Inductores Fijos

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Package/Case Packaging Series ProductStatus Type Material-Core Inductance Tolerance CurrentRating(Amps) Current-Saturation(Isat) Shielding DCResistance(DCR) Q@Freq Frequency-SelfResonant Ratings OperatingTemperature InductanceFrequency-Test Features MountingType Size/Dimension
WB0402T1N8SJ

WB0402T1N8SJ

WW IND 0402 1.8NH 5%

CAL-CHIP ELECTRONICS, INC.
24,000 -

RFQ

WB0402T1N8SJ

Ficha técnica

0402 (1005 Metric) Tape & Reel (TR) WB Active Drum Core, Wirewound Ceramic 1.8 nH ±5% 1.04 A - Unshielded 70mOhm Max 16 @ 250MHz 12GHz - -40°C ~ 125°C 250 MHz - Surface Mount 0402
WB0603TR39SJ

WB0603TR39SJ

WW IND 0603 390NH 5%

CAL-CHIP ELECTRONICS, INC.
20,000 -

RFQ

WB0603TR39SJ

Ficha técnica

0603 (1608 Metric) Tape & Reel (TR) WB Active Drum Core, Wirewound Ceramic 390 nH ±5% 100 mA - Unshielded 4.35Ohm Max 25 @ 100MHz 900MHz - -40°C ~ 125°C 100 MHz - Surface Mount 0603
WB0805T27NSG

WB0805T27NSG

WW IND 0805 27NH 2%

CAL-CHIP ELECTRONICS, INC.
60,000 -

RFQ

WB0805T27NSG

Ficha técnica

0805 (2012 Metric) Tape & Reel (TR) WB Active Drum Core, Wirewound Ceramic 27 nH ±2% 500 mA - Unshielded 250mOhm Max 55 @ 500MHz 2.5GHz - -40°C ~ 125°C 250 MHz - Surface Mount 0805
WB0805T15NSG

WB0805T15NSG

WW IND 0805 15NH 2%

CAL-CHIP ELECTRONICS, INC.
51,000 -

RFQ

WB0805T15NSG

Ficha técnica

0805 (2012 Metric) Tape & Reel (TR) WB Active Drum Core, Wirewound Ceramic 15 nH ±2% 600 mA - Unshielded 170mOhm Max 50 @ 500MHz 3.4GHz - -40°C ~ 125°C 250 MHz - Surface Mount 0805
WB0805TR22SG

WB0805TR22SG

WW IND 0805 220NH 2%

CAL-CHIP ELECTRONICS, INC.
33,000 -

RFQ

WB0805TR22SG

Ficha técnica

0805 (2012 Metric) Tape & Reel (TR) WB Active Drum Core, Wirewound Ceramic 220 nH ±2% 400 mA - Unshielded 700mOhm Max 50 @ 250MHz 850MHz - -40°C ~ 125°C 100 MHz - Surface Mount 0805
WB0805T36NSG

WB0805T36NSG

WW IND 0805 36NH 2%

CAL-CHIP ELECTRONICS, INC.
30,000 -

RFQ

WB0805T36NSG

Ficha técnica

0805 (2012 Metric) Tape & Reel (TR) WB Active Drum Core, Wirewound Ceramic 36 nH ±2% 500 mA - Unshielded 270mOhm Max 55 @ 500MHz 1.7GHz - -40°C ~ 125°C 250 MHz - Surface Mount 0805
WB0805T18NSG

WB0805T18NSG

WW IND 0805 18NH 2%

CAL-CHIP ELECTRONICS, INC.
30,000 -

RFQ

WB0805T18NSG

Ficha técnica

0805 (2012 Metric) Tape & Reel (TR) WB Active Drum Core, Wirewound Ceramic 18 nH ±2% 600 mA - Unshielded 200mOhm Max 50 @ 500MHz 3.3GHz - -40°C ~ 125°C 250 MHz - Surface Mount 0805
WB0805T22NSG

WB0805T22NSG

WW IND 0805 22NH 2%

CAL-CHIP ELECTRONICS, INC.
30,000 -

RFQ

WB0805T22NSG

Ficha técnica

0805 (2012 Metric) Tape & Reel (TR) WB Active Drum Core, Wirewound Ceramic 22 nH ±2% 500 mA - Unshielded 220mOhm Max 55 @ 500MHz 2.6GHz - -40°C ~ 125°C 250 MHz - Surface Mount 0805
WB0805TR15SG

WB0805TR15SG

WW IND 0805 150NH 2%

CAL-CHIP ELECTRONICS, INC.
30,000 -

RFQ

WB0805TR15SG

Ficha técnica

0805 (2012 Metric) Tape & Reel (TR) WB Active Drum Core, Wirewound Ceramic 150 nH ±2% 400 mA - Unshielded 560mOhm Max 50 @ 250MHz 920MHz - -40°C ~ 125°C 100 MHz - Surface Mount 0805
WB0805T82NSG

WB0805T82NSG

WW IND 0805 82NH 2%

CAL-CHIP ELECTRONICS, INC.
27,000 -

RFQ

WB0805T82NSG

Ficha técnica

0805 (2012 Metric) Tape & Reel (TR) WB Active Drum Core, Wirewound Ceramic 82 nH ±2% 400 mA - Unshielded 420mOhm Max 65 @ 500MHz 1.3GHz - -40°C ~ 125°C 150 MHz - Surface Mount 0805
WB0805T3N3SG

WB0805T3N3SG

WW IND 0805 3.3NH 2%

CAL-CHIP ELECTRONICS, INC.
24,000 -

RFQ

WB0805T3N3SG

Ficha técnica

0805 (2012 Metric) Tape & Reel (TR) WB Active Drum Core, Wirewound Ceramic 3.3 nH ±2% 600 mA - Unshielded 80mOhm Max 35 @ 1.5GHz 7.9GHz - -40°C ~ 125°C 250 MHz - Surface Mount 0805
WB0805TR18SG

WB0805TR18SG

WW IND 0805 180NH 2%

CAL-CHIP ELECTRONICS, INC.
24,000 -

RFQ

WB0805TR18SG

Ficha técnica

0805 (2012 Metric) Tape & Reel (TR) WB Active Drum Core, Wirewound Ceramic 180 nH ±2% 400 mA - Unshielded 640mOhm Max 50 @ 250MHz 870MHz - -40°C ~ 125°C 100 MHz - Surface Mount 0805
WB0805T24NSG

WB0805T24NSG

WW IND 0805 24NH 2%

CAL-CHIP ELECTRONICS, INC.
24,000 -

RFQ

WB0805T24NSG

Ficha técnica

0805 (2012 Metric) Tape & Reel (TR) WB Active Drum Core, Wirewound Ceramic 24 nH ±2% 500 mA - Unshielded 220mOhm Max 50 @ 500MHz 2GHz - -40°C ~ 125°C 250 MHz - Surface Mount 0805
WB0805T47NSG

WB0805T47NSG

WW IND-805 47NH 2%

CAL-CHIP ELECTRONICS, INC.
24,000 -

RFQ

WB0805T47NSG

Ficha técnica

0805 (2012 Metric) Tape & Reel (TR) WB Active Drum Core, Wirewound Ceramic 47 nH ±2% 500 mA - Unshielded 310mOhm Max 60 @ 500MHz 1.65GHz - -40°C ~ 125°C 200 MHz - Surface Mount 0805
WB0805T39NSG

WB0805T39NSG

WW IND 0805 39NH 2%

CAL-CHIP ELECTRONICS, INC.
21,000 -

RFQ

WB0805T39NSG

Ficha técnica

0805 (2012 Metric) Tape & Reel (TR) WB Active Drum Core, Wirewound Ceramic 39 nH ±2% 500 mA - Unshielded 290mOhm Max 60 @ 500MHz 2GHz - -40°C ~ 125°C 250 MHz - Surface Mount 0805
WB0805TR47SG

WB0805TR47SG

WW IND 0805 470NH 2%

CAL-CHIP ELECTRONICS, INC.
18,000 -

RFQ

WB0805TR47SG

Ficha técnica

0805 (2012 Metric) Tape & Reel (TR) WB Active Drum Core, Wirewound Ceramic 470 nH ±2% 250 mA - Unshielded 1.7Ohm Max 33 @ 100MHz 375MHz - -40°C ~ 125°C 50 MHz - Surface Mount 0805
WB0805TR11SG

WB0805TR11SG

WW IND 0805 110NH 2%

CAL-CHIP ELECTRONICS, INC.
18,000 -

RFQ

WB0805TR11SG

Ficha técnica

0805 (2012 Metric) Tape & Reel (TR) WB Active Drum Core, Wirewound Ceramic 110 nH ±2% 400 mA - Unshielded 480mOhm Max 50 @ 500MHz 1GHz - -40°C ~ 125°C 150 MHz - Surface Mount 0805
WB0805TR39SG

WB0805TR39SG

WW IND 0805 390NH 2%

CAL-CHIP ELECTRONICS, INC.
15,000 -

RFQ

WB0805TR39SG

Ficha técnica

0805 (2012 Metric) Tape & Reel (TR) WB Active Drum Core, Wirewound Ceramic 390 nH ±2% 300 mA - Unshielded 1.5Ohm Max 48 @ 250MHz 560MHz - -40°C ~ 125°C 100 MHz - Surface Mount 0805
WB0805T33NSG

WB0805T33NSG

WW IND 0805 33NH 2%

CAL-CHIP ELECTRONICS, INC.
15,000 -

RFQ

WB0805T33NSG

Ficha técnica

0805 (2012 Metric) Tape & Reel (TR) WB Active Drum Core, Wirewound Ceramic 33 nH ±2% 500 mA - Unshielded 270mOhm Max 60 @ 500MHz 2.05GHz - -40°C ~ 125°C 250 MHz - Surface Mount 0805
WB0805T6N8SG

WB0805T6N8SG

WW IND 0805 6.8NH 2%

CAL-CHIP ELECTRONICS, INC.
15,000 -

RFQ

WB0805T6N8SG

Ficha técnica

0805 (2012 Metric) Tape & Reel (TR) WB Active Drum Core, Wirewound Ceramic 6.8 nH ±2% 600 mA - Unshielded 110mOhm Max 50 @ 1GHz 5.5GHz - -40°C ~ 125°C 250 MHz - Surface Mount 0805
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20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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