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Integrado - Microprocesadores
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Package/Case | Packaging | Series | ProductStatus | CoreProcessor | NumberofCores/BusWidth | Speed | Co-Processors/DSP | RAMControllers | GraphicsAcceleration | Display&InterfaceControllers | Ethernet | SATA | USB | Voltage-I/O | OperatingTemperature | SecurityFeatures |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
ATSAMA5D27C-LD1G-CURCORTEX-A5 MPU 1GBIT LPDDR2 BGA I Microchip Technology |
3,579 | - |
RFQ |
Ficha técnica |
361-TFBGA | Tape & Reel (TR) | SAMA5D2 | Active | ARM® Cortex®-A5 | 1 Core, 32-Bit | 500MHz | Multimedia; NEON™ MPE | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | Yes | Keyboard, LCD, Touchscreen | 10/100Mbps (1) | - | USB 2.0 + HSIC | 3.3V | -40°C ~ 85°C (TA) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC |
|
ATSAMA5D27C-LD2G-CURCORTEX-A5 MPU 2GBIT LPDDR2 BGA I Microchip Technology |
2,497 | - |
RFQ |
Ficha técnica |
361-TFBGA | Tape & Reel (TR) | SAMA5D2 | Active | ARM® Cortex®-A5 | 1 Core, 32-Bit | 500MHz | Multimedia; NEON™ MPE | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | Yes | Keyboard, LCD, Touchscreen | 10/100Mbps (1) | - | USB 2.0 + HSIC | 3.3V | -40°C ~ 85°C (TA) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC |
|
RM7065C-466G-D004MICROPROCESSOR Microchip Technology |
3,819 | - |
RFQ |
- | Tray | - | Active | - | 1 Core, 64-Bit | 466MHz | - | DDR, SDRAM | - | - | - | - | - | 2.5V, 3.3V | - | - | |
|
|
RM7065C-600G-D004MICROPROCESSOR Microchip Technology |
3,842 | - |
RFQ |
- | Tray | - | Active | - | 1 Core, 64-Bit | 600MHz | - | DDR, SDRAM | - | - | - | - | - | 2.5V, 3.3V | - | - | |
|
AT75C220-C256IC MPU SIAP 40MHZ 256BGA Microchip Technology |
3,471 | - |
RFQ |
Ficha técnica |
256-LFBGA | Tray | SIAP™ | Obsolete | ARM7TDMI | 1 Core, 32-Bit | 40MHz | Signal Processing; OakDSP | SDRAM | No | - | 10/100Mbps (2) | - | - | 3.3V | - | - |
|
AT75C220-Q208IC MPU SIAP 40MHZ 208QFP Microchip Technology |
3,692 | - |
RFQ |
Ficha técnica |
208-BFQFP | Tray | SIAP™ | Obsolete | ARM7TDMI | 1 Core, 32-Bit | 40MHz | Signal Processing; OakDSP | SDRAM | No | - | 10/100Mbps (2) | - | - | 3.3V | - | - |
|
AT75C310-Q160IC SIAP ARM/THUMB OAKDSP 160QFP Microchip Technology |
2,048 | - |
RFQ |
Ficha técnica |
160-BQFP | Tray | SIAP™ | Obsolete | ARM7TDMI | 1 Core, 32-Bit | 40MHz | Signal Processing; OakDSP | SDRAM | No | - | - | - | - | 3.3V | - | - |
|
AT91SAM9261-CJIC MCU 32BIT 32KB ROM 217BGA Microchip Technology |
3,596 | - |
RFQ |
Ficha técnica |
217-LFBGA | Tray | AT91SAM | Obsolete | ARM926EJ-S | 1 Core, 32-Bit | 190MHz | - | SDRAM, SRAM | No | LCD | - | - | USB 2.0 (2) | 3.0V, 3.3V | -40°C ~ 85°C (TA) | - |
|
|
PCX7447AVGH1000NBIC MPU POWERPC 1.0GHZ 360CBGA Microchip Technology |
2,112 | - |
RFQ |
Ficha técnica |
360-BCBGA | Tray | - | Obsolete | PowerPC | 1 Core, 32-Bit | 1.0GHz | - | - | No | - | - | - | - | 1.1V, 1.3V | -40°C ~ 110°C (TJ) | - |
|
|
PCX7447AVGH1167NBIC MPU POWERPC 1.167GHZ 360CBGA Microchip Technology |
2,468 | - |
RFQ |
Ficha técnica |
360-BCBGA | Tray | - | Obsolete | PowerPC | 1 Core, 32-Bit | 1.167GHZ | - | - | No | - | - | - | - | 1.1V, 1.3V | -40°C ~ 110°C (TJ) | - |
|
|
PCX7457VGH1000NCIC MPU POWERPC G4 1.0GHZ 483CBGA Microchip Technology |
2,002 | - |
RFQ |
Ficha técnica |
483-BCBGA Exposed Pad | Tray | - | Obsolete | PowerPC G4 | 1 Core, 32-Bit | 1.0GHz | - | - | No | - | - | - | - | 1.8V, 2.5V | -40°C ~ 110°C (TJ) | - |
|
|
PCX7457VGU933NCIC MPU POWERPC G4 933MHZ 360CBGA Microchip Technology |
2,608 | - |
RFQ |
Ficha técnica |
360-BCBGA | Tray | - | Obsolete | PowerPC G4 | 1 Core, 32-Bit | 933MHz | - | - | No | - | - | - | - | 1.8V, 2.5V | -40°C ~ 110°C (TJ) | - |
|
|
PCX745BVZFU300LEIC MPU POWERPC 300MHZ 255BGA Microchip Technology |
3,035 | - |
RFQ |
Ficha técnica |
255-BBGA Exposed Pad | Tray | - | Obsolete | PowerPC | 1 Core, 32-Bit | 300MHz | - | - | No | - | - | - | - | 2.5V, 3.3V | -40°C ~ 110°C (TJ) | - |
|
|
PCX745BVZFU350LEIC MPU POWERPC 350MHZ 255BGA Microchip Technology |
3,349 | - |
RFQ |
Ficha técnica |
255-BBGA Exposed Pad | Tray | - | Obsolete | PowerPC | 1 Core, 32-Bit | 350MHz | - | - | No | - | - | - | - | 2.5V, 3.3V | -40°C ~ 110°C (TJ) | - |
|
|
PCX755BVZFU300LEIC MPU POWERPC 300MHZ 360BGA Microchip Technology |
3,639 | - |
RFQ |
Ficha técnica |
360-BBGA Exposed Pad | Tray | - | Obsolete | PowerPC | 1 Core, 32-Bit | 300MHz | - | - | No | - | - | - | - | 2.5V, 3.3V | -40°C ~ 110°C (TJ) | - |
|
|
PCX755BVZFU350LEIC MPU POWERPC 350MHZ 360BGA Microchip Technology |
2,151 | - |
RFQ |
Ficha técnica |
360-BBGA Exposed Pad | Tray | - | Obsolete | PowerPC | 1 Core, 32-Bit | 350MHz | - | - | No | - | - | - | - | 2.5V, 3.3V | -40°C ~ 110°C (TJ) | - |
|
|
PCX755CVZFU400LEIC MPU POWERPC 400MHZ 360BGA Microchip Technology |
3,835 | - |
RFQ |
Ficha técnica |
360-BBGA Exposed Pad | Tray | - | Obsolete | PowerPC | 1 Core, 32-Bit | 400MHz | - | - | No | - | - | - | - | 2.5V, 3.3V | -40°C ~ 110°C (TJ) | - |
|
|
PCX8240VTPU200EIC MPU 603E 200MHZ 352TBGA Microchip Technology |
2,725 | - |
RFQ |
Ficha técnica |
352-LBGA | Tray | - | Obsolete | PowerPC 603e | 1 Core, 32-Bit | 200MHz | - | DRAM, SDRAM | No | - | - | - | - | 3.3V | -40°C ~ 110°C (TJ) | - |
|
|
PCX8240VTPU200EZD3IC MPU 603E 200MHZ 352TBGA Microchip Technology |
2,117 | - |
RFQ |
Ficha técnica |
352-LBGA | Tray | - | Obsolete | PowerPC 603e | 1 Core, 32-Bit | 200MHz | - | DRAM, SDRAM | No | - | - | - | - | 3.3V | -40°C ~ 110°C (TJ) | - |
|
|
TS68020MF1-16IC MPU 68000 16.67MHZ 132CQFP Microchip Technology |
2,410 | - |
RFQ |
Ficha técnica |
132-BCQFP | Tray | - | Obsolete | 68000 | 1 Core, 32-Bit | 16.67MHz | - | - | No | - | - | - | - | 5.0V | -55°C ~ 125°C (TC) | - |
- 1500+ Promedio diario de RFQ
- 20,000.000 Unidad estándar de producto
- 1800+ Fabricantes en todo el mundo
- 15,000+ Almacén en inventario
