Microcontroladores integrados, módulos FPGA con microprocesador

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series RoHS Speed RAM Size Flash Size Part Status Co-Processor Connector Type Core Processor Size / Dimension Module/Board Type Operating Temperature
TE0715-04-21C33-A

TE0715-04-21C33-A

IC SOC MODULE 1GB DDR3L

Trenz Electronic GmbH
2,203 -

RFQ

Bulk TE0715 RoHS 125MHz 1GB 32MB Active Zynq-7000 (Z-7012S) Samtec LSHM ARM Cortex-A9 1.97" x 1.57" (50mm x 40mm) MCU, FPGA 0°C ~ 70°C
20-101-0508

20-101-0508

IC MOD RABBIT 3000 30MHZ 128KB

Digi
2,736 -

RFQ

20-101-0508

Ficha técnica

Box RabbitCore RCM3000 RoHS 30MHz 128KB 256KB Not For New Designs - 2 IDC Headers 2x17 Rabbit 3000 1.85" x 2.73" (47mm x 69mm) MPU Core -40°C ~ 70°C
20-101-0961

20-101-0961

IC MOD RABBIT 3000 22.1MHZ 256KB

Digi
3,069 -

RFQ

Box RabbitCore® RoHS 22.1MHz 256KB 512KB (Internal), 1MB (External) Obsolete - IDC Header 2x20 Rabbit 3000 1.2" x 2.95" (30mm x 75mm) MPU Core -40°C ~ 70°C
TE0820-04-2BI21FA

TE0820-04-2BI21FA

MOD MPSOC 2GB DDR4

Trenz Electronic GmbH
3,140 -

RFQ

Bulk TE0820 RoHS - 2GB 128MB Obsolete - Samtec LSHM Zynq UltraScale+ XCZU2EG-1SFVC784I 1.97" x 1.57" (50mm x 40mm) MPU Core -40°C ~ 85°C
TE0712-02-71I36-A

TE0712-02-71I36-A

FPGA MODULE ARTIX7

Trenz Electronic GmbH
2,491 -

RFQ

Bulk TE0712 RoHS 200MHz 1GB 32MB Active - Samtec LSHM Artix-7 A100T 1.97" x 1.57" (50mm x 40mm) FPGA Core -40°C ~ 85°C
OSD3358-512M-ICB

OSD3358-512M-ICB

IC MOD CORTEX-A8 1GHZ 512MB 4GB

Octavo Systems LLC
3,035 -

RFQ

OSD3358-512M-ICB

Ficha técnica

Tray OSD335x RoHS 1GHz 512MB 4GB Active NEON™ SIMD 400-BGA ARM® Cortex®-A8, AM3358 1.06" x 1.06" (27.0mm x 27.0mm) MPU Core -40°C ~ 85°C
TE0820-04-2BE21ML

TE0820-04-2BE21ML

MOD MPSOC 2GB DDR4

Trenz Electronic GmbH
3,704 -

RFQ

Bulk TE0820 RoHS - 2GB 128MB Active - Samtec LSHM Zynq UltraScale+ XCZU2EG-1SFVC784E 1.97" x 1.57" (50mm x 40mm) MPU Core 0°C ~ 85°C
TE0720-03-61Q33MA

TE0720-03-61Q33MA

IC SOC MODULE XILINX ZYNQ

Trenz Electronic GmbH
3,413 -

RFQ

Bulk TE0720 RoHS - 1GB 8GB Active Zynq-7000 (Z-7020) Samtec LSHM ARM Cortex-A9 1.97" x 1.57" (50mm x 40mm) MCU, FPGA -40°C ~ 85°C
MOD5270-100IR

MOD5270-100IR

IC MOD COLDFIRE 147.5MHZ 8.064MB

NetBurner Inc.
3,952 -

RFQ

MOD5270-100IR

Ficha técnica

Bulk RoHS 147.5MHz 8.064MB 512KB Active - RJ-45, 2x50 Header ColdFire 5270 2.6" x 2" (66.04mm x 50.8mm) MCU, Ethernet Core -40°C ~ 85°C
TE0820-04-2BE21MA

TE0820-04-2BE21MA

MOD MPSOC 2GB DDR4

Trenz Electronic GmbH
3,520 -

RFQ

Bulk TE0820 RoHS - 2GB 128MB Active - Samtec LSHM Zynq UltraScale+ XCZU2EG-1SFVC784E 1.97" x 1.57" (50mm x 40mm) MPU Core 0°C ~ 85°C
TE0720-03-62I33ML

TE0720-03-62I33ML

IC SOC MODULE XILINX ZYNQ

Trenz Electronic GmbH
3,747 -

RFQ

Bulk TE0720 RoHS - 1GB 8GB Active Zynq-7000 (Z-7020) Samtec LSHM ARM Cortex-A9 1.97" x 1.57" (50mm x 40mm) MCU, FPGA -40°C ~ 85°C
TE0600-03-83I11-A

TE0600-03-83I11-A

IC MODULE GIGABEE

Trenz Electronic GmbH
2,176 -

RFQ

Bulk RoHS 125MHz 256MB 16MB Active - Samtec LSHM Spartan-6 LX-150 1.97" x 1.57" (50mm x 40mm) FPGA Core -40°C ~ 85°C
OSD3358-1G-ISM

OSD3358-1G-ISM

IC MODULE CORTEX-A8 1GHZ 1GB

Octavo Systems LLC
3,637 -

RFQ

OSD3358-1G-ISM

Ficha técnica

Tray OSD335x RoHS 1GHz 1GB - Active - 256-BGA ARM® Cortex®-A8, AM3358 0.83" x 0.83" (21mm x 21mm) MPU Core -40°C ~ 85°C
TE0820-04-2BE21MAJ

TE0820-04-2BE21MAJ

MOD MPSOC 2GB DDR4

Trenz Electronic GmbH
3,656 -

RFQ

Bulk TE0820 RoHS - 2GB 128MB Active - Samtec LSHM Zynq UltraScale+ XCZU2EG-1SFVC784E 1.97" x 1.57" (50mm x 40mm) MPU Core 0°C ~ 85°C
TE0712-02-72C36-A

TE0712-02-72C36-A

FPGA MODULE ARTIX7

Trenz Electronic GmbH
3,371 -

RFQ

Bulk TE0712 RoHS 200MHz 1GB 32MB Active - Samtec LSHM Artix-7 A100T 1.97" x 1.57" (50mm x 40mm) FPGA Core 0°C ~ 85°C
TE0600-03-52I11-C

TE0600-03-52I11-C

IC MODULE GIGABEE

Trenz Electronic GmbH
3,888 -

RFQ

Bulk RoHS 125MHz 256MB 16MB Active - Samtec LSHM Spartan-6 LX-45 1.97" x 1.57" (50mm x 40mm) FPGA Core -40°C ~ 85°C
20-101-1154

20-101-1154

IC MOD RABBIT 4000 58.98MHZ 1MB

Digi
3,327 -

RFQ

20-101-1154

Ficha técnica

Box RabbitCore RCM4100 RoHS 58.98MHz 1MB 512KB Not For New Designs - IDC Header 2x25, 2x5 Rabbit 4000 1.41" x 1.88" (36mm x 48mm) MPU Core -40°C ~ 85°C
TE0820-04-2BI21MA

TE0820-04-2BI21MA

MOD MPSOC 2GB DDR4

Trenz Electronic GmbH
2,968 -

RFQ

Bulk TE0820 RoHS - 2GB 128MB Active - Samtec LSHM Zynq UltraScale+ XCZU2EG-1SFVC784I 1.97" x 1.57" (50mm x 40mm) MPU Core -40°C ~ 85°C
TE0729-02-62I63MAK

TE0729-02-62I63MAK

IC SOC MODULE ZYNQ

Trenz Electronic GmbH
2,862 -

RFQ

Bulk TE0729 RoHS - 512MB 32MB Active Zynq-7000 (Z-7020) B2B ARM Cortex-A9 2.05" x 2.99" (52mm x 76mm) MCU, FPGA -40°C ~ 85°C
TE0600-03IC4

TE0600-03IC4

IC MODULE GIGABEE

Trenz Electronic GmbH
3,405 -

RFQ

Bulk RoHS 125MHz 256MB 16MB Obsolete - Samtec LSHM Spartan-6 LX-45 1.97" x 1.57" (50mm x 40mm) FPGA Core -40°C ~ 85°C
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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