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Térmico - Disipadores de calor
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | PackageCooled | AttachmentMethod | Shape | Length | Width | Diameter | FinHeight | PowerDissipation@TemperatureRise | ThermalResistance@ForcedAirFlow | ThermalResistance@Natural | Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
ACC-HS4-SETACC HEATSINK ME ACC-HS4 Enclustra FPGA Solutions |
3,864 | - |
RFQ |
Box | ACC-HS4 | Active | - | Bolt On | Rectangular | 2.913 (74.00mm) | 2.126 (54.00mm) | - | 0.571 (14.50mm) | - | - | - | - | ||
|
HS-ZX-SET-R2ACC HEATSINK MA-ZX*/AX3 Enclustra FPGA Solutions |
3,086 | - |
RFQ |
Box | - | Active | - | - | - | - | - | - | - | - | - | - | - | ||
|
|
HS-XU3-SET-R2ACC HEATSINK MA-XU3 Enclustra FPGA Solutions |
2,318 | - |
RFQ |
Box | Mars XU3 | Active | - | - | - | - | - | - | - | - | - | - | - | ||
|
|
ACC-HS3-SETACC HEATSINK ME ACC-HS3 Enclustra FPGA Solutions |
2,245 | - |
RFQ |
Box | ACC-HS3 | Active | - | Bolt On | Rectangular | 2.205 (56.00mm) | 1.063 (27.00mm) | - | 0.571 (14.50mm) | - | - | - | - | ||
|
|
HS-MA3-R1-SET-R1HEATSINK MARS MA3 Enclustra FPGA Solutions |
2,317 | - |
RFQ |
Bag | Mars MA3 | Active | Top Mount | - | - | - | - | - | - | - | - | - | - | ||
|
|
HS-ZX-R1-SET-R1HEATSINK MARS ZX2 ZX3 Enclustra FPGA Solutions |
2,873 | - |
RFQ |
Bag | Mars ZX2, ZX3 | Active | Top Mount | - | - | - | - | - | - | - | - | - | - | ||
|
|
HS-XU3-R1-SET-R1HEATSINK MARS XU3 Enclustra FPGA Solutions |
3,415 | - |
RFQ |
Bag | Mars XU3 | Active | Top Mount | - | - | - | - | - | - | - | - | - | - | ||
|
|
EN104037ACC HEATSINK MA-MA3 Enclustra FPGA Solutions |
2,395 | - |
RFQ |
Box | Mars MA3 | Obsolete | - | - | - | - | - | - | - | - | - | - | - |
- 1500+ Promedio diario de RFQ
- 20,000.000 Unidad estándar de producto
- 1800+ Fabricantes en todo el mundo
- 15,000+ Almacén en inventario
