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| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | Composition | Diameter | MeltingPoint | FluxType | WireGauge | MeshType | Process | Form | ShelfLife | ShelfLifeStart |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
4901-454GSOLDER LF SN99 21GAUGE 1LBS MG Chemicals |
3,791 | - |
RFQ |
Ficha técnica |
Spool | 4901 | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.032 (0.81mm) | 442°F (227°C) | No-Clean | 20 AWG, 21 SWG | - | Lead Free | Spool, 1 lb (454 g) | 60 Months | - |
|
SMD291SNL10SOLDER PASTE NO-CLEAN 10CC SYR Chip Quik Inc. |
106 | - |
RFQ |
Ficha técnica |
Syringe | - | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 3 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 6 Months | Date of Manufacture |
|
SMDSWLF.006 50GLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
2,954 | - |
RFQ |
Ficha técnica |
Bulk | SMD | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.006 (0.15mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 34 AWG, 38 SWG | - | Lead Free | Spool, 1.76 oz (50g) | - | - |
|
SMDSWLT.040 200GSN42/BI57/AG1 2.2 FLUX CORE SOLD Chip Quik Inc. |
2,162 | - |
RFQ |
Ficha técnica |
Bulk | SMD | Active | Wire Solder | Bi57Sn42Ag1 (57/42/1) | 0.040 (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | 18 AWG, 19 SWG | - | Lead Free | Spool, 7 oz (200g) | - | - |
|
NC2SW.031 0.5OZSOLDER WIRE MINI POCKET PACK 60/ Chip Quik Inc. |
249 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Wire Solder | Sn60Pb40 (60/40) | 0.031 (0.79mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean | 20 AWG, 21 SWG | - | Leaded | Tube, 0.50 oz (14.17g) | - | - |
|
NCSW.031 0.5OZSOLDER WIRE MINI POCKET PACK 63/ Chip Quik Inc. |
542 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Wire Solder | Sn63Pb37 (63/37) | 0.031 (0.79mm) | 361°F (183°C) | No-Clean | 20 AWG, 21 SWG | - | Leaded | Tube, 0.50 oz (14.17g) | - | - |
|
NCSWLF.031 0.5OZLF SOLDER WIRE MINI POCKET PACK Chip Quik Inc. |
875 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031 (0.79mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean | 20 AWG, 21 SWG | - | - | Tube, 0.50 oz (14.17g) | - | - |
|
EXB-SN63PB37-0.5LBSOLDER BAR SN63/PB37 0.5LB (227G Chip Quik Inc. |
784 | - |
RFQ |
Ficha técnica |
Bulk | Super Low Dross™ | Active | Bar Solder | Sn63Pb37 (63/37) | - | 361°F (183°C) | - | - | - | Leaded | Bar, 0.5 lb (227g) | - | - |
|
70-1607-0520SOLDERPASTE NO CLEAN 63/37 35GM Kester Solder |
2,742 | - |
RFQ |
Ficha técnica |
Syringe | R276 | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 3 | Leaded | Syringe, 1.23 oz (35g), 10cc | 6 Months | Date of Manufacture |
|
24-6040-0066SOLDER RA FLUX 11AWG 60/40 1LB Kester Solder |
3,489 | - |
RFQ |
Ficha técnica |
Spool | 44 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.093 (2.36mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | 11 AWG, 13 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
24-6337-8814SOLDER NO-CLEAN 16AWG 63/37 1LB Kester Solder |
252 | - |
RFQ |
Ficha técnica |
Spool | 245 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.050 (1.27mm) | 361°F (183°C) | No-Clean | 16 AWG, 18 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
|
24-6040-0053SOLDER RA FLUX 16AWG 60/40 1LB Kester Solder |
249 | - |
RFQ |
Ficha técnica |
Spool | 44 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.050 (1.27mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | 16 AWG, 18 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
|
24-6337-8801SOLDER NO-CLEAN 20AWG 63/37 1LB Kester Solder |
498 | - |
RFQ |
Ficha técnica |
Spool | 245 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.031 (0.79mm) | 361°F (183°C) | No-Clean | 20 AWG, 22 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
|
24-6337-0018SOLDER RA FLUX 22AWG 63/37 1LB Kester Solder |
3,441 | - |
RFQ |
Ficha técnica |
Spool | 44 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.025 (0.64mm) | 361°F (183°C) | Rosin Activated (RA) | 22 AWG, 23 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
|
24-6040-0027SOLDER RA 60/40 20AWG 1LB Kester Solder |
341 | - |
RFQ |
Ficha técnica |
Spool | 44 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.031 (0.79mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
24-6337-6403SOLDER WATER SOLUABLE 20AWG 1LB Kester Solder |
2,786 | - |
RFQ |
Ficha técnica |
Spool | 331 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.031 (0.79mm) | 361°F (183°C) | Water Soluble | 20 AWG, 22 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
|
24-6040-0061SOLDER RA 60/40 14AWG 1LB Kester Solder |
140 | - |
RFQ |
Ficha técnica |
Spool | 44 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.062 (1.57mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
|
24-6040-0039SOLDER RA 60/40 18AWG 1LB Kester Solder |
157 | - |
RFQ |
Ficha técnica |
Spool | 44 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.040 (1.02mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | 18 AWG, 19 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
|
24-6337-8817SOLDER NO-CLEAN 14AWG 63/37 1LB Kester Solder |
159 | - |
RFQ |
Ficha técnica |
Spool | 245 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.062 (1.57mm) | 361°F (183°C) | No-Clean | 14 AWG, 16 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
44-6337-0030SOLDER SN63PB37 ULD BAR 1 2/3 LB Kester Solder |
298 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Bar Solder | Sn63Pb37 (63/37) | - | 361°F (183°C) | - | - | - | Leaded | Bar, 1.66 lbs (750g) | 24 Months | Date of Manufacture |
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