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Integrado - Microprocesadores
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Package/Case | Packaging | Series | ProductStatus | CoreProcessor | NumberofCores/BusWidth | Speed | Co-Processors/DSP | RAMControllers | GraphicsAcceleration | Display&InterfaceControllers | Ethernet | SATA | USB | Voltage-I/O | OperatingTemperature | SecurityFeatures |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
BSC9131NLN1HHHBIC MPU Q OR IQ 800MHZ 520FCBGA NXP USA Inc. |
3,751 | - |
RFQ |
520-FBGA, FCBGA | Bulk | QorIQ Qonverge BSC | Active | PowerPC e500 | 1 Core, 32-Bit | 800MHz | Signal Processing; SC3850 | DDR3, DDR3L | No | - | 10/100/1000Mbps (2) | - | USB 2.0 (1) | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | |
|
MCIMX6D5EYM10ACRIC MPU I.MX6D 1.0GHZ 624FCBGA NXP USA Inc. |
3,509 | - |
RFQ |
Ficha técnica |
624-LFBGA, FCBGA | Tape & Reel (TR) | i.MX6D | Not For New Designs | ARM® Cortex®-A9 | 2 Core, 32-Bit | 1.0GHz | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | -20°C ~ 105°C (TJ) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
|
|
MCIMX6D5EYM10ADRIC MPU I.MX6D 1.0GHZ 624FCBGA NXP USA Inc. |
2,293 | - |
RFQ |
Ficha técnica |
624-LFBGA, FCBGA | Tape & Reel (TR) | i.MX6D | Active | ARM® Cortex®-A9 | 2 Core, 32-Bit | 1.0GHz | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | -20°C ~ 105°C (TJ) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
|
|
MCIMX6D5EYM10AERIC MPU I.MX6D ENHANCED 624FCBGA NXP USA Inc. |
2,939 | - |
RFQ |
Ficha técnica |
624-LFBGA, FCBGA | Tape & Reel (TR) | i.MX6D | Active | ARM® Cortex®-A9 | 2 Core, 32-Bit | 1.0GHz | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | -20°C ~ 105°C (TJ) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
|
|
MCIMX6D5EYM12CEI.MX6DQ 1ROM PERF ENHAN NXP USA Inc. |
3,815 | - |
RFQ |
Ficha técnica |
624-LFBGA, FCBGA | Tray | i.MX6D | Active | ARM® Cortex®-A9 | 2 Core, 32-Bit | 1.2GHz | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | -20°C ~ 105°C (TJ) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
|
MPC8313ECVRAGDCIC MPU POWERQUICC II PRO 516PBGA NXP USA Inc. |
2,259 | - |
RFQ |
Ficha técnica |
516-BBGA Exposed Pad | Tray | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
LS1021AXE7MQBLS1 32BIT ARM SOC 1.2GHZ DDR3/ NXP USA Inc. |
3,847 | - |
RFQ |
525-FBGA, FCBGA | Tray | QorIQ® Layerscape | Active | ARM® Cortex®-A7 | 2 Core, 32-Bit | 1.2GHz | - | DDR3L, DDR4 | - | 2D-ACE | GbE (3) | SATA 6Gbps (1) | USB 3.0 (1) + PHY | - | -40°C ~ 105°C | Secure Boot, TrustZone® | |
|
MPC8323ECVRADDCAIC MPU MPC83XX 266MHZ 516BGA NXP USA Inc. |
2,460 | - |
RFQ |
Ficha técnica |
516-BBGA | Tray | MPC83xx | Active | PowerPC e300c2 | 1 Core, 32-Bit | 266MHz | Communications; QUICC Engine, Security; SEC 2.2 | DDR, DDR2 | No | - | 10/100Mbps (3) | - | USB 2.0 (1) | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | Cryptography |
|
MPC8247VRMIBAIC MPU MPC82XX 266MHZ 516BGA NXP USA Inc. |
2,760 | - |
RFQ |
Ficha técnica |
516-BBGA | Tray | MPC82xx | Active | PowerPC G2_LE | 1 Core, 32-Bit | 266MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | 10/100Mbps (2) | - | USB 2.0 (1) | 3.3V | 0°C ~ 105°C (TA) | - |
|
|
MPC8323CVRAFDCAIC MPU MPC83XX 333MHZ 516BGA NXP USA Inc. |
3,819 | - |
RFQ |
Ficha técnica |
516-BBGA | Tray | MPC83xx | Active | PowerPC e300c2 | 1 Core, 32-Bit | 333MHz | Communications; QUICC Engine | DDR, DDR2 | No | - | 10/100Mbps (3) | - | USB 2.0 (1) | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | - |
|
MIMX8QX6CVLDZACI.MX 8QUADXPLUS 21X21 NXP USA Inc. |
3,836 | - |
RFQ |
- | Tray | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
SPC5200CBV400BR2IC MPU MPC52XX 400MHZ 272BGA NXP USA Inc. |
3,724 | - |
RFQ |
Ficha técnica |
272-BBGA | Tape & Reel (TR) | MPC52xx | Not For New Designs | PowerPC G2_LE | 1 Core, 32-Bit | 400MHz | - | DDR, SDRAM | No | - | 10/100Mbps (1) | - | USB 1.1 (2) | 2.5V, 3.3V | -40°C ~ 85°C (TA) | - |
|
MIMX8MQ5CVAHZAAI.MX 8MQUAD LT 17X17 NOL NXP USA Inc. |
3,113 | - |
RFQ |
Ficha técnica |
621-FBGA, FCBGA | Tray | i.MX8MQ | Not For New Designs | ARM® Cortex®-A53 | 4 Core, 64-Bit | 1.3GHz | ARM® Cortex®-M4 | DDR3L, DDR4, LPDDR4 | Yes | eDP, HDMI, MIPI-CSI, MIPI-DSI | GbE | - | USB 3.0 (2) | - | -40°C ~ 105°C (TJ) | ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS |
|
|
MCIMX6Q5EYM10CEI.MX6DQ ROM PERF ENHAN NXP USA Inc. |
2,391 | - |
RFQ |
Ficha técnica |
624-LFBGA, FCBGA | Tray | i.MX6Q | Active | ARM® Cortex®-A9 | 4 Core, 32-Bit | 1.0GHz | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | -20°C ~ 105°C (TJ) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
|
LS1017ASN7HNALS1017A-800 ST NO SEC NXP USA Inc. |
2,618 | - |
RFQ |
448-BFBGA | Tray | QorIQ® Layerscape | Active | ARM® Cortex®-A72 | 1 Core, 64-Bit | 800MHz | - | DDR3L SDRAM, DDR4 SDRAM | - | - | 1Gbps (1), 2.5Gbps (5) | SATA 6Gbps (1) | - | - | -40°C ~ 105°C (TA) | - | |
|
|
MCIMX6D5EZK08ADI.MX 6 SERIES 32-BIT MPU DUAL A NXP USA Inc. |
3,918 | - |
RFQ |
Ficha técnica |
569-LFBGA | Tray | i.MX6D | Active | ARM® Cortex®-A9 | 2 Core, 32-Bit | 800MHz | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | -20°C ~ 105°C (TJ) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
|
|
MCIMX6D5EZK08AEI.MX6D POP ARIK-D POP RO NXP USA Inc. |
3,733 | - |
RFQ |
Ficha técnica |
569-LFBGA | Tray | i.MX6D | Active | ARM® Cortex®-A9 | 2 Core, 32-Bit | 800MHz | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | -20°C ~ 105°C (TJ) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
|
|
MIMX8DX1AVOFZACI.MX 8DUALXPLUS 17X17 NXP USA Inc. |
2,910 | - |
RFQ |
- | Tray | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
MIMX8UX6AVOFZACI.MX8 QXP 17X17 NXP USA Inc. |
3,354 | - |
RFQ |
- | Tray | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
MIMX8UX5AVLFZACI.MX8 QXP 21X21 NXP USA Inc. |
2,040 | - |
RFQ |
- | Tray | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |
- 1500+ Promedio diario de RFQ
- 20,000.000 Unidad estándar de producto
- 1800+ Fabricantes en todo el mundo
- 15,000+ Almacén en inventario
