Integrado - Sistema en chip (SoC)

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Package/Case Packaging Series ProductStatus Architecture CoreProcessor FlashSize RAMSize Peripherals Connectivity Speed PrimaryAttributes OperatingTemperature
M2S050-FGG896

M2S050-FGG896

IC SOC CORTEX-M3 166MHZ 896FBGA

Microchip Technology
3,504 -

RFQ

M2S050-FGG896

Ficha técnica

896-BGA Tray SmartFusion®2 Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I²C, SPI, UART/USART, USB 166MHz FPGA - 50K Logic Modules 0°C ~ 85°C (TJ)
M2S050T-FGG484I

M2S050T-FGG484I

IC SOC CORTEX-M3 166MHZ 484FBGA

Microchip Technology
3,586 -

RFQ

M2S050T-FGG484I

Ficha técnica

484-BGA Tray SmartFusion®2 Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I²C, SPI, UART/USART, USB 166MHz FPGA - 50K Logic Modules -40°C ~ 100°C (TJ)
XC7Z015-2CLG485E

XC7Z015-2CLG485E

IC SOC CORTEX-A9 766MHZ 485CSBGA

AMD Xilinx
3,418 -

RFQ

XC7Z015-2CLG485E

Ficha técnica

485-LFBGA, CSPBGA Tray Zynq®-7000 Active MCU, FPGA Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ - 256KB DMA CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 766MHz Artix™-7 FPGA, 74K Logic Cells 0°C ~ 100°C (TJ)
PXB4330EV1.1

PXB4330EV1.1

AOP ATM OAM PROCESSOR

Infineon Technologies
2,330 -

RFQ

- Bulk * Active - - - - - - - - -
R8J66607B00FP#RF1S

R8J66607B00FP#RF1S

SOC/SIP

Renesas Electronics America Inc
3,395 -

RFQ

- Bulk * Active - - - - - - - - -
UPD720231AK8-612-BAE

UPD720231AK8-612-BAE

SOC, USB 3.0/2.0 CONTROLLER

Renesas Electronics America Inc
3,986 -

RFQ

- Bulk * Active - - - - - - - - -
UPD63711AGC-8EU-A

UPD63711AGC-8EU-A

SOC ANALOG CD/TUNER

Renesas Electronics America Inc
3,747 -

RFQ

- Bulk * Active - - - - - - - - -
QN9083CUK,019

QN9083CUK,019

QN908X: ULTRA-LOW-POWER BLUETOOT

NXP USA Inc.
2,776 -

RFQ

- Bulk * Active - - - - - - - - -
PSB21473FV1.3

PSB21473FV1.3

INCA-D PBX PHONE SOC

Lantiq
2,640 -

RFQ

- Bulk * Active - - - - - - - - -
TLE92672QXXUMA2

TLE92672QXXUMA2

TLE9267 - SYSTEM BASIS CHIP

Infineon Technologies
2,873 -

RFQ

- Bulk * Active - - - - - - - - -
NHE6300ESB

NHE6300ESB

MULTIFUNCTION PERIPHERAL, CMOS

Intel
2,443 -

RFQ

- Bulk * Active - - - - - - - -
TLE92682QXXUMA2

TLE92682QXXUMA2

TLE9268-2QX - SYSTEM BASIS CHIP

Infineon Technologies
3,597 -

RFQ

- Bulk * Active - - - - - - - - -
UPD72874AGC-YEB-A

UPD72874AGC-YEB-A

SOC / AV LINK

Renesas Electronics America Inc
3,859 -

RFQ

UPD72874AGC-YEB-A

Ficha técnica

- Bulk * Active - - - - - - - - -
PLCHIP-P13-51220

PLCHIP-P13-51220

P13 PLC ON A CHIP LQFP-208, UP T

Divelbiss Corporation
2,655 -

RFQ

PLCHIP-P13-51220

Ficha técnica

208-LQFP Tray - Active MCU PLC 256KB 32KB LCD, PWM, WDT CANbus, Ethernet, I²C, MMC/SD, SPI, UART/USART 12MHz - -40°C ~ 85°C (TJ)
XC7Z007S-1CLG225I

XC7Z007S-1CLG225I

IC SOC CORTEX-A9 667MHZ 225BGA

AMD Xilinx
2,487 -

RFQ

XC7Z007S-1CLG225I

Ficha técnica

225-LFBGA, CSPBGA Tray Zynq®-7000 Active MCU, FPGA Single ARM® Cortex®-A9 MPCore™ with CoreSight™ - 256KB DMA CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 667MHz Artix™-7 FPGA, 23K Logic Cells -40°C ~ 100°C (TJ)
M2S025T-FCSG158I

M2S025T-FCSG158I

M2S025T-FCSG158I

Microchip Technology
2,466 -

RFQ

158-BGA, FCBGA Tray - Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I²C, SPI, UART/USART, USB 166MHz FPGA - 25K Logic Modules -40°C ~ 100°C (TJ)
M2S025T-1FCSG158I

M2S025T-1FCSG158I

M2S025T-1FCSG158I

Microchip Technology
2,871 -

RFQ

158-BGA, FCBGA Tray - Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I²C, SPI, UART/USART, USB 166MHz FPGA - 25K Logic Modules -40°C ~ 100°C (TJ)
DRA829JMTGBALFR

DRA829JMTGBALFR

DUAL ARM CORTEX-A72, QUAD CORTEX

Texas Instruments
2,957 -

RFQ

827-BFBGA, FCBGA Tape & Reel (TR),Cut Tape (CT) - Active DSP, MCU, MPU ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x - 1.5MB DMA, PWM, WDT I²C, I³C, MCAN, MMC/SD/SDIO, SPI, UART, USB 2GHz, 1GHz, 1.35GHz, 1GHz - -40°C ~ 105°C (TJ)
TDA4VM88TGBALFR

TDA4VM88TGBALFR

NEXT GENERATION SOC FAMILY FOR L

Texas Instruments
2,172 -

RFQ

827-BFBGA, FCBGA Tape & Reel (TR),Cut Tape (CT) Automotive, AEC-Q100 Active DSP, MCU, MPU ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x - 1.5MB DMA, PWM, WDT MCAN, MMC/SDSD/IOI²C, SPI, UART, USB 2GHz, 1GHz, 1.35GHz, 1GHz - -40°C ~ 105°C (TJ)
TDA4VM88TGBALFRQ1

TDA4VM88TGBALFRQ1

NEXT GENERATION SOC FAMILY FOR L

Texas Instruments
3,988 -

RFQ

827-BFBGA, FCBGA Tape & Reel (TR),Cut Tape (CT) Automotive, AEC-Q100 Active DSP, MCU, MPU ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x - 1.5MB DMA, PWM, WDT MCAN, MMC/SDSD/IOI²C, SPI, UART, USB 2GHz, 1GHz, 1.35GHz, 1GHz - -40°C ~ 125°C (TJ)
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1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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