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Integrado - Microprocesadores
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Package/Case | Packaging | Series | ProductStatus | CoreProcessor | NumberofCores/BusWidth | Speed | Co-Processors/DSP | RAMControllers | GraphicsAcceleration | Display&InterfaceControllers | Ethernet | SATA | USB | Voltage-I/O | OperatingTemperature | SecurityFeatures |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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MCIMX6X1AVO08ACI.MX6SX AUTO ROM P ENHAN NXP USA Inc. |
2,683 | - |
RFQ |
Ficha técnica |
400-LFBGA | Tray | i.MX6SX | Active | ARM® Cortex®-A9, ARM® Cortex®-M4 | 2 Core, 32-Bit | 200MHz, 800MHz | Multimedia; NEON™ MPE | LPDDR2, LVDDR3, DDR3 | No | Keypad, LCD | 10/100/1000Mbps (2) | - | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | 1.8V, 2.5V, 2.8V, 3.15V | -40°C ~ 125°C (TJ) | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE |
|
|
MCIMX6X1AVO08ACRI.MX6SX AUTO ROM P ENHAN NXP USA Inc. |
3,504 | - |
RFQ |
Ficha técnica |
400-LFBGA | Tape & Reel (TR) | i.MX6SX | Active | ARM® Cortex®-A9, ARM® Cortex®-M4 | 2 Core, 32-Bit | 200MHz, 800MHz | Multimedia; NEON™ MPE | LPDDR2, LVDDR3, DDR3 | No | Keypad, LCD | 10/100/1000Mbps (2) | - | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | 1.8V, 2.5V, 2.8V, 3.15V | -40°C ~ 125°C (TJ) | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE |
|
MCIMX27MJP4AIC MPU I.MX27 400MHZ 473MAPBGA NXP USA Inc. |
3,474 | - |
RFQ |
Ficha técnica |
473-LFBGA | Bulk,Tray | i.MX27 | Not For New Designs | ARM926EJ-S | 1 Core, 32-Bit | 400MHz | Security; SAHARAH2 | DDR | Yes | Keypad, LCD | 10/100Mbps (1) | - | USB 2.0 + PHY (3) | 2.0V, 2.5V, 2.7V, 3.0V | -40°C ~ 85°C (TA) | Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory |
|
|
MCIMX27MOP4AIC MPU I.MX27 400MHZ 473MAPBGA NXP USA Inc. |
2,857 | - |
RFQ |
Ficha técnica |
473-LFBGA | Tray | i.MX27 | Not For New Designs | ARM926EJ-S | 1 Core, 32-Bit | 400MHz | Security; SAHARAH2 | DDR | Yes | Keypad, LCD | 10/100Mbps (1) | - | USB 2.0 + PHY (3) | 2.0V, 2.5V, 2.7V, 3.0V | -40°C ~ 85°C (TA) | Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory |
|
MIMX8MM3CVTKZAAIC MPU I.MX 8M MINI DUALLITE NXP USA Inc. |
3,862 | - |
RFQ |
Ficha técnica |
486-LFBGA, FCBGA | Tray | i.MX8MM | Active | ARM® Cortex®-A53 | 2 Core, 64-Bit | 1.6GHz | ARM® Cortex®-M4 | DDR3L, DDR4, LPDDR4 | Yes | MIPI-DSI | GbE | - | USB 2.0 + PHY (2) | - | -40°C ~ 105°C (TJ) | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS |
|
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MCIMX6X3CVN08ACI.MX 6SX ROM PERF ENHAN NXP USA Inc. |
2,738 | - |
RFQ |
Ficha técnica |
400-LFBGA | Tray | i.MX6SX | Active | ARM® Cortex®-A9, ARM® Cortex®-M4 | 2 Core, 32-Bit | 200MHz, 800MHz | Multimedia; NEON™ MPE | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (2) | - | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | 1.8V, 2.5V, 2.8V, 3.15V | -40°C ~ 105°C (TA) | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE |
|
MCIMX6S5DVM10ABRIC MPU I.MX6S 1.0GHZ 624MAPBGA NXP USA Inc. |
2,105 | - |
RFQ |
Ficha técnica |
624-LFBGA | Tape & Reel (TR) | i.MX6S | Not For New Designs | ARM® Cortex®-A9 | 1 Core, 32-Bit | 1.0GHz | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | 0°C ~ 95°C (TJ) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
|
|
MCIMX6S5DVM10ADRII.MX 6S ROM PERF ENHAN NXP USA Inc. |
2,310 | - |
RFQ |
Ficha técnica |
624-LFBGA | Tape & Reel (TR) | i.MX6S | Active | ARM® Cortex®-A9 | 1 Core, 32-Bit | 1.0GHz | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | 0°C ~ 95°C (TJ) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
|
MC9328MX21VMR2IC MPU I.MX21 266MHZ 289MAPBGA NXP USA Inc. |
3,238 | - |
RFQ |
Ficha técnica |
289-LFBGA | Tape & Reel (TR) | i.MX21 | Last Time Buy | ARM926EJ-S | 1 Core, 32-Bit | 266MHz | - | SDRAM | No | Keypad, LCD | - | - | USB 1.x (2) | 1.8V, 3.0V | 0°C ~ 70°C (TA) | - |
|
MCIMX6X3EVK10ABRI.MX 6 SERIES 32-BIT MPU ARM CO NXP USA Inc. |
3,257 | - |
RFQ |
400-LFBGA | Tape & Reel (TR) | i.MX6SX | Active | ARM® Cortex®-A9, ARM® Cortex®-M4 | 2 Core, 32-Bit | 227MHz, 1GHz | Multimedia; NEON™ MPE | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD, LVDS | 10/100/1000Mbps (2) | - | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | 1.8V, 2.5V, 2.8V, 3.15V | -20°C ~ 105°C (TJ) | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | |
|
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MC9328MX21VMIC MPU I.MX21 266MHZ 289MAPBGA NXP USA Inc. |
2,574 | - |
RFQ |
Ficha técnica |
289-LFBGA | Tray | i.MX21 | Last Time Buy | ARM926EJ-S | 1 Core, 32-Bit | 266MHz | - | SDRAM | No | Keypad, LCD | - | - | USB 1.x (2) | 1.8V, 3.0V | 0°C ~ 70°C (TA) | - |
|
|
MCIMX6X1AVK08AC.MX 6SX ROM PERF ENHAN NXP USA Inc. |
3,098 | - |
RFQ |
Ficha técnica |
400-LFBGA | Tray | i.MX6SX | Active | ARM® Cortex®-A9, ARM® Cortex®-M4 | 2 Core, 32-Bit | 200MHz, 800MHz | Multimedia; NEON™ MPE | LPDDR2, LVDDR3, DDR3 | No | Keypad, LCD | 10/100/1000Mbps (2) | - | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | 1.8V, 2.5V, 2.8V, 3.15V | -40°C ~ 125°C (TJ) | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE |
|
MVF51NS151CMK50IC MCU 32BIT ROMLESS 364MAPBGA NXP USA Inc. |
3,767 | - |
RFQ |
Ficha técnica |
364-LFBGA | Tray | Vybrid, VF5xx | Active | ARM® Cortex®-A5 | 1 Core, 32-Bit | 500MHz | Multimedia; NEON™ MPE | LPDDR2, DDR3, DRAM | Yes | DCU, GPU, LCD, VideoADC, VIU | 10/100Mbps (2) | - | USB 2.0 OTG + PHY (1) | 3.3V | -40°C ~ 85°C (TA) | ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG |
|
|
MVF51NS152CMK50IC MCU 32BIT ROMLESS 364MAPBGA NXP USA Inc. |
3,543 | - |
RFQ |
Ficha técnica |
364-LFBGA | Tray | Vybrid, VF5xx | Active | ARM® Cortex®-A5 | 1 Core, 32-Bit | 500MHz | Multimedia; NEON™ MPE | LPDDR2, DDR3, DRAM | Yes | DCU, GPU, LCD, VideoADC, VIU | 10/100Mbps (2) | - | USB 2.0 OTG + PHY (1) | 3.3V | -40°C ~ 85°C (TA) | ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG |
|
|
MIMX8MM2CVTKZAAIC MPU I.MX 8M MINI SOLO BGA NXP USA Inc. |
2,413 | - |
RFQ |
Ficha técnica |
486-LFBGA, FCBGA | Bulk,Tray | i.MX8MM | Active | ARM® Cortex®-A53 | 1 Core, 64-Bit | 1.6GHz | ARM® Cortex®-M4 | DDR3L, DDR4, LPDDR4 | Yes | MIPI-DSI | GbE | - | USB 2.0 + PHY (2) | - | -40°C ~ 105°C (TJ) | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS |
|
|
MVF60NN151CMK40IC MCU 32BIT ROMLESS 364MAPBGA NXP USA Inc. |
3,435 | - |
RFQ |
Ficha técnica |
364-LFBGA | Bulk,Tray | Vybrid, VF6xx | Active | ARM® Cortex®-A5 + Cortex®-M4 | 2 Core, 32-Bit | 400MHz, 167MHz | Multimedia; NEON™ MPE | LPDDR2, DDR3, DRAM | Yes | DCU, GPU, LCD, VideoADC, VIU | 10/100Mbps (2) | - | USB 2.0 OTG + PHY (1) | 3.3V | -40°C ~ 85°C (TA) | - |
|
|
MVF62NN151CMK40IC MCU 32BIT ROMLESS 364MAPBGA NXP USA Inc. |
3,937 | - |
RFQ |
Ficha técnica |
364-LFBGA | Tray | Vybrid, VF6xx | Active | ARM® Cortex®-A5 + Cortex®-M4 | 2 Core, 32-Bit | 400MHz, 167MHz | Multimedia; NEON™ MPE | LPDDR2, DDR3, DRAM | Yes | DCU, GPU, LCD, VideoADC, VIU | 10/100Mbps (2) | - | USB 2.0 OTG + PHY (1) | 3.3V | -40°C ~ 85°C (TA) | - |
|
|
MVF60NN152CMK40IC MCU 32BIT ROMLESS 364MAPBGA NXP USA Inc. |
3,380 | - |
RFQ |
Ficha técnica |
364-LFBGA | Tray | Vybrid, VF6xx | Active | ARM® Cortex®-A5 + Cortex®-M4 | 2 Core, 32-Bit | 400MHz, 167MHz | Multimedia; NEON™ MPE | LPDDR2, DDR3, DRAM | Yes | DCU, GPU, LCD, VideoADC, VIU | 10/100Mbps (2) | - | USB 2.0 OTG + PHY (1) | 3.3V | -40°C ~ 85°C (TA) | - |
|
|
MVF62NN152CMK40VYBRID F 32-BIT MPU ARM CORTEX- NXP USA Inc. |
3,090 | - |
RFQ |
364-LFBGA | Tray | Vybrid, VF6xx | Active | ARM® Cortex®-A5 + Cortex®-M4 | 2 Core, 32-Bit | 400MHz, 167MHz | Multimedia; NEON™ MPE | LPDDR2, DDR3, DRAM | Yes | DCU, GPU, LCD, VideoADC, VIU | 10/100Mbps (2) | - | USB 2.0 OTG + PHY (1) | 3.3V | -40°C ~ 85°C (TA) | - | |
|
|
MIMX8MN6DVTJZAA8M NANO 815S 14X14FCBGA NXP USA Inc. |
3,311 | - |
RFQ |
486-LFBGA, FCBGA | Bulk,Tray | i.MX8MN | Obsolete | ARM® Cortex®-A53 | 4 Core, 64-Bit | 1.5GHz | ARM® Cortex®-M7 | DDR3L, DDR4, LPDDR4 | Yes | LCD, MIPI-CSI, MIPI-DSI | GbE | - | USB 2.0 + PHY (2) | - | 0°C ~ 95°C (TJ) | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS |
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