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| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | Product Status | PLL | Main Purpose | Input | Output | Number of Circuits | Ratio-Input:Output | Differential-Input:Output | Frequency-Max | Voltage-Supply | Operating Temperature | Mounting Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
ZL30732LDG12-CHANNEL, 10-OUTPUT 1588 TIMING Microchip Technology |
3,412 | - |
RFQ |
Tray | - | Active | Yes | - | - | CMOS | 5 | 10:10 | Yes/Yes | 750MHz | 1.8V, 3.3V | - | Surface Mount | |
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|
DSC557-0344FI0IC CLOCK GEN PCIE 14QFN Microchip Technology |
2,240 | - |
RFQ |
Ficha técnica |
Tube | DSC557-03 | Active | Yes | PCI Express (PCIe) | - | HCSL | 1 | 0:2 | No/Yes | 100MHz | 2.25V ~ 3.6V | -40°C ~ 85°C | Surface Mount |
|
SY69753ALHGIC CLK DATA REC SDH 155MBPS Microchip Technology |
3,276 | - |
RFQ |
Ficha técnica |
Tray | - | Active | Yes | Ethernet, SONET/SDH, ATM OC-3 | PECL | PECL | 1 | 1:3 | Yes/Yes | 155Mbps | 3.15V ~ 3.45V | -40°C ~ 85°C | Surface Mount |
|
MDB1900ZBQZZERO DELAY BUFFER FOR PCIE Microchip Technology |
256 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Yes | PCI Express (PCIe), SATA CPU | HCSL | HCSL | 1 | 2:19 | Yes/Yes | 133.33MHz | 2.375V ~ 3.465V | 0°C ~ 70°C | Surface Mount |
|
|
DSC557-0344FL1TIC CLOCK GEN PCIE 14QFN Microchip Technology |
2,261 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR),Cut Tape (CT) | DSC557-03 | Active | Yes | PCI Express (PCIe) | - | HCSL | 1 | 0:2 | No/Yes | 100MHz | 2.25V ~ 3.6V | -40°C ~ 105°C | Surface Mount |
|
|
SY87700ALHGIC CLK DATA REC SDH 208MBPS Microchip Technology |
2,395 | - |
RFQ |
Ficha técnica |
Tray | AnyRate® | Active | Yes | Ethernet, SONET/SDH, ATM applications | PECL, TTL | PECL | 1 | 3:3 | Yes/Yes | 208Mbps | 3.15V ~ 3.45V | -40°C ~ 85°C | Surface Mount |
|
ZL30143GGG2IC SONET/SDH SYNCH 100CABGA Microchip Technology |
2,308 | - |
RFQ |
Ficha técnica |
Tray | - | Active | Yes | Ethernet, SONET/SDH, Stratum | Clock | Clock | 1 | 13:14 | No/Yes | 622.08MHz | - | -40°C ~ 85°C | Surface Mount |
|
|
DSC557-0344FI0TIC CLOCK GEN PCIE 14QFN Microchip Technology |
3,621 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR),Cut Tape (CT) | DSC557-03 | Active | Yes | PCI Express (PCIe) | - | HCSL | 1 | 0:2 | No/Yes | 100MHz | 2.25V ~ 3.6V | -40°C ~ 85°C | Surface Mount |
|
|
DSC557-0343FI0IC CLOCK GEN PCIE 14QFN Microchip Technology |
3,620 | - |
RFQ |
Ficha técnica |
Tube | DSC557-03 | Active | Yes | PCI Express (PCIe) | - | HCSL, LVDS | 1 | 0:2 | No/Yes | 100MHz | 2.25V ~ 3.6V | -40°C ~ 85°C | Surface Mount |
|
DSC557-04444KI1IC CLOCK GEN PCIE 20VFQFN Microchip Technology |
3,612 | - |
RFQ |
Ficha técnica |
Tube | DSC557-04 | Active | Yes | PCI Express (PCIe) | - | HCSL | 1 | 0:03 | No/Yes | 460MHz | 2.25V ~ 3.6V | -40°C ~ 85°C | Surface Mount |
|
|
DSC557-054444KI1IC CLOCK GEN PCIE 20VFQFN Microchip Technology |
3,997 | - |
RFQ |
Ficha técnica |
Tube | DSC557-05 | Active | Yes | PCI Express (PCIe) | - | HCSL | 1 | 0:4 | No/Yes | 460MHz | 2.25V ~ 3.6V | -40°C ~ 85°C | Surface Mount |
|
|
SY87700ALHG-TRIC CLK DATA REC SDH 208MBPS Microchip Technology |
3,356 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR),Cut Tape (CT) | AnyRate® | Active | Yes | Ethernet, SONET/SDH, ATM applications | PECL, TTL | PECL | 1 | 3:3 | Yes/Yes | 208Mbps | 3.15V ~ 3.45V | -40°C ~ 85°C | Surface Mount |
|
DS31400GN2IC TIMING DUAL DPLL 256-CSBGA Microchip Technology |
2,888 | - |
RFQ |
Ficha técnica |
Tray | - | Active | Yes | Ethernet, SONET/SDH, Stratum, Telecom | CMOS, TTL | CML, CMOS, LVDS, LVPECL, TTL | 1 | 8:14 | Yes/Yes | 750MHz | 1.8V | -40°C ~ 85°C | Surface Mount |
|
|
DSC557-0333FI1T2-OUTPUT MEMS PCIE GEN1/2/3/4 CL Microchip Technology |
3,752 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR),Cut Tape (CT) | DSC557-03 | Active | Yes | PCI Express (PCIe) | - | HCSL, LVCMOS, LVDS | 1 | 1:2 | No/Yes | 100MHz | 2.25V ~ 3.6V | -40°C ~ 85°C | Surface Mount |
|
|
DSC557-0344FI1TMEMS OSC XO 100.0000MHZ HCSL SMD Microchip Technology |
2,858 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR),Cut Tape (CT) | DSC557-03 | Active | Yes | PCI Express (PCIe) | - | HCSL | 1 | 0:2 | No/Yes | 100MHz | 2.25V ~ 3.6V | -40°C ~ 85°C | Surface Mount |
|
|
DSC557-0334FI1MEMS OSC XO 100.0000MHZ HCSL LVD Microchip Technology |
3,869 | - |
RFQ |
Ficha técnica |
Tube | DSC557-03 | Active | Yes | PCI Express (PCIe) | - | HCSL, LVDS | 1 | 0:2 | No/Yes | 100MHz | 2.25V ~ 3.6V | -40°C ~ 85°C | Surface Mount |
|
|
DSC557-0343FI1MEMS OSC XO 100.0000MHZ HCSL LVD Microchip Technology |
3,750 | - |
RFQ |
Ficha técnica |
Tube | DSC557-03 | Active | Yes | PCI Express (PCIe) | - | HCSL, LVDS | 1 | 0:2 | No/Yes | 100MHz | 2.25V ~ 3.6V | -40°C ~ 85°C | Surface Mount |
|
|
ZL30640ALDG120-OUTPUT TIMEBUFFER WITH ETOD I Microchip Technology |
3,346 | - |
RFQ |
Tray | - | Active | Yes | SONET/SDH | CMOS | CMOS, LVDS, LVPECL | 1 | 5:10 | Yes/Yes | 500MHz | 1.8V, 3.3V | - | Surface Mount | |
|
ZL30169LDG1IC CLK TRANSLATOR OTN 3I/O 32QFN Microchip Technology |
3,652 | - |
RFQ |
Ficha técnica |
Tray | - | Active | Yes | Telecom | CML, CMOS, Crystal | CML, CMOS | 1 | 4:3 | Yes/Yes | 1.035GHz | - | -40°C ~ 85°C | Surface Mount |
|
|
ZL30641LDG11-CHANNEL, 10-OUTPUT LINE CARD Microchip Technology |
2,155 | - |
RFQ |
Ficha técnica |
Tray | - | Active | Yes | Ethernet, SONET/SDH, Wireless Base Stations | CMOS | CMOS, LVDS, LVPECL | 1 | 5:10 | Yes/Yes | 750MHz | 1.8V, 3.3V | - | Surface Mount |
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