Micrófonos

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type OutputType Direction FrequencyRange Sensitivity S/NRatio Impedance Voltage-Rated VoltageRange Current-Supply PortLocation Ratings Termination Size/Dimension Height(Max)
MMICT5919-00-012

MMICT5919-00-012

MIC MEMS DIG PDM -41DB 3.5X2.65

TDK InvenSense
3,315 -

RFQ

MMICT5919-00-012

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) T5919 Active MEMS (Silicon) Digital, PDM Omnidirectional - -41dB ±1dB @ 94dB SPL 64.5dB - 1.8 V 1.65 V ~ 1.98 V 590 µA Bottom - Surface Mount 0.138 L x 0.104 W (3.50mm x 2.65mm) 0.039 (0.98mm)
ICS-41350

ICS-41350

MICROPHONE MEMS DIGITAL PDM OMNI

TDK InvenSense
2,826 -

RFQ

ICS-41350

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) - Active MEMS (Silicon) Digital, PDM Omnidirectional 50 Hz ~ 40 kHz -32dB ±1dB 64dB - - 1.65 V ~ 3.63 V 750 µA Bottom - Solder Pads 0.138 L x 0.104 W (3.50mm x 2.65mm) 0.039 (0.98mm)
MMICT390200012

MMICT390200012

PDM DIGITAL OUTPUT MEMS MICROPHO

TDK InvenSense
2,483 -

RFQ

MMICT390200012

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) T3902 Active MEMS (Silicon) Digital, PDM Omnidirectional - -32dB ±1dB @ 94dB SPL 64dB - - 1.65 V ~ 3.63 V 650 µA Bottom - Surface Mount 0.138 L x 0.104 W (3.50mm x 2.65mm) 0.039 (0.98mm)
INMP621ACEZ-R7

INMP621ACEZ-R7

MICROPHONE MEMS DIGITAL PDM OMNI

TDK InvenSense
2,574 -

RFQ

INMP621ACEZ-R7

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) INMP621 Active MEMS (Silicon) Digital, PDM Omnidirectional 45 Hz ~ 20 kHz -46dB ±2dB @ 94dB SPL 65dB - - 1.62 V ~ 3.63 V 1.6 mA Bottom - Solder Pads 0.157 L x 0.118 W (4.00mm x 3.00mm) 0.043 (1.10mm)
ICS-40619

ICS-40619

MICROPHONE MEMS ANALOG OMNI

TDK InvenSense
3,770 -

RFQ

ICS-40619

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) - Active MEMS (Silicon) Analog Omnidirectional 50 Hz ~ 20 kHz -38db ±1dB 67dB - - 1.52 V ~ 3.63 V 190 µA Top - Solder Pads 0.138 L x 0.104 W (3.50mm x 2.65mm) 0.043 (1.10mm)
ICS-52000

ICS-52000

MICROPHONE MEMS DIGITAL TDM OMNI

TDK InvenSense
3,402 -

RFQ

ICS-52000

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) - Active MEMS (Silicon) Digital, TDM Omnidirectional 50 Hz ~ 20 kHz -26 ±1dB @ 94dB SPL 65dB - - 1.62 V ~ 3.63 V 1.5 mA Bottom - Solder Pads 0.157 L x 0.118 W (4.00mm x 3.00mm) 0.043 (1.10mm)
MMICT5818-00-012

MMICT5818-00-012

MIC MEMS DIG MULTI -41/-26DB

TDK InvenSense
2,442 -

RFQ

MMICT5818-00-012

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) T5818 Active MEMS (Silicon) Digital, PDM Omnidirectional 40 Hz ~ 20 kHz -41dB ±1dB @ 94dB SPL 66dB - 1.8 V 1.65 V ~ 3.63 V 220 µA Bottom - Solder Pads 0.138 L x 0.104 W (3.50mm x 2.65mm) 0.039 (0.98mm)
ICS-40638

ICS-40638

DIFFERENTIAL ANALOG OUTPUT MEMS

TDK InvenSense
2,489 -

RFQ

ICS-40638

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) - Active MEMS (Silicon) Analog Omnidirectional 35 Hz ~ 20 kHz -43dB ±1dB @ 94dB SPL 63dB 355 Ohms - 1.52 V ~ 3.63 V 170 µA Bottom - Surface Mount 0.138 L x 0.104 W (3.50mm x 2.65mm) 0.039 (0.98mm)
INMP621ACEZ-R0

INMP621ACEZ-R0

MICROPHONE MEMS DIGITAL PDM OMNI

TDK InvenSense
3,562 -

RFQ

INMP621ACEZ-R0

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) INMP621 Active MEMS (Silicon) Digital, PDM Omnidirectional 45 Hz ~ 20 kHz -46dB ±2dB @ 94dB SPL 65dB - - 1.62 V ~ 3.63 V 1.6 mA Bottom - Solder Pads 0.157 L x 0.118 W (4.00mm x 3.00mm) 0.043 (1.10mm)
INMP522ACEZ-R0

INMP522ACEZ-R0

MICROPHONE MEMS DIGITAL PDM OMNI

TDK InvenSense
3,230 -

RFQ

INMP522ACEZ-R0

Ficha técnica

Tape & Reel (TR) INMP522 Active MEMS (Silicon) Digital, PDM Omnidirectional 75 Hz ~ 20 kHz -26dB ±1dB @ 94dB SPL 65dB - - 1.62 V ~ 3.63 V 1.4 mA Bottom - Solder Pads 0.157 L x 0.118 W (4.00mm x 3.00mm) 0.039 (1.00mm)
INMP510ACEZ-R0

INMP510ACEZ-R0

MICROPHONE MEMS ANALOG OMNI

TDK InvenSense
3,202 -

RFQ

INMP510ACEZ-R0

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) INMP510 Not For New Designs MEMS (Silicon) Analog Omnidirectional 60 Hz ~ 20 kHz -38dB ±2dB @ 94dB SPL 65dB 350 Ohms - 1.5 V ~ 3.63 V 250 µA Bottom - Solder Pads 0.132 L x 0.098 W (3.35mm x 2.50mm) 0.043 (1.10mm)
INMP521ACEZ-R0

INMP521ACEZ-R0

MICROPHONE MEMS DIGITAL PDM OMNI

TDK InvenSense
2,948 -

RFQ

INMP521ACEZ-R0

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) INMP521 Active MEMS (Silicon) Digital, PDM Omnidirectional 100 Hz ~ 16 kHz -26dB ±3dB @ 94dB SPL 65dB - - 1.8 V ~ 3.3 V 1.2 mA Bottom - Solder Pads 0.157 L x 0.118 W (4.00mm x 3.00mm) 0.043 (1.10mm)
INMP404ACEZ-R0

INMP404ACEZ-R0

MICROPHONE MEMS ANALOG OMNI

TDK InvenSense
2,721 -

RFQ

INMP404ACEZ-R0

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) INMP404 Not For New Designs MEMS (Silicon) Analog Omnidirectional 100 Hz ~ 15 kHz -38dB ±3dB @ 94dB SPL 62dB 200 Ohms - 1.5 V ~ 3.3 V 250 µA Bottom - Solder Pads 0.132 L x 0.098 W (3.35mm x 2.50mm) 0.039 (0.98mm)
ICS-40181

ICS-40181

MICROPHONE MEMS ANALOG OMNI

TDK InvenSense
2,824 -

RFQ

ICS-40181

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) - Obsolete MEMS (Silicon) Analog Omnidirectional 60 Hz ~ 20 kHz -38db ±1dB 65dB 350 Ohms - 1.5 V ~ 3.63 V 250 µA Top - Solder Pads 0.138 L x 0.104 W (3.50mm x 2.65mm) 0.043 (1.10mm)
INMP401ACEZ-R7

INMP401ACEZ-R7

MICROPHONE MEMS ANALOG OMNI

TDK InvenSense
2,307 -

RFQ

INMP401ACEZ-R7

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) INMP401 Obsolete MEMS (Silicon) Analog Omnidirectional 60 Hz ~ 15 kHz -42dB ±3dB @ 94dB SPL 62dB 200 Ohms - 1.5 V ~ 3.3 V 250 µA Bottom - Solder Pads 0.186 L x 0.148 W (4.72mm x 3.76mm) 0.043 (1.10mm)
INMP405ACEZ-R0

INMP405ACEZ-R0

MIC MEMS ANALOG OMNI -38DB

TDK InvenSense
2,909 -

RFQ

INMP405ACEZ-R0

Ficha técnica

Cut Tape (CT) INMP405 Obsolete MEMS (Silicon) Analog Omnidirectional 200 Hz ~ 15 kHz -38dB ±3dB @ 94dB SPL 62dB 200 Ohms - 1.5 V ~ 3.3 V 250 µA Bottom - Solder Pads 0.132 L x 0.098 W (3.35mm x 2.50mm) 0.039 (0.98mm)
INMP441ACEZ-R7

INMP441ACEZ-R7

MICROPHONE MEMS DIGITAL I2S OMNI

TDK InvenSense
2,868 -

RFQ

INMP441ACEZ-R7

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) INMP441 Obsolete MEMS (Silicon) Digital, I²S Omnidirectional 60 Hz ~ 15 kHz -26dB ±3dB @ 94dB SPL 61dB - - 1.62 V ~ 3.63 V 1.6 mA Bottom - Solder Pads 0.186 L x 0.148 W (4.72mm x 3.76mm) 0.041 (1.05mm)
INMP504ACEZ-R7

INMP504ACEZ-R7

MICROPHONE MEMS ANALOG OMNI

TDK InvenSense
2,736 -

RFQ

INMP504ACEZ-R7

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) INMP504 Obsolete MEMS (Silicon) Analog Omnidirectional 100 Hz ~ 20 kHz -38dB ±3dB @ 94dB SPL 65dB 200 Ohms - 1.6 V ~ 3.3 V 225 µA Bottom - Solder Pads 0.132 L x 0.098 W (3.35mm x 2.50mm) 0.039 (0.98mm)
INMP421BCEZ-R7

INMP421BCEZ-R7

MICROPHONE MEMS DIGITAL PDM OMNI

TDK InvenSense
3,076 -

RFQ

INMP421BCEZ-R7

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) INMP421 Obsolete MEMS (Silicon) Digital, PDM Omnidirectional 100 Hz ~ 15 kHz -26dB ±3dB @ 94dB SPL 61dB - - 1.62 V ~ 3.63 V 650 µA Bottom - Solder Pads 0.157 L x 0.118 W (4.00mm x 3.00mm) 0.043 (1.10mm)
INMP405ACEZ-R7

INMP405ACEZ-R7

MICROPHONE MEMS ANALOG OMNI

TDK InvenSense
2,028 -

RFQ

INMP405ACEZ-R7

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) INMP405 Obsolete MEMS (Silicon) Analog Omnidirectional 200 Hz ~ 15 kHz -38dB ±3dB @ 94dB SPL 62dB 2 kOhms - 1.5 V ~ 3.3 V 250 µA Bottom - Solder Pads 0.132 L x 0.098 W (3.35mm x 2.50mm) 0.039 (0.98mm)
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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