Integrado - Microcontroladores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Package/Case Packaging Series ProductStatus CoreProcessor CoreSize Speed Connectivity Peripherals NumberofI/O ProgramMemorySize ProgramMemoryType EEPROMSize RAMSize Voltage-Supply(Vcc/Vdd) DataConverters OscillatorType OperatingTemperature MountingType
MC9S08PA4AVTGR

MC9S08PA4AVTGR

IC MCU 8BIT 4KB FLASH 16TSSOP

NXP USA Inc.
3,387 -

RFQ

MC9S08PA4AVTGR

Ficha técnica

16-TSSOP (0.173", 4.40mm Width) Tape & Reel (TR),Cut Tape (CT) S08 RoHS 20MHz 512 x 8 8-Bit 128 x 8 Active LVD, POR, PWM, WDT LINbus, SPI, UART/USART Surface Mount 14 S08 A/D 8x12b Internal 4KB (4K x 8) FLASH -40°C ~ 105°C (TA)
MKL02Z32CAF4R

MKL02Z32CAF4R

IC MCU 32BIT 32KB FLASH 20WLCSP

NXP USA Inc.
3,681 -

RFQ

MKL02Z32CAF4R

Ficha técnica

20-UFBGA, WLCSP Tape & Reel (TR),Cut Tape (CT) Kinetis KL02 RoHS 48MHz 4K x 8 32-Bit - Active Brown-out Detect/Reset, LVD, POR, PWM, WDT I²C, SPI, UART/USART Surface Mount 18 ARM® Cortex®-M0+ A/D 10x12b Internal 32KB (32K x 8) FLASH -40°C ~ 85°C (TA)
LPC804M101JDH20FP

LPC804M101JDH20FP

IC MCU 32BIT 32KB FLASH 20TSSOP

NXP USA Inc.
3,843 -

RFQ

LPC804M101JDH20FP

Ficha técnica

20-TSSOP (0.173", 4.40mm Width) Tube LPC80xM RoHS 15MHz 4K x 8 32-Bit - Active Brown-out Detect/Reset, POR, PWM, WDT I²C, SPI, UART/USART Surface Mount 17 ARM® Cortex®-M0+ A/D 12x12b Internal 32KB (32K x 8) FLASH -40°C ~ 105°C (TA)
LPC845M301JHI33Y

LPC845M301JHI33Y

IC MCU 32BIT 64KB FLASH 32HVQFN

NXP USA Inc.
2,822 -

RFQ

LPC845M301JHI33Y

Ficha técnica

32-VFQFN Exposed Pad Tape & Reel (TR),Cut Tape (CT) LPC84x RoHS 30MHz 16K x 8 32-Bit - Active Brown-out Detect/Reset, Cap Sense, DMA, POR, PWM, WDT I²C, SPI, UART/USART Surface Mount 29 ARM® Cortex®-M0+ A/D 12x12b; D/A 1x10b External, Internal 64KB (64K x 8) FLASH -40°C ~ 105°C (TA)
LPC824M201JDH20J

LPC824M201JDH20J

IC MCU 32BIT 32KB FLASH 20TSSOP

NXP USA Inc.
2,329 -

RFQ

LPC824M201JDH20J

Ficha técnica

20-TSSOP (0.173", 4.40mm Width) Tape & Reel (TR),Cut Tape (CT) LPC82x RoHS 30MHz 8K x 8 32-Bit - Active Brown-out Detect/Reset, DMA, POR, PWM, WDT I²C, SPI, UART/USART Surface Mount 16 ARM® Cortex®-M0+ A/D 5x12b Internal 32KB (32K x 8) FLASH -40°C ~ 105°C (TA)
MKE06Z128VLH4

MKE06Z128VLH4

IC MCU 32BIT 128KB FLASH 64LQFP

NXP USA Inc.
2,344 -

RFQ

MKE06Z128VLH4

Ficha técnica

64-LQFP Tray Kinetis KE06 RoHS 48MHz 16K x 8 32-Bit - Active LVD, PWM, WDT CANbus, I²C, SPI, UART/USART Surface Mount 58 ARM® Cortex®-M0+ A/D 16x12b; D/A 2x6b Internal 128KB (128K x 8) FLASH -40°C ~ 105°C (TA)
MKL17Z256VMP4

MKL17Z256VMP4

IC MCU 32BIT 256KB FLSH 64MAPBGA

NXP USA Inc.
3,946 -

RFQ

MKL17Z256VMP4

Ficha técnica

64-LFBGA Tray Kinetis KL1 RoHS 48MHz 32K x 8 32-Bit - Active Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT I²C, LINbus, SPI, UART/USART Surface Mount 54 ARM® Cortex®-M0+ A/D 20x16b; D/A 1x12b Internal 256KB (256K x 8) FLASH -40°C ~ 105°C (TA)
MKE02Z16VLC4

MKE02Z16VLC4

IC MCU 32BIT 16KB FLASH 32LQFP

NXP USA Inc.
3,318 -

RFQ

MKE02Z16VLC4

Ficha técnica

32-LQFP Tray Kinetis KE02 RoHS 40MHz 2K x 8 32-Bit 256 x 8 Active LVD, PWM, WDT I²C, SPI, UART/USART Surface Mount 28 ARM® Cortex®-M0+ A/D 16x12b; D/A 2x6b Internal 16KB (16K x 8) FLASH -40°C ~ 105°C (TA)
MC9RS08KA2CSC

MC9RS08KA2CSC

IC MCU 8BIT 2KB FLASH 8SOIC

NXP USA Inc.
3,771 -

RFQ

MC9RS08KA2CSC

Ficha técnica

8-SOIC (0.154", 3.90mm Width) Tube RS08 RoHS 10MHz 63 x 8 8-Bit - Active LVD, POR, WDT - Surface Mount 4 RS08 - Internal 2KB (2K x 8) FLASH -40°C ~ 85°C (TA)
LPC11U68JBD64K

LPC11U68JBD64K

IC MCU 32BIT 256KB FLASH 64LQFP

NXP USA Inc.
3,837 -

RFQ

LPC11U68JBD64K

Ficha técnica

64-LQFP Tray LPC11Uxx RoHS 50MHz 36K x 8 32-Bit 4K x 8 Active Brown-out Detect/Reset, DMA, POR, PWM, WDT I²C, Microwire, SmartCard, SPI, SSP, UART/USART, USB Surface Mount 48 ARM® Cortex®-M0+ A/D 10x12b Internal 256KB (256K x 8) FLASH -40°C ~ 105°C (TA)
MC9S08QG8CFFE

MC9S08QG8CFFE

IC MCU 8BIT 8KB FLASH 16QFN

NXP USA Inc.
2,073 -

RFQ

MC9S08QG8CFFE

Ficha técnica

16-VQFN Exposed Pad Tray S08 RoHS 20MHz 512 x 8 8-Bit - Active LVD, POR, PWM, WDT I²C, SCI, SPI Surface Mount 12 S08 A/D 8x10b Internal 8KB (8K x 8) FLASH -40°C ~ 85°C (TA)
MC9S08GT16ACFBER

MC9S08GT16ACFBER

IC MCU 8BIT 16KB FLASH 44QFP

NXP USA Inc.
2,994 -

RFQ

MC9S08GT16ACFBER

Ficha técnica

44-QFP Tape & Reel (TR),Cut Tape (CT) S08 RoHS 40MHz 2K x 8 8-Bit - Active LVD, POR, PWM, WDT I²C, SCI, SPI Surface Mount 36 S08 A/D 8x10b Internal 16KB (16K x 8) FLASH -40°C ~ 85°C (TA)
MKE02Z64VLD4

MKE02Z64VLD4

IC MCU 32BIT 64KB FLASH 44LQFP

NXP USA Inc.
2,261 -

RFQ

MKE02Z64VLD4

Ficha técnica

44-LQFP Tray Kinetis KE02 RoHS 40MHz 4K x 8 32-Bit 256 x 8 Active LVD, PWM, WDT I²C, SPI, UART/USART Surface Mount 37 ARM® Cortex®-M0+ A/D 16x12b; D/A 2x6b Internal 64KB (64K x 8) FLASH -40°C ~ 105°C (TA)
S9KEAZN64AMLH

S9KEAZN64AMLH

IC MCU 32BIT 64KB FLASH 64LQFP

NXP USA Inc.
3,718 -

RFQ

S9KEAZN64AMLH

Ficha técnica

64-LQFP Tray Kinetis KEA RoHS 40MHz 4K x 8 32-Bit 256 x 8 Active LVD, POR, PWM, WDT I²C, LINbus, SPI, UART/USART Surface Mount 57 ARM® Cortex®-M0+ A/D 16x12b Internal 64KB (64K x 8) FLASH -40°C ~ 125°C (TA)
MCHC908QY4CDWE

MCHC908QY4CDWE

IC MCU 8BIT 4KB FLASH 16SOIC

NXP USA Inc.
2,055 -

RFQ

MCHC908QY4CDWE

Ficha técnica

16-SOIC (0.295", 7.50mm Width) Tube HC08 RoHS 8MHz 128 x 8 8-Bit - Not For New Designs LVD, POR, PWM - Surface Mount 13 HC08 A/D 4x8b Internal 4KB (4K x 8) FLASH -40°C ~ 85°C (TA)
MC9S08QG8CDTE

MC9S08QG8CDTE

IC MCU 8BIT 8KB FLASH 16TSSOP

NXP USA Inc.
2,840 -

RFQ

MC9S08QG8CDTE

Ficha técnica

16-TSSOP (0.173", 4.40mm Width) Tube S08 RoHS 20MHz 512 x 8 8-Bit - Active LVD, POR, PWM, WDT I²C, SCI, SPI Surface Mount 12 S08 A/D 8x10b Internal 8KB (8K x 8) FLASH -40°C ~ 85°C (TA)
MKL17Z256VFT4

MKL17Z256VFT4

IC MCU 32BIT 256KB FLASH 48QFN

NXP USA Inc.
3,180 -

RFQ

MKL17Z256VFT4

Ficha técnica

48-UFQFN Exposed Pad Tray Kinetis KL1 RoHS 48MHz 32K x 8 32-Bit - Active Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT I²C, LINbus, SPI, UART/USART Surface Mount 40 ARM® Cortex®-M0+ A/D 18x16b; D/A 1x12b Internal 256KB (256K x 8) FLASH -40°C ~ 105°C (TA)
LPC1517JBD48E

LPC1517JBD48E

IC MCU 32BIT 64KB FLASH 48LQFP

NXP USA Inc.
3,516 -

RFQ

LPC1517JBD48E

Ficha técnica

48-LQFP Tray LPC15xx RoHS 72MHz 12K x 8 32-Bit 4K x 8 Active Brown-out Detect/Reset, DMA, POR, PWM, WDT CANbus, I²C, SPI, UART/USART Surface Mount 32 ARM® Cortex®-M3 A/D 16x12b Internal 64KB (64K x 8) FLASH -40°C ~ 105°C (TA)
MC9S08QD4CSCR

MC9S08QD4CSCR

IC MCU 8BIT 4KB FLASH 8SOIC

NXP USA Inc.
3,199 -

RFQ

MC9S08QD4CSCR

Ficha técnica

8-SOIC (0.154", 3.90mm Width) Tape & Reel (TR),Cut Tape (CT) S08 RoHS 16MHz 256 x 8 8-Bit - Active LVD, POR, PWM, WDT - Surface Mount 4 S08 A/D 4x10b Internal 4KB (4K x 8) FLASH -40°C ~ 85°C (TA)
LPC11E14FBD48/401,

LPC11E14FBD48/401,

IC MCU 32BIT 32KB FLASH 48LQFP

NXP USA Inc.
3,988 -

RFQ

LPC11E14FBD48/401,

Ficha técnica

48-LQFP Tray LPC11Exx RoHS 50MHz 10K x 8 32-Bit 4K x 8 Active Brown-out Detect/Reset, POR, WDT I²C, Microwire, SPI, SSI, SSP, UART/USART Surface Mount 40 ARM® Cortex®-M0 A/D 8x10b Internal 32KB (32K x 8) FLASH -40°C ~ 85°C (TA)
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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