Conectores rectangulares - Espaciadores de placa, Apiladores (placa a placa)

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus NumberofPositions Pitch NumberofRows RowSpacing Length-OverallPin Length-Post(Mating) Length-StackHeight Length-Tail MountingType Termination ContactFinish-Post(Mating) ContactFinishThickness-Post(Mating)
98426-G12-06-210LF

98426-G12-06-210LF

CONN HDR 12POS 0.079 STACK T/H

Amphenol ICC (FCI)
2,862 -

RFQ

98426-G12-06-210LF

Ficha técnica

Box Minitek® 2.00mm Active 12 0.079 (2.00mm) 2 0.079 (2.00mm) 0.917 (23.300mm) 0.157 (4.000mm) 0.661 (16.800mm) 0.091 (2.300mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54112-816122500LF

54112-816122500LF

CONN HDR STACK

Amphenol ICC (FCI)
2,347 -

RFQ

Bag * Active - - - - - - - - - - - -
20021831-04508C1LF

20021831-04508C1LF

CONN HDR STACK SMD

Amphenol ICC (FCI)
2,896 -

RFQ

Tape & Reel (TR) * Active - - - - - - - - - - - -
54122-108141500LF

54122-108141500LF

CONN HDR 14POS 0.100 STACK T/H

Amphenol ICC (FCI)
3,440 -

RFQ

54122-108141500LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 14 0.100 (2.54mm) 2 0.100 (2.54mm) 0.925 (23.500mm) 0.215 (5.450mm) 0.591 (15.000mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54121-808161300LF

54121-808161300LF

CONN HDR 16POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,509 -

RFQ

54121-808161300LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 16 0.100 (2.54mm) 1 - 0.925 (23.500mm) 0.293 (7.450mm) 0.512 (13.000mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 15.0µin (0.38µm)
54112-106161000LF

54112-106161000LF

CONN HDR 16POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,224 -

RFQ

54112-106161000LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 16 0.100 (2.54mm) 2 0.100 (2.54mm) 0.744 (18.900mm) 0.256 (6.500mm) 0.394 (10.000mm) 0.095 (2.413mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54121-808161050LF

54121-808161050LF

CONN HDR 16POS 0.100 STACK T/H

Amphenol ICC (FCI)
3,596 -

RFQ

54121-808161050LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 16 0.100 (2.54mm) 1 - 0.925 (23.500mm) 0.392 (9.950mm) 0.413 (10.500mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 15.0µin (0.38µm)
59202-F26-02A040LF

59202-F26-02A040LF

CONN HDR STACK SMD

Amphenol ICC (FCI)
3,746 -

RFQ

Tape & Reel (TR) * Active - - - - - - - - - - - -
20021833-05010T1LF

20021833-05010T1LF

CONN HDR 10POS 0.05 STACK SMD

Amphenol ICC (FCI)
2,808 -

RFQ

20021833-05010T1LF

Ficha técnica

Tube Minitek127® 20021833 Active 10 0.050 (1.27mm) 2 0.050 (1.27mm) 0.480 (12.200mm) 0.256 (6.500mm) 0.197 (5.000mm) - Surface Mount Solder Gold Flash
20021811-04510T4LF

20021811-04510T4LF

CONN HDR 10POS 0.050 STACK TH

Amphenol ICC (FCI)
3,551 -

RFQ

20021811-04510T4LF

Ficha técnica

Tube 20021811 Active 10 0.050 (1.27mm) 2 0.050 (1.27mm) 0.394 (10.000mm) 0.118 (3.000mm) 0.177 (4.500mm) 0.098 (2.500mm) Through Hole Solder Gold 10.0µin (0.25µm)
92813-025

92813-025

CONN HDR 6POS 0.079 STACK SMD

Amphenol ICC (FCI)
2,980 -

RFQ

Bag Minitek® Active 6 0.079 (2.00mm) 2 0.079 (2.00mm) 0.315 (8.000mm) 0.157 (4.000mm) 0.157 (4.000mm) - Surface Mount Solder Gold 30.0µin (0.76µm)
75970-130-10LF

75970-130-10LF

CONN HDR 10POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,246 -

RFQ

75970-130-10LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 10 0.100 (2.54mm) 1 - 0.760 (19.300mm) 0.110 (2.800mm) 0.539 (13.700mm) 0.110 (2.800mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
98426-G04-10-133LF

98426-G04-10-133LF

CONN HDR 20POS 0.079 STACK T/H

Amphenol ICC (FCI)
2,289 -

RFQ

98426-G04-10-133LF

Ficha técnica

Box Minitek® 2.00mm Active 20 0.079 (2.00mm) 2 0.079 (2.00mm) 0.614 (15.600mm) 0.157 (4.000mm) 0.358 (9.100mm) 0.091 (2.300mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
59132-S28-08-051LF

59132-S28-08-051LF

CONN HDR 16POS 0.079 STACK TH

Amphenol ICC (FCI)
3,879 -

RFQ

59132-S28-08-051LF

Ficha técnica

Bulk Minitek® 2.00mm Active 16 0.079 (2.00mm) 2 0.079 (2.00mm) 0.465 (11.800mm) 0.146 (3.700mm) 0.201 (5.100mm) 0.118 (3.000mm) Through Hole Solder Gold 15.0µin (0.38µm)
59202-F34-10-070LF

59202-F34-10-070LF

CONN HDR STACK SMD

Amphenol ICC (FCI)
2,271 -

RFQ

Bag * Active - - - - - - - - - - - -
98426-G06-07-148LF

98426-G06-07-148LF

CONN HDR 14POS 0.079 STACK T/H

Amphenol ICC (FCI)
3,412 -

RFQ

98426-G06-07-148LF

Ficha técnica

Box Minitek® 2.00mm Active 14 0.079 (2.00mm) 2 0.079 (2.00mm) 0.673 (17.100mm) 0.157 (4.000mm) 0.417 (10.600mm) 0.091 (2.300mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54122-110101200LF

54122-110101200LF

CONN HDR 10POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,248 -

RFQ

54122-110101200LF

Ficha técnica

Bulk,Box BERGSTIK®, MezzSelect™, Basics+ Active 10 0.100 (2.54mm) 2 0.100 (2.54mm) 1.125 (28.575mm) 0.533 (13.538mm) 0.472 (12.000mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
59112-F30-05-038LF

59112-F30-05-038LF

CONN HDR STACK

Amphenol ICC (FCI)
3,001 -

RFQ

Bag * Active - - - - - - - - - - - -
59132-S30-05-072

59132-S30-05-072

CONN HDR STACK

Amphenol ICC (FCI)
2,262 -

RFQ

Bag * Active - - - - - - - - - - - -
59202-S28-03A081LF

59202-S28-03A081LF

CONN HDR STACK SMD

Amphenol ICC (FCI)
2,309 -

RFQ

Tape & Reel (TR) * Active - - - - - - - - - - - -
Total 1780 Record«Prev1... 2526272829303132...89Next»
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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