Integrado - Microcontroladores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Package/Case Packaging Series ProductStatus CoreProcessor CoreSize Speed Connectivity Peripherals NumberofI/O ProgramMemorySize ProgramMemoryType EEPROMSize RAMSize Voltage-Supply(Vcc/Vdd) DataConverters OscillatorType OperatingTemperature MountingType
MC9S12A128CFUE

MC9S12A128CFUE

IC MCU 16BIT 128KB FLASH 80QFP

NXP USA Inc.
2,643 -

RFQ

MC9S12A128CFUE

Ficha técnica

80-QFP Tray HCS12 RoHS 25MHz 4K x 8 16-Bit 2K x 8 Active PWM, WDT I²C, SCI, SPI Surface Mount 59 HCS12 A/D 16x10b Internal 128KB (128K x 8) FLASH -40°C ~ 85°C (TA)
MC9S12A128CPVE

MC9S12A128CPVE

IC MCU 16BIT 128KB FLASH 112LQFP

NXP USA Inc.
3,943 -

RFQ

MC9S12A128CPVE

Ficha técnica

112-LQFP Tray HCS12 RoHS 25MHz 4K x 8 16-Bit 2K x 8 Active PWM, WDT I²C, SCI, SPI Surface Mount 91 HCS12 A/D 16x10b Internal 128KB (128K x 8) FLASH -40°C ~ 85°C (TA)
MC9S12DG128CFUER

MC9S12DG128CFUER

IC MCU 16BIT 128KB FLASH 80QFP

NXP USA Inc.
2,942 -

RFQ

MC9S12DG128CFUER

Ficha técnica

80-QFP Tape & Reel (TR),Cut Tape (CT) HCS12 RoHS 25MHz 8K x 8 16-Bit 2K x 8 Active PWM, WDT CANbus, I²C, SCI, SPI Surface Mount 59 HCS12 A/D 16x10b Internal 128KB (128K x 8) FLASH -40°C ~ 85°C (TA)
MCF54418CMJ250

MCF54418CMJ250

IC MCU 32BIT ROMLESS 256MAPBGA

NXP USA Inc.
3,067 -

RFQ

MCF54418CMJ250

Ficha técnica

256-LBGA Tray MCF5441x RoHS 250MHz 64K x 8 32-Bit - Active DMA, PWM, WDT 1-Wire®, CANbus, EBI/EMI, Ethernet, I²C, SmartCard, SPI, SSI, UART/USART, USB, USB OTG Surface Mount 87 Coldfire V4 A/D 8x12b; D/A 2x12b Internal - ROMless -40°C ~ 85°C (TA)
MC56F8346VFVE

MC56F8346VFVE

IC MCU 16BIT 128KB FLASH 144LQFP

NXP USA Inc.
3,065 -

RFQ

MC56F8346VFVE

Ficha técnica

144-LQFP Tray 56F8xxx RoHS 60MHz 6K x 16 16-Bit - Active POR, PWM, Temp Sensor, WDT CANbus, EBI/EMI, SCI, SPI Surface Mount 62 56800E A/D 16x12b External 128KB (64K x 16) FLASH -40°C ~ 105°C (TA)
DSP56F805FV80E

DSP56F805FV80E

IC MCU 16BIT 64KB FLASH 144LQFP

NXP USA Inc.
3,910 -

RFQ

DSP56F805FV80E

Ficha técnica

144-LQFP Tray 56F8xx RoHS 80MHz 2K x 16 16-Bit - Active POR, PWM, WDT CANbus, EBI/EMI, SCI, SPI Surface Mount 32 56800 A/D 8x12b External 64KB (32K x 16) FLASH -40°C ~ 85°C (TA)
MC56F8345MFGE

MC56F8345MFGE

IC MCU 16BIT 128KB FLASH 128LQFP

NXP USA Inc.
3,782 -

RFQ

MC56F8345MFGE

Ficha técnica

128-LQFP Tray 56F8xxx RoHS 60MHz 6K x 16 16-Bit - Active POR, PWM, Temp Sensor, WDT CANbus, EBI/EMI, SCI, SPI Surface Mount 49 56800E A/D 16x12b External 128KB (64K x 16) FLASH -40°C ~ 125°C (TA)
MC9S12XDP512CAL

MC9S12XDP512CAL

IC MCU 16BIT 512KB FLASH 112LQFP

NXP USA Inc.
2,212 -

RFQ

MC9S12XDP512CAL

Ficha técnica

112-LQFP Tray HCS12X RoHS 80MHz 32K x 8 16-Bit 4K x 8 Active LVD, POR, PWM, WDT CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI Surface Mount 91 HCS12X A/D 16x10b External 512KB (512K x 8) FLASH -40°C ~ 85°C (TA)
MKE02Z32VLC2

MKE02Z32VLC2

IC MCU 32BIT 32KB FLASH 32LQFP

NXP USA Inc.
2,457 -

RFQ

MKE02Z32VLC2

Ficha técnica

32-LQFP Tray Kinetis KE02 RoHS 20MHz 4K x 8 32-Bit 256 x 8 Active LVD, PWM, WDT I²C, SPI, UART/USART Surface Mount 28 ARM® Cortex®-M0+ A/D 16x12b; D/A 2x6b Internal 32KB (32K x 8) FLASH -40°C ~ 105°C (TA)
MC9S12A256CPVE

MC9S12A256CPVE

IC MCU 16BIT 256KB FLASH 112LQFP

NXP USA Inc.
3,176 -

RFQ

MC9S12A256CPVE

Ficha técnica

112-LQFP Tray HCS12 RoHS 25MHz 12K x 8 16-Bit 4K x 8 Active PWM, WDT I²C, SCI, SPI Surface Mount 91 HCS12 A/D 8x10b Internal 256KB (256K x 8) FLASH -40°C ~ 85°C (TA)
SPC5746RK1MMT5

SPC5746RK1MMT5

IC MCU 32BIT 4MB FLASH 252MAPBGA

NXP USA Inc.
2,524 -

RFQ

SPC5746RK1MMT5

Ficha técnica

252-LFBGA Tray Automotive, AEC-Q100 MPC57xx RoHS 200MHz 256K x 8 32-Bit Tri-Core - Active DMA, LVD, POR, Zipwire CANbus, Ethernet, I²C, LINbus, SCI, SPI, UART/USART Surface Mount - e200z4 A/D 12b SAR, 16b Sigma-Delta Internal 4MB (4M x 8) FLASH -40°C ~ 125°C (TA)
MC9S12DG256CFUE

MC9S12DG256CFUE

IC MCU 16BIT 256KB FLASH 80QFP

NXP USA Inc.
3,759 -

RFQ

MC9S12DG256CFUE

Ficha técnica

80-QFP Tray HCS12 RoHS 25MHz 12K x 8 16-Bit 4K x 8 Active PWM, WDT CANbus, I²C, SCI, SPI Surface Mount 59 HCS12 A/D 16x10b Internal 256KB (256K x 8) FLASH -40°C ~ 85°C (TA)
DSP56F807PY80E

DSP56F807PY80E

IC MCU 16BIT 120KB FLASH 160LQFP

NXP USA Inc.
3,293 -

RFQ

DSP56F807PY80E

Ficha técnica

160-LQFP Tray 56F8xx RoHS 80MHz 4K x 16 16-Bit - Active POR, PWM, WDT CANbus, EBI/EMI, SCI, SPI Surface Mount 32 56800 A/D 16x12b External 120KB (60K x 16) FLASH -40°C ~ 85°C (TA)
MC9S12XDP512MAL

MC9S12XDP512MAL

IC MCU 16BIT 512KB FLASH 112LQFP

NXP USA Inc.
900 -

RFQ

MC9S12XDP512MAL

Ficha técnica

112-LQFP Tray HCS12X RoHS 80MHz 32K x 8 16-Bit 4K x 8 Active LVD, POR, PWM, WDT CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI Surface Mount 91 HCS12X A/D 16x10b External 512KB (512K x 8) FLASH -40°C ~ 125°C (TA)
MC56F8356VFVE

MC56F8356VFVE

IC MCU 16BIT 256KB FLASH 144LQFP

NXP USA Inc.
3,409 -

RFQ

MC56F8356VFVE

Ficha técnica

144-LQFP Tray 56F8xxx RoHS 60MHz 10K x 16 16-Bit - Active POR, PWM, Temp Sensor, WDT CANbus, EBI/EMI, SCI, SPI Surface Mount 62 56800E A/D 16x12b External 256KB (128K x 16) FLASH -40°C ~ 105°C (TA)
MK22FN512VLH12

MK22FN512VLH12

IC MCU 32BIT 512KB FLASH 64LQFP

NXP USA Inc.
3,047 -

RFQ

MK22FN512VLH12

Ficha técnica

64-LQFP Tray Kinetis K20 RoHS 120MHz 128K x 8 32-Bit - Active DMA, I²S, LVD, POR, PWM, WDT I²C, IrDA, SPI, UART/USART, USB, USB OTG Surface Mount 40 ARM® Cortex®-M4 A/D 22x16b; D/A 2x12b Internal 512KB (512K x 8) FLASH -40°C ~ 105°C (TA)
MC9S12XDP512MAG

MC9S12XDP512MAG

IC MCU 16BIT 512KB FLASH 144LQFP

NXP USA Inc.
2,690 -

RFQ

MC9S12XDP512MAG

Ficha técnica

144-LQFP Tray HCS12X RoHS 80MHz 32K x 8 16-Bit 4K x 8 Active LVD, POR, PWM, WDT CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI Surface Mount 119 HCS12X A/D 24x10b External 512KB (512K x 8) FLASH -40°C ~ 125°C (TA)
MC68HC16Z1CEH16

MC68HC16Z1CEH16

IC MCU 16BIT ROMLESS 132PQFP

NXP USA Inc.
3,247 -

RFQ

MC68HC16Z1CEH16

Ficha técnica

132-BQFP Bumpered Tray HC16 RoHS 16MHz 1K x 8 16-Bit - Not For New Designs POR, PWM, WDT EBI/EMI, SCI, SPI Surface Mount 16 CPU16 A/D 8x10b Internal - ROMless -40°C ~ 85°C (TA)
MC9S12DG256MPVE

MC9S12DG256MPVE

IC MCU 16BIT 256KB FLASH 112LQFP

NXP USA Inc.
3,960 -

RFQ

MC9S12DG256MPVE

Ficha técnica

112-LQFP Tray HCS12 RoHS 25MHz 12K x 8 16-Bit 4K x 8 Active PWM, WDT CANbus, I²C, SCI, SPI Surface Mount 91 HCS12 A/D 16x10b Internal 256KB (256K x 8) FLASH -40°C ~ 125°C (TA)
MC68LK332ACAG16

MC68LK332ACAG16

IC MCU 32BIT ROMLESS 144LQFP

NXP USA Inc.
2,643 -

RFQ

MC68LK332ACAG16

Ficha técnica

144-LQFP Tray M683xx RoHS 16.78MHz 2K x 8 32-Bit - Not For New Designs POR, PWM, WDT EBI/EMI, SCI, SPI, UART/USART Surface Mount 15 CPU32 - Internal - ROMless -40°C ~ 85°C (TA)
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1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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