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0Microcontroladores integrados, módulos FPGA con microprocesador
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | RoHS | Speed | RAM Size | Flash Size | Part Status | Co-Processor | Connector Type | Core Processor | Size / Dimension | Module/Board Type | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
TE0807-03-5AI21-AMPSOC ZYNQ USCALE 4GB DDR4 Trenz Electronic GmbH |
3,579 | - |
RFQ |
Box | RoHS | - | - | - | Active | - | - | - | - | - | - | ||
|
|
TE0808-04-9BE21-LIC MOD SOM MPSOC 4GB XCZU9EG Trenz Electronic GmbH |
3,289 | - |
RFQ |
Ficha técnica |
Box | TE0808 | RoHS | - | 4GB | 128MB | Active | - | B2B | - | - | MPU Core | - |
|
TE0808-05-9BE21-AKIC MOD SOM MPSOC 4GB DDR4 Trenz Electronic GmbH |
2,934 | - |
RFQ |
Bulk | TE0808 | RoHS | - | 2GB | 128MB | Active | - | B2B | Zynq UltraScale+ XCZU9EG-1FFVC900E | 2.05" x 2.99" (52mm x 76mm) | MPU Core | 0°C ~ 85°C | |
|
|
TE0741-03-410-2IFMODULE FPGA KINTEX Trenz Electronic GmbH |
2,140 | - |
RFQ |
Ficha técnica |
Box | RoHS | - | - | 32MB | Last Time Buy | - | Board-to-Board (BTB) Socket | Xilinx Kintex-7 FPGA XC7K410T-2FBG676I | 1.97" x 1.57" (50mm x 40mm) | FPGA Core | -40°C ~ 85°C | |
|
|
TE0745-02-92I31-AMOD SOM DDR3L 1GB Trenz Electronic GmbH |
2,048 | - |
RFQ |
Bulk | TE0745 | RoHS | - | 1GB | 64MB | Active | Zynq-7000 (Z-7045) | Board-to-Board (BTB) Socket - 480 | ARM Cortex-A9 | 2.05" x 2.99" (52mm x 76mm) | MCU, FPGA | -40°C ~ 85°C | |
|
|
TE0745-02-92I31-AKMOD SOM DDR3L 1GB Trenz Electronic GmbH |
3,522 | - |
RFQ |
Bulk | TE0745 | RoHS | - | 1GB | 64MB | Active | Zynq-7000 (Z-7045) | Board-to-Board (BTB) Socket - 480 | ARM Cortex-A9 | 2.05" x 2.99" (52mm x 76mm) | MCU, FPGA | -40°C ~ 85°C | |
|
|
TE0841-02-41C21-AIC MODULE USCALE 2GB Trenz Electronic GmbH |
2,482 | - |
RFQ |
Ficha técnica |
Bulk | TE0841 | RoHS | - | 2GB | 64MB | Active | - | B2B | Kintex UltraScale KU40 | 1.97" x 1.57" (50mm x 40mm) | MCU, FPGA | 0°C ~ 70°C |
|
|
TE0808-04-BBE21-AIC MODULE ZYNQ USCALE 2GB 128MB Trenz Electronic GmbH |
3,072 | - |
RFQ |
Bulk | TE0808 | RoHS | - | 4GB | 128MB | Active | - | B2B | Zynq UltraScale+ XCZU15EG-1FFVC900E | 2.05" x 2.99" (52mm x 76mm) | MPU Core | 0°C ~ 85°C | |
|
|
TE0808-04-BBE21-AKIC MOD SOM MPSOC 4GB ZU15G Trenz Electronic GmbH |
3,150 | - |
RFQ |
Ficha técnica |
Bulk | TE0808 | RoHS | - | 4GB | 128MB | Active | - | B2B | Zynq UltraScale+ XCZU15EG-1FFVC900E | 2.05" x 2.99" (52mm x 76mm) | MPU Core | 0°C ~ 85°C |
|
|
TE0745-02-92I31-FMOD SOM DDR3L 1GB Trenz Electronic GmbH |
2,114 | - |
RFQ |
Bulk | TE0745 | RoHS | - | 1GB | 64MB | Active | Zynq-7000 (Z-7045) | Board-to-Board (BTB) Socket - 480 | ARM Cortex-A9 | 2.05" x 2.99" (52mm x 76mm) | MCU, FPGA | -40°C ~ 85°C | |
|
|
TE0807-03-7AI21-AMPSOC ZYNQ USCALE 4GB DDR4 Trenz Electronic GmbH |
3,428 | - |
RFQ |
Box | TE0807 | RoHS | - | 4GB | 128MB | Active | - | B2B | Zynq UltraScale+ XCZU7CG-1FBVB900I | 2.05" x 2.99" (52mm x 76mm) | MPU Core | -40°C ~ 85°C | |
|
|
TE0807-03-7DI21-AMPSOC ZYNQ USCALE 4GB DDR4 Trenz Electronic GmbH |
3,588 | - |
RFQ |
Box | TE0807 | RoHS | - | 4GB | 128MB | Active | - | B2B | Zynq UltraScale+ XCZU7EV-1FBVB900I | 2.05" x 2.99" (52mm x 76mm) | MPU Core | -40°C ~ 85°C | |
|
|
TE0745-02-93E31-AMOD SOM DDR3L 1GB Trenz Electronic GmbH |
3,116 | - |
RFQ |
Bulk | TE0745 | RoHS | - | 1GB | 64MB | Active | Zynq-7000 (Z-7045) | Board-to-Board (BTB) Socket - 480 | ARM Cortex-A9 | 2.05" x 2.99" (52mm x 76mm) | MCU, FPGA | -40°C ~ 85°C | |
|
|
TE0807-02-07EV-1EIC MODULE ZYNQ USCALE 4GB 128MB Trenz Electronic GmbH |
2,599 | - |
RFQ |
Ficha técnica |
Bulk | TE0807 | RoHS | - | 4GB | 128MB | Obsolete | - | B2B | Zynq UltraScale+ XCZU7EV-1FBVB900E | 2.05" x 2.99" (52mm x 76mm) | MPU Core | 0°C ~ 85°C |
|
|
TE0820-03-02EG-1EDIC MODULE ZYNQ USCALE 2GB 128MB Trenz Electronic GmbH |
3,664 | - |
RFQ |
Ficha técnica |
Bulk | TE0820 | RoHS | - | 2GB | 128MB | Obsolete | - | B2B | Zynq UltraScale+ XCZU2EG-1SFVC784E | 1.57" x 1.97" (40mm x 50mm) | MPU Core | 0°C ~ 85°C |
|
|
TE0820-03-04CG-1EDIC MODULE ZYNQ USCALE 2GB 128MB Trenz Electronic GmbH |
2,216 | - |
RFQ |
Ficha técnica |
Bulk | TE0820 | RoHS | - | 2GB | 128MB | Obsolete | - | B2B | Zynq UltraScale+ XCZU4CG-1SFVC784E | 1.57" x 1.97" (40mm x 50mm) | MPU Core | 0°C ~ 85°C |
|
|
TE0820-03-03CG-1EDIC MODULE ZYNQ USCALE 1GB 128MB Trenz Electronic GmbH |
3,138 | - |
RFQ |
Ficha técnica |
Bulk | TE0820 | RoHS | - | 1GB | 128MB | Obsolete | - | B2B | Zynq UltraScale+ XCZU3CG-1SFVC784E | 1.57" x 1.97" (40mm x 50mm) | MPU Core | 0°C ~ 85°C |
|
|
TE0820-03-02CG-1EDIC MODULE ZYNQ USCALE 2GB 128MB Trenz Electronic GmbH |
3,682 | - |
RFQ |
Ficha técnica |
Bulk | TE0820 | RoHS | - | 2GB | 128MB | Obsolete | - | B2B | Zynq UltraScale+ XCZU2CG-1SFVC784E | 1.57" x 1.97" (40mm x 50mm) | MPU Core | 0°C ~ 85°C |
|
|
TE0820-03-03EG-1EDIC MODULE ZYNQ USCALE 2GB 128MB Trenz Electronic GmbH |
3,705 | - |
RFQ |
Ficha técnica |
Bulk | TE0820 | RoHS | - | 2GB | 128MB | Obsolete | - | B2B | Zynq UltraScale+ XCZU3EG-1SFVC784E | 1.57" x 1.97" (40mm x 50mm) | MPU Core | 0°C ~ 80°C |
|
|
TE0803-03-2BE11-AIC MODULE ZYNQ USCALE 2GB 128MB Trenz Electronic GmbH |
3,253 | - |
RFQ |
Ficha técnica |
Bulk | TE0803 | RoHS | - | 2GB | 128MB | Obsolete | - | B2B | Zynq UltraScale+ XCZU2EG-1SFVC784E | 2.05" x 2.99" (52mm x 76mm) | MPU Core | 0°C ~ 85°C |
- 1500+ Promedio diario de RFQ
- 20,000.000 Unidad estándar de producto
- 1800+ Fabricantes en todo el mundo
- 15,000+ Almacén en inventario
