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Micrófonos

Número de parte del fabricante	Disponibilidad	Precio	Cantidad	Ficha técnica	Packaging	Series	ProductStatus	Type	OutputType	Direction	FrequencyRange	Sensitivity	S/NRatio	Impedance	Voltage-Rated	VoltageRange	Current-Supply	PortLocation	Ratings	Termination	Size/Dimension	Height(Max)
SPA1687LR5H-1 ALTMAN MIC ANALOG BOTTOM PORT Knowles	2,157	-	RFQ	Ficha técnica	Tape & Reel (TR),Cut Tape (CT)	SiSonic™	Not For New Designs	MEMS (Silicon)	Analog	Omnidirectional	100 Hz ~ 10 kHz	-38dB ±3dB @ 94dB SPL	65dB	-	2.7 V	-	325 µA	Bottom	-	Solder Pads	0.132 L x 0.098 W (3.35mm x 2.50mm)	0.043 (1.08mm)
SPU1410LR5H-QB MICROPHONE MEMS ANALOG OMNI Knowles	3,091	-	RFQ	Ficha técnica	Tape & Reel (TR),Cut Tape (CT)	SiSonic™ SP	Obsolete	MEMS (Silicon)	Analog	Omnidirectional	10 Hz ~ 10 kHz	-38dB ±3dB @ 94dB SPL	63dB	400 Ohms	-	1.5 V ~ 3.6 V	160 µA	Bottom	-	Solder Pads	0.148 L x 0.118 W (3.76mm x 3.00mm)	0.047 (1.20mm)
ICS-51360 MIC MEMS DIG PDM -36DB 3.5X2.65 TDK InvenSense	2,333	-	RFQ	Ficha técnica	Tape & Reel (TR),Cut Tape (CT)	ICS-51360	Obsolete	MEMS (Silicon)	Digital, PDM	Omnidirectional	50 Hz ~ 20 kHz	-36dB ±1dB @ 94dB SPL	62dB	-	1.8 V	1.65 V ~ 3.63 V	730 µA	Bottom	-	Solder Pads	0.138 L x 0.104 W (3.50mm x 2.65mm)	0.039 (0.98mm)
ICS-41352 MIC MEMS DIG PDM -26DB 3.5X2.65 TDK InvenSense	2,394	-	RFQ	Ficha técnica	Tape & Reel (TR),Cut Tape (CT)	ICS-41352	Obsolete	MEMS (Silicon)	Digital, PDM	Omnidirectional	-	-26dB ±1dB @ 94dB SPL	64dB	-	1.8 V	1.65 V ~ 3.63 V	600 µA	Bottom	-	Solder Pads	0.138 L x 0.104 W (3.50mm x 2.65mm)	0.039 (0.98mm)
ICS-40180 MICROPHONE MEMS ANALOG OMNI TDK InvenSense	2,972	-	RFQ	Ficha técnica	Tape & Reel (TR),Cut Tape (CT)	-	Obsolete	MEMS (Silicon)	Analog	Omnidirectional	60 Hz ~ 20 kHz	-38dB ±1dB @ 94dB SPL	65dB	350 Ohms	-	1.5 V ~ 3.63 V	260 µA	Bottom	-	Solder Pads	0.138 L x 0.104 W (3.50mm x 2.65mm)	0.043 (1.10mm)
MM034202-7 MICROPHONE MEMS ANALOG OMNI DB Unlimited	935	-	RFQ	Ficha técnica	Tape & Reel (TR),Cut Tape (CT)	-	Active	MEMS (Silicon)	Analog	Omnidirectional	30 Hz ~ 10 kHz	-42dB	60dB	-	2 V	-	80 µA	Top	-	Solder Pads	0.148 L x 0.116 W (3.76mm x 2.95mm)	0.047 (1.20mm)
MM023802-3 MICROPHONE MEMS ANALOG OMNI DB Unlimited	990	-	RFQ	Ficha técnica	Tape & Reel (TR),Cut Tape (CT)	-	Active	MEMS (Silicon)	Analog	Omnidirectional	100 Hz ~ 10 kHz	-38dB ±3dB	61dB	-	2 V	-	180 µA	Bottom	-	Solder Pads	0.108 L x 0.073 W (2.75mm x 1.85mm)	0.041 (1.05mm)
MM023802-2 MICROPHONE MEMS ANALOG OMNI DB Unlimited	988	-	RFQ	Ficha técnica	Tape & Reel (TR),Cut Tape (CT)	-	Active	MEMS (Silicon)	Analog	Omnidirectional	100 Hz ~ 10 kHz	-38dB ±3dB	61dB	-	2 V	-	180 µA	Bottom	-	Solder Pads	0.108 L x 0.073 W (2.75mm x 1.85mm)	0.041 (1.05mm)
CMM-4030DT-26154-TR MICROPHONE MEMS DIGITAL PDM OMNI CUI Devices	442	-	RFQ	Ficha técnica	Tape & Reel (TR),Cut Tape (CT)	CMM	Active	MEMS (Silicon)	Digital, PDM	Omnidirectional	100 Hz ~ 10 kHz	-26dB ±1dB @ 94dB SPL	65dB	-	2 V	1.6 V ~ 3.6 V	540 µA	Top	-	Solder Pads	0.157 L x 0.118 W (4.00mm x 3.00mm)	0.043 (1.10mm)
SMO04C-38/1316 MEMS MICROPHONE BeStar Technologies, Inc.	100	-	RFQ	Ficha técnica	Box	SMO	Active	MEMS (Silicon)	Analog	Omnidirectional	100 Hz ~ 10 kHz	-38dB ±1dB	63dB	-	-	1.6 V ~ 3.6 V	0.2 mA	Top	-	Solder Pads	0.148 L x 0.116 W (3.76mm x 2.95mm)	0.043 (1.10mm)
POM-1345P-C3310-R MIC COND ANALOG OMNI -45DB 6MM D PUI Audio, Inc.	2,256	-	RFQ	Ficha técnica	Bulk	POM	Active	Electret Condenser	Analog	Omnidirectional	-	-45dB ±4dB	55dB	2.2 kOhms	2 V	2 V ~ 10 V	500 µA	Top	-	PC Pins	0.236 Dia (6.00mm)	0.071 (1.80mm)
CMC-6015-47P MIC COND ANALOG UNI -47DB 6MM D CUI Devices	2,811	-	RFQ	Ficha técnica	Box	CMC	Active	Electret Condenser	Analog	Unidirectional	100 Hz ~ 20 kHz	-47dB ±3dB @ 94dB SPL	56dB	2.2 kOhms	2 V	2 V ~ 10 V	500 µA	Top	-	PC Pins	0.236 Dia (6.00mm)	0.094 (2.40mm)
INMP521ACEZ-R7 MICROPHONE MEMS DIGITAL PDM OMNI TDK InvenSense	3,679	-	RFQ	Ficha técnica	Tape & Reel (TR),Cut Tape (CT)	INMP521	Not For New Designs	MEMS (Silicon)	Digital, PDM	Omnidirectional	100 Hz ~ 16 kHz	-26dB ±3dB @ 94dB SPL	65dB	-	-	1.62 V ~ 3.63 V	1.2 mA	Bottom	-	Solder Pads	0.157 L x 0.118 W (4.00mm x 3.00mm)	0.043 (1.10mm)
TO-24611-000 MICROPHONE COND ANALOG OMNI Knowles	2,140	-	RFQ	Ficha técnica	Tray	TO	Active	Electret Condenser	Analog	Omnidirectional	100 Hz ~ 5.8 kHz	-56dB ±3dB @ 74dB SPL	-	4.4 kOhms	1.3 V	0.9 V ~ 1.6 V	50 µA	Side	-	Solder Pads	0.141 L x 0.141 W (3.57mm x 3.57mm)	0.053 (1.35mm)
CMM-2718AT-42116-TR MICROPHONE MEMS ANALOG OMNI CUI Devices	3,286	-	RFQ	Ficha técnica	Tape & Reel (TR),Cut Tape (CT)	CMM	Active	MEMS (Silicon)	Analog	Omnidirectional	100 Hz ~ 10 kHz	-42dB ±1dB @ 94dB SPL	57dB	-	2 V	1.6 V ~ 3.6 V	160 µA	Top	-	Solder Pads	0.108 L x 0.073 W (2.75mm x 1.85mm)	0.041 (1.05mm)
ICS-40212 MICROPHONE MEMS ANALOG OMNI TDK InvenSense	3,996	-	RFQ	Ficha técnica	Tape & Reel (TR),Cut Tape (CT)	ICS-40212	Active	MEMS (Silicon)	Analog	Omnidirectional	35 Hz ~ 20 kHz	-38dB ±1dB @ 94dB SPL	66dB	-	-	1.52 V ~ 3.63 V	190 µA	Bottom	-	Solder Pads	0.138 L x 0.104 W (3.50mm x 2.65mm)	0.039 (0.98mm)
DMM-4026-B-R MICROPHONE MEMS DIGITAL PDM OMNI PUI Audio, Inc.	2,121	-	RFQ	Ficha técnica	Tape & Reel (TR),Cut Tape (CT)	-	Active	MEMS (Silicon)	Digital, PDM	Omnidirectional	20 Hz ~ 18 kHz	-26dB ±1dB	61dB	-	1.8 V	1.5 V ~ 3.6 V	1 A	Bottom	-	Solder Pads	0.157 L x 0.118 W (4.00mm x 3.00mm)	0.043 (1.10mm)
DMM-3526-B-R MICROPHONE MEMS DIGITAL PDM OMNI PUI Audio, Inc.	852	-	RFQ	Ficha técnica	Tape & Reel (TR),Cut Tape (CT)	-	Active	MEMS (Silicon)	Digital, PDM	Omnidirectional	20 Hz ~ 18 kHz	-26dB ±1dB	61dB	-	1.8 V	1.5 V ~ 3.6 V	1 A	Bottom	-	Solder Pads	0.138 L x 0.104 W (3.50mm x 2.65mm)	0.043 (1.08mm)
AMM-3742-T-WP-R MIC MEMS ANLG -42DB 3.76X2.95MM PUI Audio, Inc.	2,617	-	RFQ	Ficha técnica	Tape & Reel (TR),Cut Tape (CT)	-	Active	MEMS (Silicon)	Analog	Omnidirectional	20 Hz ~ 20 kHz	-42dB ±1dB	59dB	300 Ohms	1.5 V	1.5 V ~ 3.6 V	200 µA	Top	IP57 - Dust Protected, Waterproof	Solder Pads	0.148 L x 0.116 W (3.76mm x 2.95mm)	0.047 (1.20mm)
AMM-2742-T-WP-R MIC MEMS ANLG -42DB 2.75X1.85MM PUI Audio, Inc.	2,725	-	RFQ	Ficha técnica	Tape & Reel (TR),Cut Tape (CT)	-	Active	MEMS (Silicon)	Analog	Omnidirectional	20 Hz ~ 20 kHz	-42dB ±1dB	59dB	300 Ohms	2 V	1.6 V ~ 3.6 V	200 µA	Top	IP57 - Dust Protected, Waterproof	Solder Pads	0.108 L x 0.073 W (2.75mm x 1.85mm)	0.039 (1.00mm)