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Integrado - Microcontroladores - Aplicación específica
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Package/Case | Packaging | Series | ProductStatus | Applications | CoreProcessor | ProgramMemoryType | ControllerSeries | RAMSize | Interface | NumberofI/O | Voltage-Supply | OperatingTemperature | MountingType |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
AT97SC3205T-X3A1610BMEM FF IND I2C TPM 28TSSOP Microchip Technology |
2,449 | - |
RFQ |
Ficha técnica |
Tube | - | Obsolete | Trusted Platform Module (TPM) | AVR | EEPROM | - | - | I²C | 4 | 3.3V | 0°C ~ 70°C | Surface Mount | |
|
|
AT97SC3205T-X3A1620BMEM FF IND I2C TPM 28TSSOP Microchip Technology |
2,029 | - |
RFQ |
Ficha técnica |
Tube | - | Obsolete | Trusted Platform Module (TPM) | AVR | EEPROM | - | - | I²C | 4 | 3.3V | 0°C ~ 70°C | Surface Mount | |
|
MEC1704Q-C1-I/SZEMBEDDED CONTROLLER 480 KB TOTAL Microchip Technology |
3,122 | - |
RFQ |
Ficha técnica |
Tray | - | Active | Keyboard and Embedded Controller | ARM® Cortex®-M4 | - | MEC170x | 480KB | ACPI, EBI/EMI, eSPI, I²C, LPC, PECI, PS/2, QSPI, SPI | 123 | 1.71V ~ 3.465V | -40°C ~ 85°C | Surface Mount | |
|
WIN840W6NHEI-300A1WP2 840W6 300MHZ,LF BALLS,PBFBUM Microchip Technology |
3,306 | - |
RFQ |
Tray | - | Obsolete | Network Processor | MIPS32® 24Kc™ | - | - | - | Ethernet, PCI, SPI, USB | - | - | - | - | ||
|
|
WIN847W6NHEI-250A1WINPATH2 847 W6 PROC 250MHZ LF Microchip Technology |
2,725 | - |
RFQ |
Tray | - | Active | Network Processor | MIPS32® 24Kc™ | - | - | - | Ethernet, PCI, SPI, USB | - | - | - | - | ||
|
|
WIN860M6NHEI-300A1WINPATH2 860M6 PROC 300MHZ LF Microchip Technology |
3,707 | - |
RFQ |
Tray | - | Obsolete | Network Processor | MIPS32® 24Kc™ | - | - | - | Ethernet, PCI, SPI, USB | - | - | - | - | ||
|
|
WIN867M6NHEI-300A1WP2 86M67 300MHZ,LF BALLS,PBFBUM Microchip Technology |
2,360 | - |
RFQ |
Tray | - | Active | Network Processor | MIPS32® 24Kc™ | - | - | - | Ethernet, PCI, SPI, USB | - | - | - | - | ||
|
|
WP3160W3NFEI-320B1WINPATH3 SLB 160 320MHZ LF Microchip Technology |
2,339 | - |
RFQ |
Tray | - | Active | Network Processor | MIPS32® 34Kc™ | SRAM | - | - | I²C, RMII, UART | - | - | - | Surface Mount | ||
|
|
WP3161R4NFEI-320B1WINPATH3 SLB 161 320MHZ LF Microchip Technology |
2,972 | - |
RFQ |
Tray | - | Active | Network Processor | MIPS32® 34Kc™ | SRAM | - | - | I²C, RMII, UART | - | - | - | Surface Mount | ||
|
|
WP34C2R4EFEI-400B2WP3 4C2R4 400MHZ,LF BALLS,PBFBUM Microchip Technology |
2,856 | - |
RFQ |
Tray | - | Active | Network Processor | MIPS32® 34Kc™ | SRAM | - | - | I²C, RMII, UART | - | - | - | Surface Mount | ||
|
|
DARR83-APKIC AUDIO BASEBAND PROC 129TFBGA Microchip Technology |
2,915 | - |
RFQ |
Ficha técnica |
Tray | - | Active | Wireless Audio | 8052 | RAM (45kB), ROM (1kB) | USB Controller | 8K x 8 | I²C, I²s, SPI, UART | - | - | - | Surface Mount | |
|
|
DARR84-APKIC AUDIO BASEBAND PROC 129TFBGA Microchip Technology |
3,226 | - |
RFQ |
Ficha técnica |
Tray | - | Obsolete | Wireless Audio | 8052 | FLASH | - | - | - | - | - | - | - | |
|
|
LX3301AQPWIC, INDUCTIVE SENSOR Microchip Technology |
3,387 | - |
RFQ |
Ficha técnica |
Bulk | Automotive, AEC-Q100 | Active | Inductive Sensor Interface | 32-Bit RISC | ROM (12kB) | - | - | Analog, PWM | - | - | -40°C ~ 125°C | Surface Mount | |
|
|
LX3302AQPWIC, INDUCTIVE SENSOR Microchip Technology |
3,258 | - |
RFQ |
Bulk | Automotive, AEC-Q100 | Active | Inductive Sensor Interface | 32-Bit RISC | ROM (12kB) | - | - | Analog, PWM | - | - | -40°C ~ 150°C | Surface Mount | ||
|
|
LX3302AQPW-TRIC, INDUCTIVE SENSOR Microchip Technology |
2,128 | - |
RFQ |
Tape & Reel (TR) | Automotive, AEC-Q100 | Active | Inductive Sensor Interface | 32-Bit RISC | ROM (12kB) | - | - | Analog, PWM | - | - | -40°C ~ 150°C | Surface Mount | ||
|
CEC1702Q-C2-I/SXCRYPTO EMBEDDED CONTROLLER Microchip Technology |
2,867 | - |
RFQ |
Ficha técnica |
Tray | - | Active | Cryptography | ARM® Cortex®-M4F | - | - | 480KB | I²C, SPI, UART | 65 | 1.71V ~ 3.465V | -40°C ~ 85°C | Surface Mount | |
|
RFPIC12F675KT-I/SSIC MCU 1KX14 RF FSK/ASK 20SSOP Microchip Technology |
3,756 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR),Cut Tape (CT) | PIC® | Last Time Buy | RKE, Security Systems | PIC | FLASH (1.75kB) | rfPIC™ | 64 x 8 | - | 6 | 2V ~ 5.5V | -40°C ~ 85°C | Surface Mount | |
|
|
AT97SC3205T-U3A13-10TPM I2C C8 REVF IND 4.4MM TSSOP Microchip Technology |
2,895 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | Trusted Platform Module (TPM) | AVR | EEPROM | - | - | I²C | 4 | 3.3V | -40°C ~ 85°C | Surface Mount | |
|
|
AT97SC3205T-U3A19-AACUST SPEC TPM 1.2 IND I2C4.4MM T Microchip Technology |
3,708 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | Trusted Platform Module (TPM) | AVR | EEPROM | - | - | I²C | 4 | 3.3V | -40°C ~ 85°C | Surface Mount | |
|
|
AT97SC3205T-X3A13-10TPM I2C C8 REVF COMM 4.4MM TSSOP Microchip Technology |
3,856 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | Trusted Platform Module (TPM) | AVR | EEPROM | - | - | I²C | 4 | 3.3V | 0°C ~ 70°C | Surface Mount |
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