Térmico - Almohadillas, láminas

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Usage Type Shape Outline Thickness Material Adhesive BackingCarrier Color ThermalResistivity
HS100-TP2

HS100-TP2

HS100 RESISTOR THERMAL PAD

Ohmite
125 -

RFQ

HS100-TP2

Ficha técnica

Bulk HS Active IGBT - Heat Transfer Low Thermal Resistance Interface Pad, Sheet Rectangular 65.20mm x 47.50mm 0.0200 (0.508mm) Silicone, Ceramic Filled Tacky - Both Sides - Blue -
TGH-TP1

TGH-TP1

SOT-227 THERMO PAD

Ohmite
711 -

RFQ

TGH-TP1

Ficha técnica

Box - Active SOT-227 Graphite-Pad, Sheet - - 0.0079 (0.200mm) Graphite - - - -
HS50-TP2

HS50-TP2

HS50 RESISTOR THERMAL PAD

Ohmite
3,058 -

RFQ

HS50-TP2

Ficha técnica

Bulk HS Active IGBT - Heat Transfer Low Thermal Resistance Interface Pad, Sheet Rectangular 49.10mm x 28.00mm 0.0200 (0.508mm) Silicone, Ceramic Filled Tacky - Both Sides - Blue -
HS75-TP2

HS75-TP2

HS75 RESISTOR THERMAL PAD

Ohmite
3,568 -

RFQ

HS75-TP2

Ficha técnica

Bulk HS Active IGBT - Heat Transfer Low Thermal Resistance Interface Pad, Sheet Rectangular 48.70mm x 47.50mm 0.0200 (0.508mm) Silicone, Ceramic Filled Tacky - Both Sides - Blue -
HS150-TP2

HS150-TP2

HS150 RESISTOR THERMAL PAD

Ohmite
2,908 -

RFQ

HS150-TP2

Ficha técnica

Bulk HS Active IGBT - Heat Transfer Low Thermal Resistance Interface Pad, Sheet Rectangular 97.70mm x 47.50mm 0.0200 (0.508mm) Silicone, Ceramic Filled Tacky - Both Sides - Blue -
HS250-TP2

HS250-TP2

HS250 RESISTOR THERMAL PAD

Ohmite
2,666 -

RFQ

HS250-TP2

Ficha técnica

Bulk HS Active IGBT - Heat Transfer Low Thermal Resistance Interface Pad, Sheet Rectangular 109.70mm x 72.50mm 0.0200 (0.508mm) Silicone, Ceramic Filled Tacky - Both Sides - Blue -
HS300-TP2

HS300-TP2

HS300 RESISTOR THERMAL PAD

Ohmite
2,535 -

RFQ

HS300-TP2

Ficha técnica

Bulk HS Active IGBT - Heat Transfer Low Thermal Resistance Interface Pad, Sheet Rectangular 127.70mm x 72.50mm 0.0200 (0.508mm) Silicone, Ceramic Filled Tacky - Both Sides - Blue -
HS200-TP2

HS200-TP2

HS200 RESISTOR THERMAL PAD

Ohmite
3,428 -

RFQ

HS200-TP2

Ficha técnica

Bulk HS Active IGBT - Heat Transfer Low Thermal Resistance Interface Pad, Sheet Rectangular 89.70mm x 72.50mm 0.0200 (0.508mm) Silicone, Ceramic Filled Tacky - Both Sides - Blue -
TAP-TP1

TAP-TP1

GRAPHITE THERMAL PAD

Ohmite
2,076 -

RFQ

TAP-TP1

Ficha técnica

Box - Active TAP600, TAP650, TAP800, TAP2000 Graphite-Pad, Sheet Square 55.90mm x 55.90mm 0.0080 (0.203mm) Graphite - - Gray -
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Producto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Usuario