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| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Package/Case | Packaging | Series | ProductStatus | BaseResonator | Type | Frequency | Function | Output | Voltage-Supply | FrequencyStability | AbsolutePullRange(APR) | OperatingTemperature | SpreadSpectrumBandwidth | Current-Supply(Max) | Ratings | MountingType | Size/Dimension |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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DSC6001JI3B-004K000MEMS OSC ULP LVCMOS -40C-85C 20P Microchip Technology |
2,096 | - |
RFQ |
Ficha técnica |
4-VLGA | Tube | DSC60XXB | Active | MEMS | XO (Standard) | 4 kHz | Enable/Disable | CMOS | 1.71V ~ 3.63V | ±20ppm | - | -40°C ~ 85°C | - | 1.3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
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DSC6001JI3B-004K000TMEMS OSC ULP LVCMOS -40C-85C 20P Microchip Technology |
3,995 | - |
RFQ |
Ficha técnica |
4-VLGA | Tape & Reel (TR) | DSC60XXB | Active | MEMS | XO (Standard) | 4 kHz | Enable/Disable | CMOS | 1.71V ~ 3.63V | ±20ppm | - | -40°C ~ 85°C | - | 1.3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
DSC6001ML2B-040.0000MEMS OSC ULP LVCMOS -40C-105C 25 Microchip Technology |
3,688 | - |
RFQ |
Ficha técnica |
4-VFLGA | Bag | DSC60XXB | Active | MEMS | XO (Standard) | 40 MHz | Enable/Disable | CMOS | 1.71V ~ 3.63V | ±25ppm | - | -40°C ~ 105°C | - | 1.3mA (Typ) | AEC-Q100 | Surface Mount | 0.079 L x 0.063 W (2.00mm x 1.60mm) |
|
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DSC6001ML2B-040.0000TMEMS OSC ULP LVCMOS -40C-105C 25 Microchip Technology |
2,454 | - |
RFQ |
Ficha técnica |
4-VFLGA | Tape & Reel (TR) | DSC60XXB | Active | MEMS | XO (Standard) | 40 MHz | Enable/Disable | CMOS | 1.71V ~ 3.63V | ±25ppm | - | -40°C ~ 105°C | - | 1.3mA (Typ) | AEC-Q100 | Surface Mount | 0.079 L x 0.063 W (2.00mm x 1.60mm) |
|
|
DSC6003JI2B-025.0000MEMS OSC ULP LVCMOS -40C-85C 25P Microchip Technology |
3,208 | - |
RFQ |
Ficha técnica |
4-VLGA | Tube | DSC60XXB | Active | MEMS | XO (Standard) | 25 MHz | Enable/Disable | CMOS | 1.71V ~ 3.63V | ±25ppm | - | -40°C ~ 85°C | - | 1.3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
|
DSC6003JI2B-025.0000TMEMS OSC ULP LVCMOS -40C-85C 25P Microchip Technology |
2,675 | - |
RFQ |
Ficha técnica |
4-VLGA | Tape & Reel (TR) | DSC60XXB | Active | MEMS | XO (Standard) | 25 MHz | Enable/Disable | CMOS | 1.71V ~ 3.63V | ±25ppm | - | -40°C ~ 85°C | - | 1.3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
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DSC6003MI2B-027.0000MEMS OSC ULP LVCMOS -40C-85C 25P Microchip Technology |
3,752 | - |
RFQ |
Ficha técnica |
4-VFLGA | Bag | DSC60XXB | Active | MEMS | XO (Standard) | 27 MHz | Enable/Disable | CMOS | 1.71V ~ 3.63V | ±25ppm | - | -40°C ~ 85°C | - | 1.3mA (Typ) | AEC-Q100 | Surface Mount | 0.079 L x 0.063 W (2.00mm x 1.60mm) |
|
|
DSC6003MI2B-027.0000TMEMS OSC ULP LVCMOS -40C-85C 25P Microchip Technology |
2,737 | - |
RFQ |
Ficha técnica |
4-VFLGA | Tape & Reel (TR) | DSC60XXB | Active | MEMS | XO (Standard) | 27 MHz | Enable/Disable | CMOS | 1.71V ~ 3.63V | ±25ppm | - | -40°C ~ 85°C | - | 1.3mA (Typ) | AEC-Q100 | Surface Mount | 0.079 L x 0.063 W (2.00mm x 1.60mm) |
|
DSC6011HE1B-084K000MEMS OSC ULP LVCMOS -20C-70C 50P Microchip Technology |
2,427 | - |
RFQ |
Ficha técnica |
4-VFLGA | Bag | DSC60XXB | Active | MEMS | XO (Standard) | 84 kHz | Standby (Power Down) | CMOS | 1.71V ~ 3.63V | ±50ppm | - | -20°C ~ 70°C | - | 1.3mA (Typ) | AEC-Q100 | Surface Mount | 0.063 L x 0.047 W (1.60mm x 1.20mm) |
|
|
DSC6011HE1B-084K000TMEMS OSC ULP LVCMOS -20C-70C 50P Microchip Technology |
3,923 | - |
RFQ |
Ficha técnica |
4-VFLGA | Tape & Reel (TR) | DSC60XXB | Active | MEMS | XO (Standard) | 84 kHz | Standby (Power Down) | CMOS | 1.71V ~ 3.63V | ±50ppm | - | -20°C ~ 70°C | - | 1.3mA (Typ) | AEC-Q100 | Surface Mount | 0.063 L x 0.047 W (1.60mm x 1.20mm) |
|
|
DSC6011HI1B-009.6000MEMS OSC ULP LVCMOS -40C-85C 50P Microchip Technology |
2,335 | - |
RFQ |
Ficha técnica |
4-VFLGA | Bag | DSC60XXB | Active | MEMS | XO (Standard) | 9.6 MHz | Standby (Power Down) | CMOS | 1.71V ~ 3.63V | ±50ppm | - | -40°C ~ 85°C | - | 1.3mA (Typ) | AEC-Q100 | Surface Mount | 0.063 L x 0.047 W (1.60mm x 1.20mm) |
|
|
DSC6011HI1B-009.6000TMEMS OSC ULP LVCMOS -40C-85C 50P Microchip Technology |
3,907 | - |
RFQ |
Ficha técnica |
4-VFLGA | Tape & Reel (TR) | DSC60XXB | Active | MEMS | XO (Standard) | 9.6 MHz | Standby (Power Down) | CMOS | 1.71V ~ 3.63V | ±50ppm | - | -40°C ~ 85°C | - | 1.3mA (Typ) | AEC-Q100 | Surface Mount | 0.063 L x 0.047 W (1.60mm x 1.20mm) |
|
|
DSC6011HI1B-016.0000MEMS OSC ULP LVCMOS -40C-85C 50P Microchip Technology |
2,527 | - |
RFQ |
Ficha técnica |
4-VFLGA | Bag | DSC60XXB | Active | MEMS | XO (Standard) | 16 MHz | Standby (Power Down) | CMOS | 1.71V ~ 3.63V | ±50ppm | - | -40°C ~ 85°C | - | 1.3mA (Typ) | AEC-Q100 | Surface Mount | 0.063 L x 0.047 W (1.60mm x 1.20mm) |
|
|
DSC6011HI1B-016.0000TMEMS OSC ULP LVCMOS -40C-85C 50P Microchip Technology |
2,918 | - |
RFQ |
Ficha técnica |
4-VFLGA | Tape & Reel (TR) | DSC60XXB | Active | MEMS | XO (Standard) | 16 MHz | Standby (Power Down) | CMOS | 1.71V ~ 3.63V | ±50ppm | - | -40°C ~ 85°C | - | 1.3mA (Typ) | AEC-Q100 | Surface Mount | 0.063 L x 0.047 W (1.60mm x 1.20mm) |
|
|
DSC6011HI1B-024.0000MEMS OSC ULP LVCMOS -40C-85C 50P Microchip Technology |
3,006 | - |
RFQ |
Ficha técnica |
4-VFLGA | Bag | DSC60XXB | Active | MEMS | XO (Standard) | 24 MHz | Standby (Power Down) | CMOS | 1.71V ~ 3.63V | ±50ppm | - | -40°C ~ 85°C | - | 1.3mA (Typ) | AEC-Q100 | Surface Mount | 0.063 L x 0.047 W (1.60mm x 1.20mm) |
|
|
DSC6011HI1B-024.0000TMEMS OSC ULP LVCMOS -40C-85C 50P Microchip Technology |
2,279 | - |
RFQ |
Ficha técnica |
4-VFLGA | Tape & Reel (TR) | DSC60XXB | Active | MEMS | XO (Standard) | 24 MHz | Standby (Power Down) | CMOS | 1.71V ~ 3.63V | ±50ppm | - | -40°C ~ 85°C | - | 1.3mA (Typ) | AEC-Q100 | Surface Mount | 0.063 L x 0.047 W (1.60mm x 1.20mm) |
|
|
DSC6011HI1B-025.0000MEMS OSC ULP LVCMOS -40C-85C 50P Microchip Technology |
2,374 | - |
RFQ |
Ficha técnica |
4-VFLGA | Bag | DSC60XXB | Active | MEMS | XO (Standard) | 25 MHz | Standby (Power Down) | CMOS | 1.71V ~ 3.63V | ±50ppm | - | -40°C ~ 85°C | - | 1.3mA (Typ) | AEC-Q100 | Surface Mount | 0.063 L x 0.047 W (1.60mm x 1.20mm) |
|
|
DSC6011HI1B-025.0000TMEMS OSC ULP LVCMOS -40C-85C 50P Microchip Technology |
3,034 | - |
RFQ |
Ficha técnica |
4-VFLGA | Tape & Reel (TR) | DSC60XXB | Active | MEMS | XO (Standard) | 25 MHz | Standby (Power Down) | CMOS | 1.71V ~ 3.63V | ±50ppm | - | -40°C ~ 85°C | - | 1.3mA (Typ) | AEC-Q100 | Surface Mount | 0.063 L x 0.047 W (1.60mm x 1.20mm) |
|
|
DSC6011JE1B-840K000MEMS OSC ULP LVCMOS -20C-70C 50P Microchip Technology |
2,049 | - |
RFQ |
Ficha técnica |
4-VLGA | Tube | DSC60XXB | Active | MEMS | XO (Standard) | 840 kHz | Standby (Power Down) | CMOS | 1.71V ~ 3.63V | ±50ppm | - | -20°C ~ 70°C | - | 1.3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
|
DSC6011JE1B-840K000TMEMS OSC ULP LVCMOS -20C-70C 50P Microchip Technology |
3,141 | - |
RFQ |
Ficha técnica |
4-VLGA | Tape & Reel (TR) | DSC60XXB | Active | MEMS | XO (Standard) | 840 kHz | Standby (Power Down) | CMOS | 1.71V ~ 3.63V | ±50ppm | - | -20°C ~ 70°C | - | 1.3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
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