Más categorías de productos

Conectores rectangulares - Espaciadores de placa, Apiladores (placa a placa)

Número de parte del fabricante	Disponibilidad	Precio	Cantidad	Ficha técnica	Packaging	Series	ProductStatus	NumberofPositions	Pitch	NumberofRows	RowSpacing	Length-OverallPin	Length-Post(Mating)	Length-StackHeight	Length-Tail	MountingType	Termination	ContactFinish-Post(Mating)	ContactFinishThickness-Post(Mating)
BSTCM-605-D-08-GT-260-TR-P-LF .050 x .100 Header Major League Electronics	1,500	-	RFQ	Ficha técnica	Bag	BSTCM-6	Active	10	0.050 (1.27mm)	2	0.100 (2.54mm)	0.435 (11.049mm)	0.175 (4.445mm)	0.260 (6.600mm)	-	Surface Mount	Solder	Gold	10.0µin (0.25µm)
BSTC-225-D-060-02-T-185-LF .079 Header Major League Electronics	500	-	RFQ	Ficha técnica	Bag	BSTC-2	Active	50	0.079 (2.00mm)	2	0.079 (2.00mm)	0.323 (8.200mm)	0.078 (1.981mm)	0.185 (4.700mm)	0.060 (1.524mm)	Through Hole	Solder	Tin	-
TBSTCM-520-D-125-10-FT-315-P-AP-LF .050 x .050 Header Major League Electronics	1,932	-	RFQ	Ficha técnica	Bag	TBSTCM-5-V	Active	40	0.050 (1.27mm)	2	0.050 (1.27mm)	0.382 (9.700mm)	0.125 (3.175mm)	0.315 (8.000mm)	-	Surface Mount	Solder	Gold	Flash
BSTS-112-D-A-16-H-353-LF .100 Header Major League Electronics	1,409	-	RFQ	Ficha técnica	Bag	BSTS-1	Active	24	0.100 (2.54mm)	2	0.100 (2.54mm)	0.630 (16.000mm)	0.167 (4.242mm)	0.353 (8.966mm)	0.110 (2.794mm)	Through Hole	Solder	Gold	30.0µin (0.76µm)
BSTCM-224-D-160-28-H-255-AP-LF .079 Header Major League Electronics	280	-	RFQ	Ficha técnica	Bag	BSTCM-2	Active	48	0.079 (2.00mm)	2	0.079 (2.00mm)	0.467 (11.862mm)	0.160 (4.064mm)	0.255 (6.477mm)	-	Surface Mount	Solder	Gold	30.0µin (0.76µm)
BSTC-240-T-098-12-GT-320-LF .079 Header Major League Electronics	784	-	RFQ	Ficha técnica	Bag	BSTC-2	Active	120	0.079 (2.00mm)	3	0.079 (2.00mm)	0.594 (15.088mm)	0.176 (4.470mm)	0.320 (8.128mm)	0.098 (2.489mm)	Through Hole	Solder	Gold	10.0µin (0.25µm)
BSTS-110-S-A-16-GT-353-LF .100 Header Major League Electronics	923	-	RFQ	Ficha técnica	Bag	BSTS-1	Active	10	0.100 (2.54mm)	1	-	0.630 (16.000mm)	0.167 (4.242mm)	0.353 (8.966mm)	0.110 (2.794mm)	Through Hole	Solder	Gold	10.0µin (0.25µm)
BSTCM-105-D-230-16-GT-285-LF .100 Header Major League Electronics	200	-	RFQ	Ficha técnica	Bag	BSTCM-1	Active	10	0.100 (2.54mm)	2	0.100 (2.54mm)	0.565 (14.351mm)	0.230 (5.842mm)	0.285 (7.239mm)	-	Surface Mount	Solder	Gold	10.0µin (0.25µm)
BSTC-106-D-110-24-GT-500-LF .100 Header Major League Electronics	425	-	RFQ	Ficha técnica	Bag	BSTC-1	Active	12	0.100 (2.54mm)	2	0.100 (2.54mm)	0.930 (23.622mm)	0.320 (8.128mm)	0.500 (12.700mm)	0.110 (2.794mm)	Through Hole	Solder	Gold	10.0µin (0.25µm)
BSTCM-706-D-180-11-F-125-TR-P-LF .039 Header Major League Electronics	139	-	RFQ	Ficha técnica	Bag	BSTCM-7	Active	12	0.039 (1.00mm)	2	0.039 (1.00mm)	0.310 (7.874mm)	0.180 (4.572mm)	0.125 (3.175mm)	-	Surface Mount	Solder	Gold	Flash
BSTCR-110-D-090-20-GT-210-LF .100 Header Major League Electronics	170	-	RFQ	Ficha técnica	Bag	BSTCR-1	Active	20	0.100 (2.54mm)	2	0.100 (2.54mm)	-	0.290 (7.366mm)	0.210 (5.334mm)	0.090 (2.286mm)	Through Hole, Right Angle	Solder	Gold	10.0µin (0.25µm)
BSTCM-116-D-230-20-GT-400-LF .100 Header Major League Electronics	3,919	-	RFQ	Ficha técnica	Bag	BSTCM-1	Active	32	0.100 (2.54mm)	2	0.100 (2.54mm)	0.665 (16.891mm)	0.230 (5.842mm)	0.400 (10.160mm)	-	Surface Mount	Solder	Gold	10.0µin (0.25µm)