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0Integrado - Microprocesadores
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Package/Case | Packaging | Series | ProductStatus | CoreProcessor | NumberofCores/BusWidth | Speed | Co-Processors/DSP | RAMControllers | GraphicsAcceleration | Display&InterfaceControllers | Ethernet | SATA | USB | Voltage-I/O | OperatingTemperature | SecurityFeatures |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MC68EC040FE33A-NXPMPU M68000 2 BIT HCMOS 33MHZ 184 NXP USA Inc. |
312 | - |
RFQ |
Ficha técnica |
- | Bulk | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
T1024NSE7MQPAQORIQ 2XCPU 64-BIT PWR ARCH 1. NXP USA Inc. |
2,553 | - |
RFQ |
Ficha técnica |
780-FBGA | Tray | QorIQ T1 | Active | PowerPC e5500 | 2 Core, 64-Bit | 1.2GHz | - | DDR3L, DDR4 | No | - | GbE (8) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | - | 0°C ~ 105°C (TA) | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage |
|
LS1046AXN8Q1AQORIQ LAYERSCAPE 4XA72 64BIT ARM NXP USA Inc. |
2,697 | - |
RFQ |
Ficha técnica |
780-FBGA, FCBGA | Tray | QorIQ® Layerscape | Active | ARM® Cortex®-A72 | 4 Core, 64-Bit | 1.6GHz | - | DDR4 | - | - | 10GbE (2), 2.5GbE (1), 1GbE (4) | SATA 6Gbps (1) | USB 3.0 (3) + PHY | - | -40°C ~ 105°C | Secure Boot, TrustZone® |
|
P5010NSE7QMB557-NXPQORIQ, 64 BIT POWER ARCH SOC, 1. NXP USA Inc. |
3,164 | - |
RFQ |
- | Bulk | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
MPC8547EPXAQGD557RISC MICROPROCESSOR, CMOS NXP USA Inc. |
180 | - |
RFQ |
Ficha técnica |
- | Bulk | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
MPC860PCZQ50D4-NXPPOWERQUICC 32 BIT POWER ARCHITEC NXP USA Inc. |
3,743 | - |
RFQ |
Ficha técnica |
357-BBGA | Bulk | MPC86xx | Active | MPC8xx | 1 Core, 32-Bit | 50MHz | Communications; CPM | DRAM | No | - | 10Mbps (4), 10/100Mbps (1) | - | - | 3.3V | -40°C ~ 95°C (TJ) | - |
|
|
MPC860PVR66D4-NXPPOWERQUICC 32 BIT POWER ARCHITEC NXP USA Inc. |
1,584 | - |
RFQ |
Ficha técnica |
- | Bulk | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
T1042NSN7PQBIC SOC 4CORE 1400MHZ 780FCBGA NXP USA Inc. |
3,825 | - |
RFQ |
Ficha técnica |
780-FBGA, FCBGA | Tray | QorIQ T1 | Active | PowerPC e5500 | 4 Core, 64-Bit | 1.4GHz | - | DDR3L/4 | No | - | 1Gbps (5) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | - | 0°C ~ 105°C (TA) | - |
|
|
MC68302CRC20C157-NXPINTEGRATED MULTIPROTOCOL MICROPR NXP USA Inc. |
2,009 | - |
RFQ |
Ficha técnica |
- | Bulk | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
MC68EC040RC33A-NXPMICROPROCESSOR, 32 BIT, MC68000 NXP USA Inc. |
3,245 | - |
RFQ |
Ficha técnica |
- | Bulk | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
MPC8275VRMIBAIC MPU MPC82XX 266MHZ 516BGA NXP USA Inc. |
2,414 | - |
RFQ |
Ficha técnica |
516-BBGA | Tray | MPC82xx | Active | PowerPC G2_LE | 1 Core, 32-Bit | 266MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | 10/100Mbps (3) | - | USB 2.0 (1) | 3.3V | 0°C ~ 105°C (TA) | - |
|
|
XPC823EZT75BARISC MICROPROCESSOR, 32-BIT, 75M NXP USA Inc. |
3,000 | - |
RFQ |
Ficha técnica |
256-BBGA | Bulk | - | Obsolete | PowerPC | 1 Core, 32-Bit | 75MHz | Communications; RISC CPM | - | No | LCD, Video | 10Mbps (1) | - | USB 1.x (1) | 3.3V | 0°C ~ 95°C (TJ) | - |
|
|
MIMX8QP6AVUFFABMPU I.MX8 QUAD PLUS NXP USA Inc. |
3,037 | - |
RFQ |
- | Tray | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
MC68040RC25V-NXPMICROPROCESSOR, 32 BIT, MC68000 NXP USA Inc. |
2,590 | - |
RFQ |
Ficha técnica |
- | Bulk | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
MSC8156SAG1000B,557STARCORE DSP, 6X 1GHZ SC3850 COR NXP USA Inc. |
154 | - |
RFQ |
Ficha técnica |
- | Tray | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
MC68040RC40V-NXPMICROPROCESSOR, 32 BIT, 40MHZ, C NXP USA Inc. |
1,528 | - |
RFQ |
Ficha técnica |
- | Bulk | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
T2081NXE8TTBQORIQ 64B POWER ARCH 8X 1.8GHZ NXP USA Inc. |
3,970 | - |
RFQ |
Ficha técnica |
780-BFBGA, FCBGA | Tray | QorIQ T2 | Active | PowerPC e6500 | 4 Core, 64-Bit | 1.8GHz | - | DDR3, DDR3L | - | - | 1Gbps (8), 2.5Gbps (4), 10Gbps (4) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | - | 0°C ~ 105°C (TA) | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage |
|
MCIMX233DJM4CR2IC MPU I.MX23 454MHZ 169MAPBGA NXP USA Inc. |
1,490 | - |
RFQ |
Ficha técnica |
169-LFBGA | Tape & Reel (TR),Cut Tape (CT) | i.MX23 | Active | ARM926EJ-S | 1 Core, 32-Bit | 454MHz | Data; DCP | DRAM | No | LCD, Touchscreen | - | - | USB 2.0 + PHY (1) | 2.0V, 2.5V, 2.7V, 3.0V, 3.3V | -10°C ~ 70°C (TA) | Cryptography, Hardware ID |
|
MCIMX6D4AVT08ADRIC MPU I.MX6D 852MHZ 624FCBGA NXP USA Inc. |
1,000 | - |
RFQ |
Ficha técnica |
624-FBGA, FCBGA | Tape & Reel (TR),Cut Tape (CT) | i.MX6D | Active | ARM® Cortex®-A9 | 2 Core, 32-Bit | 852MHz | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | -40°C ~ 125°C (TJ) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
|
|
MCIMX6D6AVT08ADIC MPU I.MX6D 852MHZ 624FCBGA NXP USA Inc. |
600 | - |
RFQ |
Ficha técnica |
624-FBGA, FCBGA | Tray | i.MX6D | Active | ARM® Cortex®-A9 | 2 Core, 32-Bit | 852MHz | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | -40°C ~ 125°C (TJ) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
- 1500+ Promedio diario de RFQ
- 20,000.000 Unidad estándar de producto
- 1800+ Fabricantes en todo el mundo
- 15,000+ Almacén en inventario
