Microcontroladores integrados, módulos FPGA con microprocesador

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series RoHS Speed RAM Size Flash Size Part Status Co-Processor Connector Type Core Processor Size / Dimension Module/Board Type Operating Temperature
CC-WMX-ET8D-NN

CC-WMX-ET8D-NN

CONNECTCORE 8 MINI SOM WIRELESS

Digi
3,134 -

RFQ

Box ConnectCore® 8M Mini RoHS 1.6GHz 2GB - Active - USB ARM® Cortex®-A53, ARM® Cortex®-M4, i.MX8 1.77" x 1.57" (45mm x 40mm) MPU Core -40°C ~ 85°C
SOMOMAP3530-12-1783JFIR

SOMOMAP3530-12-1783JFIR

IC MOD OMAP3530 600MHZ 256MB

Beacon EmbeddedWorks
2,403 -

RFQ

SOMOMAP3530-12-1783JFIR

Ficha técnica

Bulk OMAP35x RoHS 600MHz 256MB 512MB (NAND), 16MB (NOR) Active TMS320C64x (DSP) - OMAP3530 3.01" x 1.23" (76.5mm x 31.2mm) MPU, DSP Core -40°C ~ 85°C
5CSE-H4-3YA-RI

5CSE-H4-3YA-RI

IC MOD CORTEX-A9 800MHZ 1GB 16MB

Critical Link LLC
2,715 -

RFQ

5CSE-H4-3YA-RI

Ficha técnica

Bulk MitySOM RoHS 800MHz 1GB 16MB Active NEON™ SIMD Edge Connector ARM® Cortex®-A9, Cyclone V SX/SE 3.2" x 1.5" (82mm x 39mm) MPU, FPGA Core -40°C ~ 85°C
CC-MX-ET8D-ZN

CC-MX-ET8D-ZN

CONNECTCORE 8 MINI SOM

Digi
2,174 -

RFQ

Box ConnectCore® 8M Mini RoHS 1.6GHz 2GB - Active - USB ARM® Cortex®-A53, ARM® Cortex®-M4, i.MX8 1.77" x 1.57" (45mm x 40mm) MPU Core -40°C ~ 85°C
100-1221-3

100-1221-3

IC MOD CM-BF537 600MHZ 32MB

BECOM Systems GmbH
3,153 -

RFQ

100-1221-3

Ficha técnica

Box Blackfin® RoHS 600MHz 32MB 4MB Active - Expansion 2 x 60 CM-BF537 1.44" x 1.24" (36.5mm x 31.5mm) MPU Core 0°C ~ 70°C
ME-SA2-D6-7I-D11-R1

ME-SA2-D6-7I-D11-R1

SOM CYCLONE V 5CSTFD6 2GB

Enclustra FPGA Solutions
2,723 -

RFQ

Box RoHS 800MHz 2GB 64MB Active - 168 Pin ARM® Dual-Core Cortex-A9 2.91" x 2.13" (74mm x 54mm) FPGA Core -40°C ~ 85°C
BS2I-IC

BS2I-IC

IC MOD PIC16C57C 20MHZ 32B 2KB

Parallax Inc.
3,093 -

RFQ

- BASIC Stamp® RoHS 20MHz 32B 2KB EEPROM Obsolete - - PIC16C57C 1.2" x 0.6" (30mm x 15mm) MCU Core -40°C ~ 85°C
100-1218-1

100-1218-1

IC MOD ADSP-BF609 500MHZ X 2

BECOM Systems GmbH
2,407 -

RFQ

100-1218-1

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) Blackfin® RoHS 500MHz x 2 256KB 8MB Active - Expansion 2 x 100 ADSP-BF609 (Dual Core) 1.73" x 1.3" (44mm x 33mm) MPU Core -40°C ~ 85°C
TE0745-02-71I31-AK

TE0745-02-71I31-AK

MOD SOM DDR3L 1GB HEAT SPREADER

Trenz Electronic GmbH
3,295 -

RFQ

Bulk TE0745 RoHS - 1GB 64MB Active Zynq-7000 (Z-7030) Board-to-Board (BTB) Socket - 480 ARM Cortex-A9 2.99" x 2.13" (76mm x 54mm) MCU, FPGA -40°C ~ 85°C
BS2E-IC

BS2E-IC

IC MODULE SX28AC 20MHZ 32B 16KB

Parallax Inc.
3,198 -

RFQ

BS2E-IC

Ficha técnica

Bulk BASIC Stamp® RoHS 20MHz 32B 16KB EEPROM Obsolete - - SX28AC 1.2" x 0.6" (30mm x 15mm) MCU Core 0°C ~ 70°C
6711-AB-3X3-RC

6711-AB-3X3-RC

IC MOD TMS320C6711 200MHZ 64KB

Critical Link LLC
3,980 -

RFQ

6711-AB-3X3-RC

Ficha técnica

Bulk MityDSP-XM RoHS 200MHz 64KB (Internal), 32MB (External) 16MB Active Spartan-3, XC3S1000 SO-DIMM-144 TMS320C6711 2.66" x 1.5" (67.6mm x 38.1mm) DSP, FPGA Core 0°C ~ 70°C
TE0803-01-04CG-1EA

TE0803-01-04CG-1EA

IC MODULE ZYNQ USCALE 2GB 128MB

Trenz Electronic GmbH
2,106 -

RFQ

TE0803-01-04CG-1EA

Ficha técnica

Bulk TE0803 RoHS - 2GB 128MB Active - B2B Zynq UltraScale+ XCZU4CG-1SFVC784E 2.99" x 2.05" (76mm x 52mm) MPU Core 0°C ~ 85°C
BS2SX-IC

BS2SX-IC

IC MODULE SX28AC 50MHZ 32B 16KB

Parallax Inc.
2,936 -

RFQ

BS2SX-IC

Ficha técnica

Bulk BASIC Stamp® RoHS 50MHz 32B 16KB EEPROM Obsolete - - SX28AC 1.2" x 0.6" (30mm x 15mm) MCU Core 0°C ~ 70°C
SP7021-IF

SP7021-IF

Plus1 Linux CPU w/integrated RAM

Tibbo
1,000 -

RFQ

Tray Plus1 RoHS 1GHz 512MB - Active - 176-LQFP ARM Cortex-A7(x4), 8051, A926 0.79" x 0.79" (20mm x 20mm) MPU Core -40°C ~ 85°C
TE0803-02-04CG-1EB

TE0803-02-04CG-1EB

IC MODULE ZYNQ USCALE 2GB 256MB

Trenz Electronic GmbH
2,360 -

RFQ

TE0803-02-04CG-1EB

Ficha técnica

Bulk TE0803 RoHS - 2GB 256MB Active - B2B Zynq UltraScale+ XCZU4CG-1SFVC784E 2.05" x 2.99" (52mm x 76mm) MPU Core 0°C ~ 85°C
JS1-IC

JS1-IC

IC MODULE SX48AC 32KB

Parallax Inc.
2,995 -

RFQ

Bulk Javelin RoHS - 32KB 32KB EEPROM Obsolete - 24-DIP SX48AC 1.2" x 0.6" (30mm x 15mm) MPU Core 0°C ~ 70°C
MA5D4-20A0A051E

MA5D4-20A0A051E

SOM SAMA5D42

ARIES Embedded
110 -

RFQ

MA5D4-20A0A051E

Ficha técnica

Box RoHS 528MHz 128MB 4GB Active - Edge Connector - 230 - 2.76" x 1.57" (70mm x 40mm) MPU Core -25°C ~ 85°C
TE0741-03-160-2IF

TE0741-03-160-2IF

IC MOD KINTEX-7 160T 200MHZ 32MB

Trenz Electronic GmbH
3,893 -

RFQ

TE0741-03-160-2IF

Ficha técnica

Bulk TE0741 RoHS 200MHz - 32MB Last Time Buy - Samtec LSHM Kintex-7 160T 1.97" x 1.57" (50mm x 40mm) FPGA Core -40°C ~ 85°C
EZ80F915050MOD

EZ80F915050MOD

IC MOD EZ80F91 50MHZ 8KB

Zilog
2,479 -

RFQ

EZ80F915050MOD

Ficha técnica

- eZ80® Acclaim!® RoHS 50MHz 8KB (Internal), 512KB (External) 256KB (Internal), 1MB (External) Obsolete - Header 2x30 eZ80F91 2.5" x 3.1" (63.5mm x 78.7mm) MCU, Ethernet Core 0°C ~ 70°C
M28-7BA1CI

M28-7BA1CI

SOM I.MX287

ARIES Embedded
290 -

RFQ

M28-7BA1CI

Ficha técnica

Box RoHS 454MHz 128MB 256MB Active - Edge Connector - 230 - 2.76" x 1.38" (70mm x 35mm) MPU Core -40°C ~ 85°C
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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