Conectores rectangulares - Espaciadores de placa, Apiladores (placa a placa)

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus NumberofPositions Pitch NumberofRows RowSpacing Length-OverallPin Length-Post(Mating) Length-StackHeight Length-Tail MountingType Termination ContactFinish-Post(Mating) ContactFinishThickness-Post(Mating)
54122-105240950LF

54122-105240950LF

CONN HDR 24POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,234 -

RFQ

54122-105240950LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 24 0.100 (2.54mm) 2 0.100 (2.54mm) 0.695 (17.650mm) 0.201 (5.100mm) 0.374 (9.500mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
59112-F34-18-076LF

59112-F34-18-076LF

CONN HDR STACK

Amphenol ICC (FCI)
3,527 -

RFQ

Bag * Active - - - - - - - - - - - -
59202-S28-16-050LF

59202-S28-16-050LF

CONN HDR STACK SMD

Amphenol ICC (FCI)
2,755 -

RFQ

Bag * Active - - - - - - - - - - - -
59112-G40-10-120

59112-G40-10-120

CONN HDR STACK

Amphenol ICC (FCI)
2,606 -

RFQ

Bag * Active - - - - - - - - - - - -
54122-104200500LF

54122-104200500LF

CONN HDR STACK

Amphenol ICC (FCI)
2,714 -

RFQ

Bulk * Active - - - - - - - - - - - -
20021834-11028T4LF

20021834-11028T4LF

CONN HDR 28POS 0.05 STACK SMD

Amphenol ICC (FCI)
2,852 -

RFQ

20021834-11028T4LF

Ficha técnica

Tube Minitek127® 20021834 Active 28 0.050 (1.27mm) 2 0.050 (1.27mm) 0.559 (14.200mm) 0.098 (2.500mm) 0.433 (11.000mm) - Surface Mount Solder Gold 10.0µin (0.25µm)
75970-323-16LF

75970-323-16LF

CONN HDR 16POS 0.100 STACK TH

Amphenol ICC (FCI)
2,704 -

RFQ

Bag BERGSTIK®, MezzSelect™, Basics+ Active 16 0.100 (2.54mm) 1 - - - - - Through Hole Solder Tin 78.7µin (2.00µm)
92813-038TRLF

92813-038TRLF

CONN HDR 28POS 0.079 STACK SMD

Amphenol ICC (FCI)
2,740 -

RFQ

92813-038TRLF

Ficha técnica

Tape & Reel (TR) Minitek® Active 28 0.079 (2.00mm) 2 0.079 (2.00mm) 0.610 (15.500mm) 0.157 (4.000mm) 0.453 (11.500mm) - Surface Mount Solder Gold, GXT™ 30.0µin (0.76µm)
54122-116302000RLF

54122-116302000RLF

CONN HDR 30POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,418 -

RFQ

54122-116302000RLF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 30 0.100 (2.54mm) 2 0.100 (2.54mm) 1.425 (36.200mm) 0.518 (13.157mm) 0.787 (20.000mm) 0.120 (3.050mm) Through Hole Kinked Pin, Solder Gold, GXT™ 30.0µin (0.76µm)
87690-107LF

87690-107LF

CONN HDR 20POS 0.100 STACK T/H

Amphenol ICC (FCI)
3,912 -

RFQ

87690-107LF

Ficha técnica

Bag BERGSTIK® II, MezzSelect™, Basics+ Active 20 0.100 (2.54mm) 2 0.100 (2.54mm) 1.325 (33.660mm) 0.471 (11.963mm) 0.728 (18.500mm) 0.126 (3.200mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54112-809201750LF

54112-809201750LF

CONN HDR 20POS 0.100 STACK T/H

Amphenol ICC (FCI)
3,977 -

RFQ

54112-809201750LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 20 0.100 (2.54mm) 2 0.100 (2.54mm) 1.025 (26.035mm) 0.241 (6.121mm) 0.689 (17.500mm) 0.095 (2.413mm) Through Hole Solder Gold, GXT™ 15.0µin (0.38µm)
54122-109161800LF

54122-109161800LF

CONN HDR 16POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,150 -

RFQ

54122-109161800LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 16 0.100 (2.54mm) 2 0.100 (2.54mm) 1.025 (26.035mm) 0.196 (4.978mm) 0.709 (18.000mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54122-820162000LF

54122-820162000LF

CONN HDR STACK

Amphenol ICC (FCI)
2,819 -

RFQ

Bag * Active - - - - - - - - - - - -
92813-041TRSLF

92813-041TRSLF

CONN HDR 30POS 0.079 STACK SMD

Amphenol ICC (FCI)
3,775 -

RFQ

92813-041TRSLF

Ficha técnica

Tape & Reel (TR) Minitek® Active 30 0.079 (2.00mm) 2 0.079 (2.00mm) 0.531 (13.500mm) 0.157 (4.000mm) 0.335 (8.500mm) - Surface Mount Solder Gold, GXT™ 30.0µin (0.76µm)
59202-G28-13A050LF

59202-G28-13A050LF

CONN HDR STACK

Amphenol ICC (FCI)
2,388 -

RFQ

Tape & Reel (TR) * Active - - - - - - - - - - - -
59112-S28-07-060LF

59112-S28-07-060LF

CONN HDR 14POS 0.079 STACK TH

Amphenol ICC (FCI)
3,736 -

RFQ

59112-S28-07-060LF

Ficha técnica

Bulk Minitek® 2.00mm Active 14 0.079 (2.00mm) 2 0.079 (2.00mm) 0.465 (11.800mm) 0.130 (3.300mm) 0.236 (6.000mm) 0.098 (2.500mm) Through Hole Solder Gold 15.0µin (0.38µm)
54242-107101450LF

54242-107101450LF

CONN HDR STACK

Amphenol ICC (FCI)
3,518 -

RFQ

Bag * Active - - - - - - - - - - - -
76745-1DF-26LF

76745-1DF-26LF

CONN HDR 26POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,624 -

RFQ

76745-1DF-26LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 26 0.100 (2.54mm) 2 0.100 (2.54mm) 1.025 (26.035mm) 0.359 (9.119mm) 0.307 (7.800mm) 0.359 (9.119mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
92813-029

92813-029

CONN HDR 44POS 0.079 STACK SMD

Amphenol ICC (FCI)
2,099 -

RFQ

Bag Minitek® Active 44 0.079 (2.00mm) 2 0.079 (2.00mm) - 0.157 (4.000mm) 0.354 (9.000mm) - Surface Mount Solder Gold, GXT™ 15.0µin (0.38µm)
54242-106301250LF

54242-106301250LF

CONN HDR 30POS 0.100 STACK SMD

Amphenol ICC (FCI)
3,385 -

RFQ

54242-106301250LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 30 0.100 (2.54mm) 2 0.100 (2.54mm) 0.674 (17.120mm) 0.183 (4.658mm) 0.492 (12.500mm) - Surface Mount Solder Gold, GXT™ 30.0µin (0.76µm)
Total 1780 Record«Prev1... 6667686970717273...89Next»
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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