-D-K

IPBT-103-H1-T-D-K

CONN HEADER VERT 6POS 4.2MM

Samtec Inc.
2,989 -

RFQ

IPBT-103-H1-T-D-K

Ficha técnica

Bulk Power Mate® IPBT Active Header Male Pin 0.165 (4.20mm) 6 2 0.165 (4.20mm) All Board to Board or Cable Shrouded - 4 Wall Through Hole Solder Locking Ramp 0.260 (6.60mm) 0.130 (3.30mm) 0.510 (12.95mm) 0.380 (9.65mm) Square Tin - Tin Copper Alloy
HTSW-108-07-G-D

HTSW-108-07-G-D

CONN HEADER VERT 16POS 2.54MM

Samtec Inc.
4,500 -

RFQ

HTSW-108-07-G-D

Ficha técnica

Bag HTSW Active Header Male Pin 0.100 (2.54mm) 16 2 0.100 (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.230 (5.84mm) 0.100 (2.54mm) 0.430 (10.92mm) 0.100 (2.54mm) Square Gold 10.0µin (0.25µm) Gold Phosphor Bronze
TMM-108-01-L-D-SM-P-TR

TMM-108-01-L-D-SM-P-TR

CONN HEADER SMD 16POS 2MM

Samtec Inc.
2,226 -

RFQ

TMM-108-01-L-D-SM-P-TR

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) TMM Active Header Male Pin 0.079 (2.00mm) 16 2 0.079 (2.00mm) All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.126 (3.20mm) - - 0.059 (1.50mm) Square Gold 10.0µin (0.25µm) Tin Phosphor Bronze
IPL1-102-01-F-S-K

IPL1-102-01-F-S-K

CONN HEADER VERT 2POS 2.54MM

Samtec Inc.
17,436 -

RFQ

IPL1-102-01-F-S-K

Ficha técnica

Tube Mini Mate® IPL1 Active Header Male Pin 0.100 (2.54mm) 2 1 - All Board to Cable/Wire Shrouded - 4 Wall Through Hole Solder Locking Ramp 0.215 (5.46mm) 0.120 (3.05mm) - 0.320 (8.13mm) Square Gold 3.00µin (0.076µm) Tin Phosphor Bronze
FTSH-105-01-F-DV-007

FTSH-105-01-F-DV-007

CONN HEADER SMD 10POS 1.27MM

Samtec Inc.
1,017 -

RFQ

FTSH-105-01-F-DV-007

Ficha técnica

Tube FTSH Active Header, Cuttable Male Pin 0.050 (1.27mm) 10 2 0.050 (1.27mm) 9 Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.120 (3.05mm) - - 0.099 (2.51mm) Square Gold 3.00µin (0.076µm) Tin Phosphor Bronze
TST-105-01-F-D

TST-105-01-F-D

CONN HEADER VERT 10POS 2.54MM

Samtec Inc.
1,053 -

RFQ

Bulk Flex Stack, TST Active Header Male Pin 0.100 (2.54mm) 10 2 0.100 (2.54mm) All Board to Cable/Wire Shrouded - 4 Wall Through Hole Solder Push-Pull 0.250 (6.35mm) 0.115 (2.92mm) 0.480 (12.19mm) 0.350 (8.89mm) Square Gold Flash Tin Phosphor Bronze
FTS-110-01-L-DV-P-TR

FTS-110-01-L-DV-P-TR

CONN HEADER SMD 20POS 1.27MM

Samtec Inc.
3,356 -

RFQ

FTS-110-01-L-DV-P-TR

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) FTS Active Header, Cuttable Male Pin 0.050 (1.27mm) 20 2 0.050 (1.27mm) All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.120 (3.05mm) - - 0.034 (0.86mm) Square Gold 10.0µin (0.25µm) Tin Phosphor Bronze
TSW-113-07-F-D

TSW-113-07-F-D

CONN HEADER VERT 26POS 2.54MM

Samtec Inc.
5,717 -

RFQ

TSW-113-07-F-D

Ficha técnica

Bag TSW Active Header Male Pin 0.100 (2.54mm) 26 2 0.100 (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.230 (5.84mm) 0.100 (2.54mm) 0.430 (10.92mm) 0.100 (2.54mm) Square Gold 3.00µin (0.076µm) Tin Phosphor Bronze
IPBT-103-H1-T-D-GP

IPBT-103-H1-T-D-GP

CONN HEADER VERT 6POS 4.2MM

Samtec Inc.
5,789 -

RFQ

IPBT-103-H1-T-D-GP

Ficha técnica

Bulk Power Mate® IPBT Active Header Male Pin 0.165 (4.20mm) 6 2 0.165 (4.20mm) All Board to Board or Cable Shrouded - 4 Wall Through Hole Solder Locking Ramp 0.260 (6.60mm) 0.130 (3.30mm) 0.510 (12.95mm) 0.380 (9.65mm) Square Tin - Tin Copper Alloy
TSM-105-01-L-DH-A

TSM-105-01-L-DH-A

CONN HEADER SMD R/A 10POS 2.54MM

Samtec Inc.
4,657 -

RFQ

TSM-105-01-L-DH-A

Ficha técnica

Tube TSM Active Header Male Pin 0.100 (2.54mm) 10 2 0.100 (2.54mm) All Board to Board or Cable Unshrouded Surface Mount, Right Angle Solder Push-Pull 0.230 (5.84mm) - - 0.240 (6.10mm) Square Gold 10.0µin (0.25µm) Tin Phosphor Bronze
TMM-105-06-G-D-SM

TMM-105-06-G-D-SM

CONN HEADER SMD 10POS 2MM

Samtec Inc.
3,573 -

RFQ

TMM-105-06-G-D-SM

Ficha técnica

Tube TMM Active Header Male Pin 0.079 (2.00mm) 10 2 0.079 (2.00mm) All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.168 (4.27mm) - - 0.059 (1.50mm) Square Gold 20.0µin (0.51µm) Gold Phosphor Bronze
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1500+ Promedio diario de RFQ
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1800+ Fabricantes en todo el mundo
15,000+
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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