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Integrado - Microprocesadores
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Package/Case | Packaging | Series | ProductStatus | CoreProcessor | NumberofCores/BusWidth | Speed | Co-Processors/DSP | RAMControllers | GraphicsAcceleration | Display&InterfaceControllers | Ethernet | SATA | USB | Voltage-I/O | OperatingTemperature | SecurityFeatures |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
T4160NSN7PQBQORIQ, 64B POWER ARCH, 16X 1.5GH NXP USA Inc. |
3,803 | - |
RFQ |
Ficha técnica |
- | Bulk | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
MC7448VU1267NDIC MPU MPC74XX 1.267GHZ 360BGA NXP USA Inc. |
3,238 | - |
RFQ |
Ficha técnica |
360-CBGA, FCCBGA | Tray | MPC74xx | Last Time Buy | PowerPC G4 | 1 Core, 32-Bit | 1.267GHz | Multimedia; SIMD | - | No | - | - | - | - | 1.5V, 1.8V, 2.5V | 0°C ~ 105°C (TA) | - |
|
|
MC7457TRX1000NCRISC MICROPROCESSOR, 32-BIT, 100 NXP USA Inc. |
172 | - |
RFQ |
483-BCBGA, FCCBGA | Tray | - | Obsolete | PowerPC G4 | 1 Core, 32-Bit | 1GHz | Multimedia; SIMD | - | No | - | - | - | - | 1.5V, 1.8V, 2.5V | -40°C ~ 105°C (TA) | - | |
|
MCIMX6Z0DVM09ABIC MPU I.MX6ULZ 900MHZ 289MAPBGA NXP USA Inc. |
2,954 | - |
RFQ |
Ficha técnica |
289-LFBGA | Tray | i.MX6 | Active | ARM® Cortex®-A7 | 1 Core, 32-Bit | 900MHz | Multimedia; NEON™ SIMD | LPDDR2, DDR3, DDR3L | No | Keypad | - | - | USB 2.0 OTG + PHY (2) | - | 0°C ~ 95°C (TJ) | A-HAB, ARM TZ, CSU, SJC, SNVS |
|
|
MCIMX6Y2DVM05ABI.MX6ULL ROM PERF ENHAN NXP USA Inc. |
2,568 | - |
RFQ |
Ficha técnica |
289-LFBGA | Tray | i.MX6 | Active | ARM® Cortex®-A7 | 1 Core, 32-Bit | 528MHz | Multimedia; NEON™ MPE | LPDDR2, DDR3, DDR3L | No | Electrophoretic, LCD | 10/100Mbps (2) | - | USB 2.0 OTG + PHY (2) | 1.8V, 2.8V, 3.3V | 0°C ~ 95°C (TJ) | A-HAB, ARM TZ, CSU, SJC, SNVS |
|
MCIMX6D6AVT10ADIC MPU I.MX6D 1.0GHZ 624FCBGA NXP USA Inc. |
2,607 | - |
RFQ |
Ficha técnica |
624-FBGA, FCBGA | Tray | i.MX6D | Active | ARM® Cortex®-A9 | 2 Core, 32-Bit | 1.0GHz | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | -40°C ~ 125°C (TJ) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
|
MC7448HX1400NDIC MPU MPC74XX 1.4GHZ 360FCCBGA NXP USA Inc. |
2,449 | - |
RFQ |
Ficha técnica |
360-BCBGA, FCCBGA | Tray | MPC74xx | Last Time Buy | PowerPC G4 | 1 Core, 32-Bit | 1.4GHz | Multimedia; SIMD | - | No | - | - | - | - | 1.5V, 1.8V, 2.5V | 0°C ~ 105°C (TA) | - |
|
MPC8321VRADDCAIC MPU MPC83XX 266MHZ 516BGA NXP USA Inc. |
3,508 | - |
RFQ |
Ficha técnica |
516-BBGA | Tray | MPC83xx | Active | PowerPC e300c2 | 1 Core, 32-Bit | 266MHz | Communications; QUICC Engine | DDR, DDR2 | No | - | 10/100Mbps (3) | - | USB 2.0 (1) | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - |
|
|
MPC8247CVRMIBAIC MPU MPC82XX 266MHZ 516BGA NXP USA Inc. |
2,599 | - |
RFQ |
Ficha técnica |
516-BBGA | Tray | MPC82xx | Active | PowerPC G2_LE | 1 Core, 32-Bit | 266MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | 10/100Mbps (2) | - | USB 2.0 (1) | 3.3V | -40°C ~ 105°C (TA) | - |
|
MCIMX6DP7CVT8ABIC MPU I.MX6DP ENHAN 624FCBGA NXP USA Inc. |
3,167 | - |
RFQ |
Ficha técnica |
624-FBGA, FCBGA | Tray | i.MX6DP | Active | ARM® Cortex®-A9 | 2 Core, 32-Bit | 800MHz | Multimedia; NEON™ SIMD | LPDDR2, DDR3L, DDR3 | Yes | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | 1.8V, 2.5V, 2.8V, 3.3V | -40°C ~ 105°C (TA) | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS |
|
LS1043ASE7QQBQORIQ 4XCPU 64-BIT ARM ARCH 1. NXP USA Inc. |
3,872 | - |
RFQ |
Ficha técnica |
621-FBGA, FCBGA | Tray | QorIQ® Layerscape | Active | ARM® Cortex®-A53 | 4 Core, 64-Bit | 1.6GHz | - | DDR3L, DDR4 | - | - | 1GbE (7) or 10GbE (1) & 1GbE (5) | SATA 6Gbps (1) | USB 3.0 (3) + PHY | - | 0°C ~ 105°C | Secure Boot, TrustZone® |
|
MPC8347VRAGDBIC MPU MPC83XX 400MHZ 620BGA NXP USA Inc. |
3,256 | - |
RFQ |
Ficha técnica |
620-BBGA Exposed Pad | Tray | MPC83xx | Active | PowerPC e300 | 1 Core, 32-Bit | 400MHz | - | DDR | No | - | 10/100/1000Mbps (2) | - | USB 2.0 + PHY (2) | 2.5V, 3.3V | 0°C ~ 105°C (TA) | - |
|
T1020NXE7MQBIC SOC 2CORE 1200MHZ SW 780FCBGA NXP USA Inc. |
2,354 | - |
RFQ |
Ficha técnica |
780-FBGA, FCBGA | Bulk | QorIQ T1 | Active | PowerPC e5500 | 2 Core, 64-Bit | 1.4GHz | - | DDR3L/4 | No | - | 1Gbps (12) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | - | -40°C ~ 105°C (TA) | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage |
|
T4241NXN7TTBQORIQ 64B POWER 24X 1.8GHZ THR NXP USA Inc. |
3,866 | - |
RFQ |
Ficha técnica |
1932-BBGA, FCBGA | Tray | QorIQ T4 | Active | PowerPC e6500 | 24 Core, 64-Bit | 1.8GHz | - | DDR3, DDR3L | No | - | 1Gbps (13), 10Gbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | 1.8V, 2.5V | -40°C ~ 105°C (TA) | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage |
|
MCIMX6G2DVK05AA-NXPI.MX 32 BIT MPU, ARM CORTEX-A7 C NXP USA Inc. |
544 | - |
RFQ |
Ficha técnica |
272-LFBGA | Bulk | i.MX6 | Active | ARM® Cortex®-A7 | 1 Core, 32-Bit | 528MHz | Multimedia; NEON™ SIMD | LPDDR2, DDR3, DDR3L | No | LCD, LVDS | 10/100Mbps (1) | - | USB 2.0 + PHY (1) | 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V | 0°C ~ 95°C (TJ) | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS |
|
|
MCIMX6G3DVK05AA-NXPI.MX 32 BIT MPU, ARM CORTEX-A7 C NXP USA Inc. |
683 | - |
RFQ |
Ficha técnica |
- | Bulk | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
MPC859DSLVR66A-NXPPOWERQUICC 32 BIT POWER ARCHITEC NXP USA Inc. |
2,827 | - |
RFQ |
Ficha técnica |
- | Bulk | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
SVF311R3K1CKU2IC MCU 32BIT ROMLESS 176LQFP NXP USA Inc. |
2,521 | - |
RFQ |
Ficha técnica |
176-LQFP Exposed Pad | Bulk | Vybrid, VF3xxR | Active | ARM® Cortex®-A5 | 1 Core, 32-Bit | 266MHz | Multimedia; NEON™ MPE | LPDDR2, DDR3, DRAM | No | DCU, GPU, LCD, VideoADC, VIU | 10/100Mbps (2) | - | USB 2.0 OTG + PHY (1) | 3.3V | -40°C ~ 85°C (TA) | ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG |
|
|
MPC880CVR66-NXPPOWERQUICC 32 BIT POWER ARCHITEC NXP USA Inc. |
3,792 | - |
RFQ |
Ficha técnica |
357-BBGA | Tray | - | Active | MPC8xx | 1 Core, 32-Bit | 66MHz | Communications; CPM | DRAM | No | - | 10Mbps (2), 10/100Mbps (2) | - | USB 2.0 (1) | 3.3V | -40°C ~ 100°C (TA) | Cryptography |
|
MCIMX6X3EVN10ABIC MPU I.MX6SX 1GHZ 400MAPBGA NXP USA Inc. |
2,373 | - |
RFQ |
Ficha técnica |
400-LFBGA | Tray | i.MX6SX | Active | ARM® Cortex®-A9, ARM® Cortex®-M4 | 2 Core, 32-Bit | 227MHz, 1GHz | Multimedia; NEON™ MPE | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (2) | - | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | 1.8V, 2.5V, 2.8V, 3.15V | -20°C ~ 105°C (TJ) | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE |
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