Más categorías de productos

Conectores rectangulares - Espaciadores de placa, Apiladores (placa a placa)

Número de parte del fabricante	Disponibilidad	Precio	Cantidad	Ficha técnica	Packaging	Series	ProductStatus	NumberofPositions	Pitch	NumberofRows	RowSpacing	Length-OverallPin	Length-Post(Mating)	Length-StackHeight	Length-Tail	MountingType	Termination	ContactFinish-Post(Mating)	ContactFinishThickness-Post(Mating)
54242-807141250LF CONN HDR 14POS 0.100 STACK SMD Amphenol ICC (FCI)	3,142	-	RFQ	Ficha técnica	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	14	0.100 (2.54mm)	2	0.100 (2.54mm)	0.755 (19.177mm)	0.263 (6.680mm)	0.492 (12.500mm)	-	Surface Mount	Solder	Gold, GXT™	15.0µin (0.38µm)
20021814-10040T1LF CONN HDR 40POS 0.050 STACK TH Amphenol ICC (FCI)	2,911	-	RFQ		Tube	Minitek127® 20021814	Active	40	0.050 (1.27mm)	2	0.050 (1.27mm)	0.630 (16.000mm)	0.138 (3.500mm)	0.394 (10.000mm)	0.098 (2.500mm)	Through Hole	Solder	Gold	Flash
54776-110-24LF CONN HDR 24POS 0.100 STACK T/H Amphenol ICC (FCI)	3,132	-	RFQ		Bag	BERGSTIK®, MezzSelect™, Basics+	Active	24	0.100 (2.54mm)	2	0.100 (2.54mm)	1.043 (26.500mm)	0.327 (8.300mm)	0.390 (9.900mm)	0.327 (8.300mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54122-111321900LF CONN HDR 32POS 0.100 STACK T/H Amphenol ICC (FCI)	2,640	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	32	0.100 (2.54mm)	2	0.100 (2.54mm)	1.225 (31.115mm)	0.357 (9.068mm)	0.748 (19.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54122-811321900LF CONN HDR 32POS 0.100 STACK T/H Amphenol ICC (FCI)	3,743	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	32	0.100 (2.54mm)	2	0.100 (2.54mm)	1.225 (31.115mm)	0.357 (9.068mm)	0.748 (19.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
59112-T40-22-145LF CONN HDR 44POS 0.079 STACK TH Amphenol ICC (FCI)	2,797	-	RFQ	Ficha técnica	Bag	Minitek® 2.00mm	Active	44	0.079 (2.00mm)	2	0.079 (2.00mm)	0.831 (21.100mm)	0.161 (4.100mm)	0.571 (14.500mm)	0.098 (2.500mm)	Through Hole	Solder	Gold	30.0µin (0.76µm)
59202-G28-05-070LF CONN HDR STACK SMD Amphenol ICC (FCI)	2,753	-	RFQ		Bag	*	Active	-	-	-	-	-	-	-	-	-	-	-	-
59112-T38-25-135LF CONN HDR 50POS 0.079 STACK TH Amphenol ICC (FCI)	2,915	-	RFQ	Ficha técnica	Bag	Minitek® 2.00mm	Active	50	0.079 (2.00mm)	2	0.079 (2.00mm)	0.752 (19.100mm)	0.122 (3.100mm)	0.531 (13.500mm)	0.098 (2.500mm)	Through Hole	Solder	Gold	30.0µin (0.76µm)
54242-106100950LF CONN HDR STACK Amphenol ICC (FCI)	2,901	-	RFQ		Bulk	*	Active	-	-	-	-	-	-	-	-	-	-	-	-
54242-108161400LF CONN HDR 16POS 0.100 STACK SMD Amphenol ICC (FCI)	3,407	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	16	0.100 (2.54mm)	2	0.100 (2.54mm)	0.855 (21.717mm)	0.418 (10.617mm)	0.551 (14.000mm)	-	Surface Mount	Solder	Gold, GXT™	30.0µin (0.76µm)
54242-808161450LF CONN HDR 16POS 0.100 STACK SMD Amphenol ICC (FCI)	2,891	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	16	0.100 (2.54mm)	2	0.100 (2.54mm)	0.855 (21.717mm)	0.284 (7.214mm)	0.571 (14.500mm)	-	Surface Mount	Solder	Gold, GXT™	15.0µin (0.38µm)
54122-110401700LF CONN HDR 40POS 0.100 STACK T/H Amphenol ICC (FCI)	3,864	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	40	0.100 (2.54mm)	2	0.100 (2.54mm)	1.125 (28.575mm)	0.336 (8.534mm)	0.669 (17.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
98426-F11-25-194LF CONN HDR 50POS 0.079 STACK TH Amphenol ICC (FCI)	3,833	-	RFQ	Ficha técnica	Box	Minitek® 2.00mm	Active	50	0.079 (2.00mm)	2	0.079 (2.00mm)	0.878 (22.300mm)	0.157 (4.000mm)	0.598 (15.200mm)	0.114 (2.900mm)	Through Hole	Solder	Gold	Flash
59112-T40-25A150LF CONN HDR 50POS 0.079 STACK TH Amphenol ICC (FCI)	3,576	-	RFQ	Ficha técnica	Tape & Reel (TR)	Minitek® 2.00mm	Active	50	0.079 (2.00mm)	2	0.079 (2.00mm)	0.831 (21.100mm)	0.142 (3.600mm)	0.591 (15.000mm)	0.098 (2.500mm)	Through Hole	Solder	Gold	30.0µin (0.76µm)
59112-T36-20-113LF CONN HDR 40POS 0.079 STACK TH Amphenol ICC (FCI)	2,733	-	RFQ	Ficha técnica	Bag	Minitek® 2.00mm	Active	40	0.079 (2.00mm)	2	0.079 (2.00mm)	0.673 (17.100mm)	0.130 (3.300mm)	0.445 (11.300mm)	0.098 (2.500mm)	Through Hole	Solder	Gold	30.0µin (0.76µm)
54242-111121800LF CONN HDR 12POS 0.100 STACK SMD Amphenol ICC (FCI)	2,139	-	RFQ	Ficha técnica	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	12	0.100 (2.54mm)	2	0.100 (2.54mm)	1.155 (29.337mm)	0.446 (11.328mm)	0.709 (18.000mm)	-	Surface Mount	Solder	Gold, GXT™	30.0µin (0.76µm)
54242-406201200LF CONN HDR 20POS 0.1 STACK SMD Amphenol ICC (FCI)	2,495	-	RFQ	Ficha técnica	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	20	0.100 (2.54mm)	2	0.100 (2.54mm)	0.674 (17.120mm)	0.202 (5.131mm)	0.472 (12.000mm)	-	Surface Mount	Solder	Tin	78.7µin (2.00µm)
76745-124-18LF CONN HDR 18POS 0.100 STACK T/H Amphenol ICC (FCI)	2,059	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	18	0.100 (2.54mm)	2	0.100 (2.54mm)	1.040 (26.416mm)	0.349 (8.865mm)	0.571 (14.500mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54242-802160950LF CONN HDR 16POS 0.100 STACK SMD Amphenol ICC (FCI)	2,810	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	16	0.100 (2.54mm)	2	0.100 (2.54mm)	0.461 (11.720mm)	0.088 (2.235mm)	0.374 (9.500mm)	-	Surface Mount	Solder	Gold, GXT™	15.0µin (0.38µm)
54121-108361650LF CONN HDR 36POS 0.100 STACK T/H Amphenol ICC (FCI)	2,899	-	RFQ	Ficha técnica	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	36	0.100 (2.54mm)	1	-	0.925 (23.500mm)	0.156 (3.950mm)	0.650 (16.500mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)