Adaptadores, placas de conexión

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus ProtoBoardType PackageAccepted NumberofPositions Pitch BoardThickness Material
DIP600T300P06

DIP600T300P06

DIP-6 (0.6 BODY) TO DIP-6 (0.3

Chip Quik Inc.
268 -

RFQ

DIP600T300P06

Ficha técnica

Bulk Proto-Advantage Active DIP to DIP - 6 0.100 (2.54mm) 0.063 (1.60mm) FR4 Epoxy Glass
DIP300T600P06

DIP300T600P06

DIP-6 (0.3 BODY) TO DIP-6 (0.6

Chip Quik Inc.
130 -

RFQ

DIP300T600P06

Ficha técnica

Bulk Proto-Advantage Active DIP to DIP - 6 0.100 (2.54mm) 0.063 (1.60mm) FR4 Epoxy Glass
DIP300T600P08

DIP300T600P08

DIP-8 (0.3 BODY) TO DIP-8 (0.6

Chip Quik Inc.
3,647 -

RFQ

DIP300T600P08

Ficha técnica

Bulk Proto-Advantage Active DIP to DIP - 8 0.100 (2.54mm) 0.063 (1.60mm) FR4 Epoxy Glass
DIP300T600P18

DIP300T600P18

DIP-18 (0.3 BODY) TO DIP-18 (0.

Chip Quik Inc.
2,631 -

RFQ

DIP300T600P18

Ficha técnica

Bulk Proto-Advantage Active DIP to DIP - 18 0.100 (2.54mm) 0.063 (1.60mm) FR4 Epoxy Glass
DIP300T600P20

DIP300T600P20

DIP-20 (0.3 BODY) TO DIP-20 (0.

Chip Quik Inc.
3,447 -

RFQ

DIP300T600P20

Ficha técnica

Bulk Proto-Advantage Active DIP to DIP - 20 0.100 (2.54mm) 0.063 (1.60mm) FR4 Epoxy Glass
DC2917J-10X

DC2917J-10X

DISCRETE 2917 TO TH ADAPTER - JU

Chip Quik Inc.
2,248 -

RFQ

DC2917J-10X

Ficha técnica

Bulk Proto-Advantage Active SMD to Plated Through Hole 2917 2 0.244 (6.20mm) - FR4 Epoxy Glass
DC2924J-10X

DC2924J-10X

DISCRETE 2924 TO TH ADAPTER - JU

Chip Quik Inc.
2,470 -

RFQ

DC2924J-10X

Ficha técnica

Bulk Proto-Advantage Active SMD to Plated Through Hole 2924 2 0.245 (6.22mm) - FR4 Epoxy Glass
DIP600T300P24

DIP600T300P24

DIP-24 (0.6 BODY) TO DIP-24 (0.

Chip Quik Inc.
3,113 -

RFQ

DIP600T300P24

Ficha técnica

Bulk Proto-Advantage Active DIP to DIP - 24 0.100 (2.54mm) 0.063 (1.60mm) FR4 Epoxy Glass
CN0010

CN0010

USB - MINI B ADAPTER BOARD

Chip Quik Inc.
3,145 -

RFQ

CN0010

Ficha técnica

Bulk Proto-Advantage Active Connector to SIP USB - mini B 5 - 0.062 (1.57mm) 1/16 FR4 Epoxy Glass
DIP300T600P26

DIP300T600P26

DIP-26 (0.3 BODY) TO DIP-26 (0.

Chip Quik Inc.
3,331 -

RFQ

DIP300T600P26

Ficha técnica

Bulk Proto-Advantage Active DIP to DIP - 26 0.100 (2.54mm) 0.063 (1.60mm) FR4 Epoxy Glass
DIP600T300P28

DIP600T300P28

DIP-28 (0.6 BODY) TO DIP-28 (0.

Chip Quik Inc.
2,098 -

RFQ

DIP600T300P28

Ficha técnica

Bulk Proto-Advantage Active DIP to DIP - 28 0.100 (2.54mm) 0.063 (1.60mm) FR4 Epoxy Glass
DIP900T600P48

DIP900T600P48

DIP-48 (0.9 BODY) TO DIP-48 (0.

Chip Quik Inc.
2,028 -

RFQ

DIP900T600P48

Ficha técnica

Bulk Proto-Advantage Active DIP to DIP - 48 0.100 (2.54mm) 0.063 (1.60mm) FR4 Epoxy Glass
BGA0029

BGA0029

BGA-36 TO DIP-36 SMT ADAPTER (0.

Chip Quik Inc.
3,360 -

RFQ

BGA0029

Ficha técnica

Bulk Proto-Advantage Active SMD to DIP BGA 36 0.014 (0.35mm) 0.063 (1.60mm) FR4 Epoxy Glass
BGA0033

BGA0033

BGA-144 TO PGA-144 SMT ADAPTER (

Chip Quik Inc.
3,801 -

RFQ

BGA0033

Ficha técnica

Bulk Proto-Advantage Active SMD to Plated Through Hole Board BGA 144 0.020 (0.50mm) 0.063 (1.60mm) FR4 Epoxy Glass
DIP600T300P10

DIP600T300P10

DIP-10 (0.6 BODY) TO DIP-10 (0.

Chip Quik Inc.
2,871 -

RFQ

DIP600T300P10

Ficha técnica

Bulk Proto-Advantage Active DIP to DIP - 10 0.100 (2.54mm) 0.063 (1.60mm) FR4 Epoxy Glass
DIP600T300P12

DIP600T300P12

DIP-12 (0.6 BODY) TO DIP-12 (0.

Chip Quik Inc.
2,331 -

RFQ

DIP600T300P12

Ficha técnica

Bulk Proto-Advantage Active DIP to DIP - 12 0.100 (2.54mm) 0.063 (1.60mm) FR4 Epoxy Glass
DIP600T300P16

DIP600T300P16

DIP-16 (0.6 BODY) TO DIP-16 (0.

Chip Quik Inc.
2,647 -

RFQ

DIP600T300P16

Ficha técnica

Bulk Proto-Advantage Active DIP to DIP - 16 0.100 (2.54mm) 0.063 (1.60mm) FR4 Epoxy Glass
DIP600T300P20

DIP600T300P20

DIP-20 (0.6 BODY) TO DIP-20 (0.

Chip Quik Inc.
2,253 -

RFQ

DIP600T300P20

Ficha técnica

Bulk Proto-Advantage Active DIP to DIP - 20 0.100 (2.54mm) 0.063 (1.60mm) FR4 Epoxy Glass
DIP600T300P26

DIP600T300P26

DIP-26 (0.6 BODY) TO DIP-26 (0.

Chip Quik Inc.
3,562 -

RFQ

DIP600T300P26

Ficha técnica

Bulk Proto-Advantage Active DIP to DIP - 26 0.100 (2.54mm) 0.063 (1.60mm) FR4 Epoxy Glass
PA0106C-P-R

PA0106C-P-R

PLCC-28 TO PGA-28 PIN 1 OUT SMT

Chip Quik Inc.
100 -

RFQ

PA0106C-P-R

Ficha técnica

Bulk - Active SMD to PGA LCC, JLCC, PLCC 28 0.050 (1.27mm) - FR4 Epoxy Glass
Total 1005 Record«Prev1... 4567891011...51Next»
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Producto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Usuario